Nanolithography Equipment For It, Electronics And Photonics - A Technology, Industry And Global Market Analysis : Market Research Report

Nanolithography Equipment For It, Electronics And Photonics - A Technology, Industry And Global Market Analysis

Published by: Innovative Research and Products (iRAP), Inc.

Published: Nov. 1, 2009 - 444 Pages

INTRODUCTION
EXECUTIVE SUMMARY: SUMMARY TABLE VALUE OF NONFABRICATION EQUIPMENT FOR SEMICONDUCTORS, THROUGH 2014; SUMMARY FIGURE VALUE OF NANOFABRICATION EQUIPMENT FOR SEMICONDUCTORS, 2009-2014
INDUSTRY OVERVIEW: TABLE 1 VALUE OF SEMICONDUCTOR NANOFABRICATION EQUIPMENT, THROUGH 2014 ($ BILLIONS); FIGURE 1 VALUE OF NANOFABRICATION EQUIPMENT COMPONENTS USED IN SEMICONDUCTORS AND ELECTRONICS, 2009-2014; FIGURE 2 MARKET SHARES OF NANOFABRICATION TECHNIQUES, 2008 ($ BILLIONS); TABLE 2 VALUE OF NANOFABRICATION INDUSTRY, 2008 AND 2007; FIGURE 3 NANOFABRICATION MARKET TIERS AND INDUSTRY SHARES, 2008; VALUE OF THE NANOFABRICATION INDUSTRY; TABLE 3 VALUE OF SEMICONDUCTOR EQUIPMENT AND MATERIALS, THROUGH 2014 ($ BILLIONS); FIGURE 4 MARKET SHARES OF TOP TWENTY NANOFABRICATION EQUIPMENT COMPANIES, 2008; TABLE 4 VALUE OF THE NANOFABRICATION INDUSTRY’S TOP 20 COMPANIES; TABLE 5 VALUE OF NANOFABRICATION INDUSTRY COMPANIES RANKED 21-40; TABLE 6 VALUE OF NANOFABRICATION INDUSTRY COMPANIES, RANKED 41-68; TABLE 7 VALUE NANOFABRICATION INDUSTRY COMPANIES; TABLE 8 MAJOR PUBLIC SEMICONDUCTOR EQUIPMENT COMPANIES, 2009; TABLE 9 VALUE OF SEMICONDUCTOR EQUIPMENT BY REGION, THROUGH 2014 ($ BILLIONS); FIGURE 5 2009 SEMICONDUCTOR EQUIPMENT MARKET BY REGION; TABLE 10 SEMICONDUCTOR MATERIALS MARKET BY REGION, THROUGH 2014 ($ BILLIONS); TABLE 11 VALUE OF SEMICONDUCTOR INDUSTRY SILICON WAFERS, THROUGH 2014; TABLE 12 MAJOR POLYSILICON PRODUCERS FOR THE SEMICONDUCTOR INDUSTRY; FIGURE 6 SEMICONDUCTOR MANUFACTURING FLOW CHART
NANO SEMICONDUCTOR MANUFACTURING METHODS: TABLE 13 GROWTH IN NANOFABRICATION METHODS, THROUGH 2014 ($ BILLIONS); FIGURE 7 GROWTH IN NANOFABRICATION METHODS, 2009-2014 ($ BILLIONS); TABLE 14 FOUNDRY COSTS FOR NANOFABRICATION OF 90-65NM, 45-32NM AND 22-12NM NODES; TABLE 15 VALUE OF NANOLITHOGRAPHY PRODUCTS & METHODS, 2009-2014; TABLE 16 NANOLITHOGRAPHY APPLICATIONS; TABLE 17 LITHOGRAPHIC PROCESS STEPS; TABLE 18 LITHOGRAPHY TECHNOLOGY REQUIREMENTS - NEAR-TERM; TABLE 19 LITHOGRAPHY METHODS AND APPLICABLE NANOMETER NODES; TABLE 20 BASIC PHOTOLITHOGRAPHY PROCESS STEPS; TABLE 21 STEPPER MANUFACTURERS; TABLE 22 STEPS FOR SINGLE METAL VERSION OF 35NM BASELINE RUN; TABLE 