Short-reach Radio and Near Field Communications

Published by: Practel, Inc.

Published: Oct. 1, 2009

Table of Contents

1.0 Introduction

1.1 General

1.2 NFC Specifics

1.3 Short-reach Radio Specifics

1.4 Report Structure

1.5 Methodology

1.6 Intended Audience 3

2.0 UWB: Technology and Market Specifics

2.1 History

2.1.1 Obstacles

2.2 Definition

2.2.1 Rates

2.3 Spectrum Allocation

2.3.1 Choices

2.4 Major Features

2.4.1 Communications Features

2.5 Standards and Regulations

2.5.1 Multiband OFDM

2.5.2 DS-UWB

2.5.3 Comparison

2.5.4 IEEE

2.5.5 FCC and ETSI

2.5.6 ECMA International

2.5.7 European Regulators

2.5.7.1 EUWB

2.5.8 Worldwide

2.5.9 Comparison

2.5.9.1 Impulse Radio- Pulse Link, Time Domain

2.5.9.2 DS-CDMA - Motorola and other

2.5.9.3 Multi-Band OFDM (FH) - MBOA

2.6 Applications

2.6.1 General

2.7 Issues

2.8 Applications Summary

2.9 UWB Market

2.9.1 General

2.9.1.1 Major Segments

2.9.2 Forecast

2.9.2.1 Conditions

2.9.2.2 Drivers

2.9.2.3 Analysis

2.9.3 Comments

2.10 Industry: UWB

Alereon (chipsets)

Artimi (merged with Staccato -November 2008)

BBN (UWB radio, first responders)

Belkin (USB)

Camero (radar, equipment for first responders)

Fujitsu Components (antenna, filter)

General Atomics (chipsets)

GeFen (HDMI Extender)

Intel (ICs)

Parco (RFID-Health Care)

Pulse~ Link (chipsets)

Sigma Designs

Staccato (chipsets)

Time Domain (chipsets-fusion of communications & radar)

Toshiba (Wireless USB)

Ubisense (RFID-tracking)

Wisair (chipsets)

Zebra (Real Time Locating Systems)

3.0 ZigBee

3.1 General

3.2 Details

3.2.1 Major Features

3.2.2 Device Types

3.3 Protocol Stack

3.3.1 Physical and MAC layers - IEEE802.15.4

3.3.2 Frame

3.3.3 Upper Layers

3.4 Interoperability

3.5 Security

3.6 Platform Considerations

3.7 Battery Life

3.8 ZigBee Technology Benefits and Limitations

3.9 Standardization Process

3.9.1 ZigBee Alliance

3.9.1.1 Objectives

3.9.2 Example: Smart Energy Profile-ICT for Smart Grid

3.10 ZigBee IP

3.11 IEEE 802.15.4 - ZigBee Basis

3.12 Application Specifics - Profiles

3.13 Applications

3.13.1 General

3.13.2 Home

3.13.3 PC

3.13.4 Manufacturing

3.13.5 WSN-UGS and ZigBee

3.14 “Green” ZigBee

3.15 Market

3.15.1 Expectations

3.15.2 Segments

3.15.3 Forecast

3.16 Industry

Airbee (Software)

Amber (RF Modules)

Arch Rock (IP)

Atmel (Chipsets)

Atmel and TazTag (NFC+ZigBee)

CEL (Modules; NFC+ZigBee)

Chipcon -TI (Chipsets)

Cirronet-RFM (Modules-Industrial Applications)

Crossbow (WSN, Environment Monitoring, motes)

Digi (Radios, Routers, Energy Management)

Duolog (Transceivers)

Ember (Chipsets, HAN applications)

EnergyHub (Smart Home)

GreenPeak (WSN)

Helicomm (Modules)

Jennic (Chipsets-Modules)

Freescale (Chipsets)

Nuri Telecom (AMR Application)

Oki (Chipsets)

Open Peak (Power Management)

Renesas (Platforms, AMR)