23 LITHOGRAPHY STEPS AND RELATED INFORMATION; TABLE 24 DOUBLE PATTERNING TECHNIQUES; FIGURE 8 EVALUATION OF A LIGHT SOURCE AT PHILIPS EXTREME UV; TABLE 25 SELECTED EUVL INNOVATIONS BY COMPANY; FIGURE 9 ZONE-PLATE-ARRAY LITHOGRAPHY (ZPAL); TABLE 26 MASKLESS LITHOGRAPHY MANUFACTURERS; FIGURE 10 NANOINK’S NLP 2000 NANO LITHOGRAPHY PLATFORM; FIGURE 11 SEQUENCE FOR CREATING A RESIST MASK BY STEP-AND-STAMP NIL.; TABLE 27 NANO-IMPRINT LITHOGRAPHY COMPANIES; TABLE 28 NANO-IMPRINT APPLICATIONS; FIGURE 12 NIL TECHNOLOGY QUARTZ AND SILICON STANDARD STAMPS WITH LINEWIDTHS DOWN TO 50NM
MASK MAKING: TABLE 29 COMMON MASK TYPES; TABLE 30 LIST OF THE LITHOGRAPHY STEPS AND THE ASSIGNED MASKS UP TO THE FIRST METAL LAYER; TABLE 31 LITHOGRAPHY MASK INDUSTRY ORGANIZATIONS; FIGURE 13 MAKING A MASK FOR NANOLITHOGRAPHY STEPS 1-6; TABLE 32 LITHOGRAPHY CHALLENGES; TABLE 33 VALUE BEAM PRODUCTS & METHODS, THROUGH 2014 ($ MILLIONS); TABLE 34 LIGHT SOURCE MARKET SHARES, 2009 COMPARED TO 2014; FIGURE 14 LIGHT SOURCE MARKET SHARES, 2009 COMPARED TO 2014; TABLE 35 WAVELENGTHS OF EXCIMER LASERS; TABLE 36 UV AND EUV BEAM MANUFACTURERS AND SALES VALUE, 2008 ($ BILLIONS)
NANOLITHOGRAPHY SEMICONDUCTOR AND ELECTRONICS MARKET APPLICATIONS: TABLE 37 REVENUE FOR PRODUCTS MANUFACTURED BY LITHOGRAPHIC PROCESSES, THROUGH 2014 ($ BILLIONS); FIGURE 15 MARKET APPLICATIONS FOR NANOLITHOGRAPHY, 2008; TABLE 38 TOP 10 MARKET APPLICATIONS FOR LITHOGRAPHIC TECHNIQUES, 2008; FIGURE 16 VALUE OF PRODUCTS MANUFACTURED BY LITHOGRAPHIC TECHNIQUES, 2008; TABLE 39 SEMICONDUCTOR MARKET VALUE 2008; FIGURE 17 2008 REVENUE FOR SEMICONDUCTORS CREATED BY LITHOGRAPHIC TECHNIQUES; FIGURE 18 LITHOGRAPHIC SEMICONDUCTOR MARKET APPLICATIONS 2009; TABLE 40 MAJOR APPLICATIONS OF SEMICONDUCTORS; FIGURE 19 SEMICONDUCTOR SALES BY REGION, JANUARY 2009; TABLE 41 THREE-MONTH AVERAGE SEMICONDUCTOR SALES FOR JANUARY BY YEAR ($); TABLE 42 DRAM MANUFACTURER MARKET SHARES, 2008; TABLE 43 MAJOR FLASH MEMORY MANUFACTURERS; TABLE 44 MAJOR ASIC SUPPLIERS; TABLE 45 MICROPROCESSOR CONTROLLER COMPANIES; TABLE 46 MAJOR CENTRAL PROCESSING UNIT (CPU) MANUFACTURERS, 2009; TABLE 47 VALUE OF THE HARD DISK MARKET, 2009-2014 ($ BILLIONS); TABLE 48 LEADING HARD DRIVE MANUFACTURERS; TABLE 49 SOLID STATE STORAGE COMPANIES; TABLE 50 LEADING SSD COMPANIES 2009; TABLE 51 RADIO FREQUENCY APPLICATIONS AND LITHOGRAPHIC MANUFACTURING TECHNIQUES; TABLE 52 VALUE OF RADIO FREQUENCY SEMICONDUCTORS, THROUGH 2014 ($ BILLIONS); TABLE 53 RADIO FREQUENCY (WIRELESS) APPLICATIONS AND LITHOGRAPHY; TABLE 54 LEADING WIRELESS TECHNOLOGY COMPANIES AND; TABLE 55 PRINTED CIRUCIT BOARD MARKET VALUE, THROUGH 2014 ($ BILLIONS); TABLE 56 PRINTED CIRCUIT BOARD MANUFACTURERS; TABLE 57 2009 CAPITAL EXPENDITURES BY MAJOR SEMICONDUCTOR MANUFACTURER; TABLE 58 OTHER SEMICONDUCTOR MANUFACTURERS EMPLOYING LITHOGRAPHIC TECHNOLOGY; TABLE 59 RECENT START-UP COMPANIES; TABLE 60 NANOTECHNOLOGY ENABLED COMMON IT CONSUMER PRODUCTS
PHOTONICS, OPTO-ELECTRONICS, OPTICS AND LITHOGRAPHY: TABLE 61 VALUE OF PHOTONICS, PHOTONIC MANUFACTURING EQUIPMENT AND PHOTONIC MATERIALS, 2009-1014; FIGURE 20 APPLICATIONS FOR LITHOGRAPHIC MANUFACTURING METHODS IN THE PHOTONICS INDUSTRY; TABLE 62 VALUE OF LITHOGRAPHICALLY PRODUCED PHONTONIC AND MEMS PRODUCTS AND COMPONENTS, THROUGH 2014 ($ BILLIONS); FIGURE 21 PHOTONIC COMPONENTS VALUES, 2009-2014 CAGR; TABLE 63 2009 VALUE OF PHOTONIC AND OPTOELECTRONIC APPLICATIONS; TABLE 64 VALUE OF OPTO-ELECTRONIC AND PHOTONIC COMPONENTS, THROUGH 2014 ($ BILLIONS); TABLE 65 OPTO-ELECTRONIC COMPONENTS MANUFACTURED; BY LITHOGRAPHIC METHODS; TABLE 66 COMPANIES, PHOTONIC DEVICES AND LITHOGRAPHIC METHODS; TABLE 67 COMPANIES AND ORGANIZATIONS INVOLVED IN DEVELOPING PHOTONICS; FIGURE 22 INTEL HYBRID SILICON LASER; TABLE 68 PHOTONIC MATERIALS AND LITHOGRAPHIC METHODS; FIGURE 23 OPTICAL EQUIPMENT FOR THE TELECOM MARKET, 2009-2014; TABLE 69 VALUE OF OPTO-ELECTRONIC AND PHOTONIC COMPONENTS FOR THE TELECOM MARKET 2009-2014 CAGR% ($ BILLIONS); TABLE 70 TELECOM NETWORK AND COMPONENT MANUFACTURERS; TABLE 71 VALUE OF DISPLAY TECHNOLOGIES MANUFACTURED BY LITHOGRAPHIC METHODS, THROUGH 2014 ($ BILLIONS); FIGURE 24 VALUE OF DISPLAY TECHNOLOGY, 2009-2014; TABLE 72 PLASMA PANEL COMPANY MARKET SHARE, 2008; TABLE 73 PLASMA DISPLAY MANUFACTURERS AND LITHOGRAPHIC TECHNIQUES; TABLE 74 TOP LCD MANUFACTURERS, 2009; TABLE 75 LCD MANUFACTURERS AND LITHOGRAPHY; TABLE 76 VALUE OF LED MARKET, THROUGH 2014 ($ BILLIONS); TABLE 77 VALUE OF LED APPLICATIONS, THROUGH 2014 ($ MILLIONS); TABLE 78 COMPANIES, LIGHT-EMITTING DEVICES AND LITHOGRAPHY; TABLE 79 LED MANUFACTURERS; TABLE 80 VALUE OF THE GLOBAL ILLUMINATION MARKET, 2009; TABLE 81 REGIONAL MARKETS FOR ILLUMINATION, 2009; TABLE 82 VALUE OF THE SOLAR POWER MARKET, 2009-2014; TABLE 83 TOP NATIONAL PV INSTALLATIONS BY MEGAWATT, 2008; TABLE 84 LEADING SOLAR POWER PANEL MANUFACTURERS; TABLE 85 SOLAR POWER AND LITHOGRAPHY; TABLE 86 SENSOR APPLICATION MARKETS 2009; TABLE 87 SENSOR VALUE BY APPLICATION, THROUGH 2014 ($ BILLIONS); TABLE 88 COMPANIES, SENSOR PRODUCTS AND LITHOGRAPHY; TABLE 89 VALUE