Silicon Laboratories (Chipsets, Modules)

Synapse (Module, Protocols)

Telegesis (Integrator, Modules)

TI (Chipsets)

4.0 IEEE 802.15.1 (Bluetooth)

4.1 Protocol Stack

4.1.2 Transport layer

4.1.2.1 Radio Layer

4.1.2.2 Baseband and Link Layers

4.1.3 Middleware Layer

4.2 Bluetooth Security

4.3 Highlights

4.3.1 Resent Advances

4.4 Market

5.0 802.11n Technology

5.1 Advanced Technologies and IEEE 802.11n: MIMO and Others

5.1.1 General

5.1.2 MIMO

5.1.2.1 “True MIMO”

5.1.2.2 BeamFlex

5.1.2.3 Atheros

5.1.3 Spatial Multiplexing

5.1.4 OFDM

5.1.5 Channel Bonding

5.1.6 Packet Aggregation

5.2 Features

5.2.1 Specifics

5.2.2 Channel Bandwidth

5.3 Adaptation

5.4 Benefits and Applications

5.4.1 Benefits

5.4.2 Applications

5.5 Market

5.5.1 General: Drivers

5.5.2 Market Forecast

5.5.2.1 Model Assumptions

5.5.2.2 Forecast

5.5.2.2.1 Chipsets

5.5.2.2.2 Equipment

5.6 Industry

Aerohive (AP)

Aruba (AP)

Asus (Router)

Atheros (Chipsets; combo BT-802.1n)

Buffalo (Router, AP)

Belkin (Router, Adaptors)

Broadcom (Chipsets; combo)

Cisco (AP)

Colubris-HP ProCurve (AP)

CSR (Chips)

D-Link (Router)

Encore (Adapter)

Edimax (Router, Adapter)

Extreme (AP)

Extricom (AP)

Gemtek (Router)

Intel (Chipsets)

Linksys (Routers)

Marvell (Chipsets)

Meru (Family of Products)

Metalink (Chipsets)

Motorola (Tools, AP)

NEC (Router)

Netgear (Router, AP)

RedPine (Chipsets)

Ruckus (AP)

Ralink (Chipsets)

Product Line Brief

Siemens (AP)

SiGe (Chipsets)

TopCom (Router)

Trapeze (Controller)

TrendNet (Routers, AP)

ZyXel (AP, Router, Adapter)

6.0 Near Field Communications

6.1 General

6.2 Characteristics

6.3 Standards

6.3.1 General

6.3.2 ECMA (Near Field Communication Interface and Protocol (NFCIP-1)

6.3.3 ISO

6.3.4 NFC Forum

6.3.4.1 General

6.3.4.2 Specifications

6.3.4.3 Summary

6.3.5 Single Wire Protocol

6.3.6 NFC and ETSI

6.4 Security

6.5 Comparison

6.5.1 Bluetooth

6.5.2 RFID

6.6 Applications

6.6.1 General

6.6.2 Primary Users

6.6.3 Mobile Phone - Major Application

6.6.3.1 Example

6.6.3.2 Danger

6.6.4 WPAN Applications

6.6.5 Payment and Ticketing

6.6.6 Smart Poster

6.6.7 NFC and WiFi

6.6.8 NFC and UWB

6.6.9 Trials

6.7 NFC Market

6.7.1 General

6.7.2 Market Drivers

6.7.3 Estimate

6.8 Vendors

Alvin

Arygon

Infineon

Innovision

Inside Contactless

Legic

Mocapay

Motorola

NEC

Nokia

Nexperts

NXP

OTI

Reslink

Sagem Orga

Sony

STmicroelectronics

StolPan

Toppan Forms

Twinlinx

UPM Raflatac

Venyon

VivoTech

Wireless Dynamics

Zenius

7.0 Conclusions

Figure 1: UWB Spectrum

Figure 2: OFDM Frequency Segments

Figure 3: DS-UWB Spectrum Characteristics

Figure 4: Spectrum Regulations-UWB

Figure 5: Spectrum Illustration

Figure 6: Europe

Figure 7: Japan and Korea

Figure 8: Canada

Figure 9: Market Estimate: UWB Circuitry ($B)