OF MEMS EQUIPMENT AND MATERIALS MARKET, THROUGH 2014 ($ MILLIONS); TABLE 90 MEMS MANUFACTURING EQUIPMENT & MATERIALS, THROUGH 2014 ($ MILLIONS); TABLE 91 MARKET SHARES OF EQUIPMENT FOR MEMS FABRICATION, 2009 ($ MILLIONS); FIGURE 25 MARKET SHARES OF EQUIPMENT FOR MEMS FABRICATION; TABLE 92 VALUE OF MEMS MATERIALS MARKET, THROUGH 2014 ($ MILLIONS); TABLE 93 VALUE OF MEMS MATERIALS MARKET, 2009; FIGURE 26 MARKET SHARES OF MATERIALS FOR MEMS FABRICATION; TABLE 94 MEMS APPLICATIONS AND MARKETS, 2009; FIGURE 27 2009 MEMS APPLICATIONS; TABLE 95 VALUE OF MEMS DEVICES AND MEMS-BASED SYSTEMS AND PRODUCTS, THROUGH 2014 ($ BILLIONS); TABLE 96 MEMS MANUFACTURING AND LITHOGRAPHY; TABLE 97 MAJOR MEMS MANUFACTURERS, 2009; TABLE 98 OTHER PHOTONIC APPLICATIONS USING LITHOGRAPHIC APPARATUS, THROUGH 2014 ($ BILLIONS); TABLE 99 COMPANIES, MEDICAL PHOTONIC APPLICATIONS AND LITHOGRAPHIC METHODS; TABLE 100 EXAMPLES OF OPTICAL PRODUCTS FOR SEMICONDUCTORS/LCD LITHOGRAPHY EQUIPMENT
PATENT ANALYSIS: TABLE 101 PATENT APPLICATIONS APRIL 19, 2001-FEBRUARY 5, 2009; TABLE 102 U.S. PATENTS BY NATION; TABLE 103 U.S. NANO PATENTS BY YEAR, 2000-2008; FIGURE 28 U.S. NANO-PATENTS BY YEAR 2000-2008; TABLE 104 U.S. NANO PATENTS BY YEAR, 1999 & PRIOR THROUGH 2008; TABLE 105 U.S. NANO PATENTS BY INVENTORS AND THEIR STATES THROUGH FEBRUARY 5, 2009; TABLE 106 U.S. NANO PATENTS BY ASSIGNEES AND THEIR STATES THROUGH FEBRUARY 5, 2009; TABLE 107 LITHOGRAPHY PATENTS AND APPLICATIONS BY ORGANIZATION; TABLE 108 50 RECENT LITHOGRAPHY PATENTS, FEB.24, 2009-NOV 11, 2008; TABLE 109 50 RECENT LITHOGRAPHIC PATENTS, FEB. 24, 2009 -DEC.9, 2008; TABLE 110 50 RECENT LITHOGRAPHY PATENT APPLICATIONS, FEB. 19, 2009-DEC. 18, 2008; TABLE 111 LITHOGRAPHIC PATENT APPLICATIONS, FEB. 19, 2009-DEC. 18, 2008
NANOLITHOGRAPHY PROFILES: TABLE 112 CURRENT ASML LITHOGRAPHY PRODUCT PORTFOLIO OF STEPPERS AND STEP & SCAN SYSTEMS; FIGURE 29 ENERGETIQ EQ-10HR; FIGURE 30 FUJITSU 2008 REVENUES BY SEGMENT; FIGURE 31 GIGAPHOTON MARKET SALES; FIGURE 32 MOLECULAR IMPRINTS NIL APPARATUS; FIGURE 33 WORLD’S FIRST PRINTED LAB-ON-A-CHIP SENSOR BY NANOIDENT; FIGURE 34 BSA PROTEIN NANOPRINTING; TABLE 113 NAPA CONSORTIUM MEMBERS, 2009; FIGURE 35 NIKON STEPPERS AND SCANNERS; FIGURE 36 REPLISAURUS ELECTROCHEMICAL PATTERN REPLICATION; TABLE 114 MAJOR INDEPENDENT FOUNDRIES/LITHOGRAPHY CUSTOMERS; TABLE 115 JAPANESE NANOFABRICATION COMPANIES FOR THE SEMICONDUCTOR INDUSTRY
COMPANIES AND INSTITUTIONS WITH NANOLITHOGRAPHY RESEARCH PROJECTS: TABLE 116 OTHER NANOLITHOGRAPHY RESEARCH PROJECTS

Abstract

Nanoscale lithographic apparatus are indispensible tools used to manufacture integrated circuits (ICs), flat panel displays, optoelectronic and photonic devices as well as micro-electromechanical systems (MEMS), all involving nanoscale structures. The advancement in photolithography technology has been the key to the rapid development of the semiconductor industry. Countless innovations and progress in this field will continue to drive technological development in the semiconductor industry.

Semiconductor chip manufacturers use many different types of equipment in the making of integrated circuits. There are 300 to 500 process steps, utilizing over 50 different types of process tools, required in the making of a single device like a microprocessor. Semiconductor chip manufacturers seek efficiency improvements through increased throughput, equipment utilization and higher manufacturing yields. Capacity is added by increasing the amount of manufacturing equipment in existing fabrication facilities and by constructing new fabrication facilities. Historically, every seven or eight years, the semiconductor industry adopts a larger silicon wafer size to achieve lower manufacturing costs; the ability to produce more chips on a larger wafer reduces the overall manufacturing cost per chip. For example, the use of 200mm wafers in production began at the end of the 1980s. The migration from 200mm to 300mm began at the end of the 1990s. Today, most wafer fabrication facilities use wafers with a diameter of 300mm, and there are plans to move to 450mm wafer diameters.

As wafers became larger, the integrated circuits on the wafers became increasingly smaller and more densely integrated, moving from below the sub-micron range (1000nm, or 1 micron, to 100nm, or 0.1 micron) to the nanometer range, which was considered to be 100nm or less in 2002, when computer and memory chip manufacturers moved from working in the 120nm range to 65 nm. Nanofabrication equipment is now used to create integrated circuits in the 65nm to 45nm range, and in 2009, companies such as Intel and Sandisk have started to move to manufacturing computer chips and memory chips in the 32nm range. Intel has announced that it will spend $7 billion dollars over the next two years for equipment to manufacture computer chips in the 32nm range in the U.S. The cost of setting up a factory, known as a foundry, for producing microprocessors and data storage is between $1 billion and $3 billion depending on the desired capacity of the foundry.

The continuing worldwide economic slowdown has driven sharp reductions in semiconductor manufacturers’ capital budgets, and nanofabrication equipment manufacturers are experiencing a greater-than-expected decline in orders and revenue as a result.