Figure 10: Market Estimate: UWB IC Shipments (Unit M)

Figure 11: Estimate of UWB Market - Communications Applications ($B)

Figure 12: UWB IC-WSN-UGS Market Segment ($M)

Figure 13: ZigBee Protocol Stack

Figure 14: Profiles

Figure 15: Estimate: ZigBee Modules Market Worldwide ($M)

Figure 16: Estimate: ZigBee Modules Market Worldwide (M Units)

Figure 17: ZigBee Market Segmentation (2009)

Figure 18: ZigBee Market Segmentation (2013)

Figure 19: Bluetooth Protocol Stack

Figure 20: Piconets Illustration

Figure 21: Global Bluetooth Revenue Market Forecast ($B)

Figure 22: Two-antenna MIMO system with two-stream SDM example

Figure 23: 802.11 Protocol Family MAC Frame Structure

Figure 24: Addressable Market: Worldwide WiFi Chipsets Shipping (Unit M)

Figure 25: Addressable Market: 802.11n Chipsets Worldwide Shipping (Unit M)

Figure 26: Addressable Market: WiFi Chipsets Worldwide Shipping ($B)

Figure 27: Addressable Market: 802.11n Chipsets Worldwide Shipping ($B)

Figure 28: Market Geography: 802.11 Chipsets Production

Figure 29: Addressable Market Estimate: 802.11n Equipment Shipping ($B)

Figure 30: Addressable Market: 802.11n Equipment Sales (Unit M)

Figure 31: Standardization

Figure 32: NFC ECMA and ISO Standards

Figure 33: ISO Protocols

Figure 34: NFC Forum Activities

Figure 35: Mobile Phone with NFC

Figure 36: Cell Phones Addressable Market (Millions Units)

Figure 37: Cell Phones and Accessories-Addressable market ($B)

Figure 38: NFC-able Cell Phones: Addressable Market (Units Million)

Figure 39: NFC-able Cell Phones: Addressable Market ($M)

Figure 40: NFC-able Cell Phone Rate of Penetration

Figure 41: NFC Electronics Market Estimate ($M)

Figure 42: Market Estimate: UWB-NFC Electronics Sales ($M).

Figure 43: NFC Market Geography

Table 1: Comparison: DS-UWB and MB-OFDM

Table 2: FCC Emission Limits

Table 3: Comparison

Table 4: UWB Applications: Summary

Table 5: UWB Market Segments

Table 6: ZigBee Parameters

Table 7: ZigBee Smart Energy Profile Feature Set

Table 8: BT Advanced Characteristics

Table 9: Comparison of Different 802.11 Members Transfer Rates

Table 10: 802.11n Advantages

Table 11: NFC Features

Table 12: NFC History

Table 13: NFC Development

Table 14: Bluetooth and NFC

Table 15: NFC-based Payment Systems -Trials

Abstract

• Bluetooth (BT)
• ZigBee
• UWB
• IEEE802.11n
• Near Field Communications.

• Progress in the development of multi-protocols SoCs with integration on single IC elements that support several technologies
• As a result, multi-modal communications using, for example, a single handset become visible (for example, when a user environment is changed from WPAN to WLAN).
• NFC is finding various applications where it has a significant role as an independent technology; or it is used for initiation of communications channels in other technologies environments (physical browsing is a new intuitive human-computer interfacing paradigm for mobile users. Services, such as information retrieval and distribution, peer- to- peer communication, payment or ticketing, and professional applications can be initiated by simply touching an object with a user’s personal device (or even bringing two devices close to each other without touching)
• It is expected that one of the most important NFC application will be an integration of NFC technology into cell phones to transfer them into devices that may eventually replace credit cards. The concept of a “wireless wallet” is discussed in details, as well as a concept of m-payments with its advantages and issues.

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