Nevertheless, the introduction of non-optical lithography will be a major paradigm shift, required in order to meet the technical specifications and complexities that are necessary for continued adherence to Moore’s Law at 32nm half-pitch and beyond. This shift will drive major changes throughout the lithography infrastructure and will require significant resources for commercialization. These development costs must necessarily be recovered in the costs of exposure tools, masks and materials.

STUDY GOAL AND OBJECTIVES

Photolithography has been a key patterning step in most integrated circuit fabrication processes. Resist, a photosensitive plastic, is spun on a workpiece, baked, and exposed in a pattern through a reticle, usually by ultraviolet (UV) light. After development and a second bake, the surface is left partially covered by an inert organic film that resists various treatments to which the workpiece is subjected. Such treatments include material removal by wet chemical etch or by gaseous plasma etch, doping by ion implantation (e.g., broad beam implantation), and addition of material (e.g., lift-off). The preparation, exposure, development, cleaning, caring, and stripping of resist can increase the number of fabrication steps tenfold, requiring expensive equipment and facilities to establish stable, qualified, and high yield fabrication.

Photolithography has been the main lithographic tool for processing patterns of resist down to 45nm. However, present and future microelectronics will require minimum feature sizes below 45nm. While advances in a number of lithography techniques (e.g., ultraviolet (UV), enhanced ultraviolet (EUV) emersion, maskless emersion, laser, phase-shift, projection ion, and electron beam lithography (EBL)) may enable high-scale production at these dimensions, they are all nearing their theoretical limits with respect to wavelength, overlay accuracy, and/or cost. Pushed to the limit, the weaknesses of each process present difficult problems, and the resulting patterning defects can result in significant yield loss. The study examines the state of the art and emerging technologies.

This study focuses on nanofabrication equipment for information technology (IT) and electronic devices. The study provides market data about the size and growth of nanofabrication application segments, industry trends, new developments including a detailed patent analysis, and company profiles. Another goal of this report is to provide a detailed and comprehensive multi-client study of the market for nanofabrication equipment in North America, Europe, Japan, China, India, Korea and the world for IT and electronic devices and potential growth opportunities in the future.

The objectives include a thorough coverage of the underlying economic issues driving nanofabrication for IT and electronic devices, as well as assessments of improved nanofabrication materials and techniques that are being developed. Another important objective is to provide realistic market data and forecasts for nanofabrication equipment nanotechnology. This study provides the most thorough and up-to-date assessment that can be found anywhere on this subject. The study also provides extensive quantification of the many important facets of market developments in nanofabrication systems and hydrogen energy use all over the world. This, in turn, contributes to the determination of the kind of strategic responses companies may adopt in order to compete in this dynamic market.

The goal of the study was to determine the current and future financial and technological state of the nanofabrication equipment industry for the IT and electronics businesses, as well as the influence of related nanotechnologies. One of the objectives was to determine how many organizations in each nation were involved in different types of nanofabrication equipment. The study provides a review of the activities of the top organizations developing nanofabrication equipment and techniques for IT and electronics.

REASONS FOR DOING THE STUDY

Nanofabrication equipment is the enabling technology for IT and electronic devices now being sold and this will continue to be so. There is no other technology on the horizon that can compete with nanofabrication equipment in the ability to create the most powerful microprocessors and memory chips for computers, electronic devices and other applications. The industry is considered critical to continued economic development in the U.S. as well as Japan, China, Korea and the member states of the European Union.

CONTRIBUTIONS OF THE STUDY

The study gathers into one place current information related to the technology of nanolithography and the application markets where this technology is used to manufacture products, amounting to over $850 billion dollars.

As nanolithographic methods are key to increasing the speed and capacity of computers and communication lines, as well as a host of other products in every field of human endeavor, more than 200 recent patents and patent applications were examined to insure that the study contains the latest technological information.

The study will benefit existing manufacturers of lithography and nanofabrication equipment that seek to expand revenues and market opportunities by expanding and diversifying the use of their equipment in manufacturing semiconductor, photonic, optoelectronic and MEMS devices.

SCOPE AND FORMAT

The study examines the companies that provide equipment to semiconductor and electronics manufacturers to enable them to produce not only microprocessors and memory chips, but also display technologies such as plasma screen TVs and computer screens as well as the screens on cellular telephones. Microprocessors and memory chips with nanoscale architecture are found in computers, cellular telephones, MP3 plays, DVD players, plasma TVs, cars and airplanes of all sizes and makes - in fact, in virtually any device that contains a microprocessor or computer chip manufactured after 2006. The “Digital Age” is very much the “Age of Nanofabrication.” At 1976 transistor prices, an IPod® would cost 3.2 billion dollars, according to Applied Material calculations. That fact highlights the importance of lithography at the nanoscale, as it it the technology that makes printing millions of transistors in a space measured in less than a few square inches possible and affordable.

This study focuses on nanofabrication techniques and apparatus, their state of development, their costs, and the markets for nanofabrication equipment. The broad categories of nanofabrication machinery and techniques covered include: deposition processes, lithography techniques, beam technologies, etch & clean processes, assembly and test equipment and services, metrology on the nanoscale and other wafer processes. Many of the nanofabrication processes used in semiconductor manufacturing are beginning to be adopted by the solar power manufacturers, who use silicon to form the solar power collector panels. The solar power industry represents a growing market for manufacturers of nanofabrication apparatus.

The materials, manufacturing methods and machinery used in producing nanomaterials for IT and electronic applications are examined.

TO WHOM THE STUDY CATERS

Process engineers working in EUV lithography process development, photomask engineers working on EUV masks, and lithography equipment engineers working on the development and evaluation of exposure tools may find this report of interest.

REPORT SUMMARY

Nanofabrication equipment has been used to create integrated circuits in the 65nm to 45nm range, and companies are now moving to manufacturing computer chips and memory chips in the 32nm range.

In 2008, nanofabrication apparatus enabled semiconductor manufacturers to transform more than $11.4 billion worth of silicon wafer material into more than $425 billion worth of semiconductor, photonic, opto-electonic and MEMS material devices for use in computers and electronic devices, which in turn constituted a global market valued in excess of $1.38 trillion dollars, plus related services valued at $5 trillion dollars globally.

Semiconductor and electronics manufacturers spent roughly $80 billion in 2007 and $74 billion in 2008 for silicon wafers, materials and equipment which allowed them to manufacture integrated circuits at scales to 45nm, and they are now beginning to buy equipment to manufacture integrated circuits at the scales of 32nm and 22nm.

The overall market for wafers and nanofabrication equipment is expected to grow at nearly 10% a year for the next five years and grow from an estimated $65.8 billion in 2009 to $105.6 billion in 2014.

Companies involved in nanofabrication materials, apparatus, metrology and testing for the IT and electronics industry had sales in excess of $80.013 billion in 2007 and more than $73.558 billion in 2008, reflecting the worldwide economic downturn.

Research and development (R&D) spending for improved nanofabrication techniques and equipment exceeds $7 billion a year at the corporate level. Research and development of manufacturing equipment for 45nm technology for semiconductors, which began in 2003, is now the manufacturing standard, and the new standard under development is 32nm architecture, beginning to be implemented in 2009. Each reduction in size results in more powerful microprocessors, memory chips and silicon-based solar power collectors, in which creates new demands. Lithography, including masks and resist, and associated metrology currently comprises 30% to 40% of the entire cost of semiconductor manufacturing. This fraction depends strongly on the product mix, volume of integrated circuits in demand per design, and age of equipment in the factory.

The iRAP study identified over 200 companies and institutions involved in as manufacturers and developers as well as researchers. These companies are driving the technology to the next generation of nanofabrication in the semiconductor industry.

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2/15/2012 - 30

Nanolithography Equipment For It, Electronics And Photonics - A Technology, Industry And Global Market Analysis

Table of Contents

Abstract