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The A to Z of Printed and Disposable ElectronicsPublished by: IDTechEx Ltd Published: Apr. 1, 2005 Table of ContentsPlease Note: Due to the brevity and/or nature of the content posted, there is no table of contents available for this report. AbstractUnderstand this exciting technology: From organic to printed inorganic semiconductors, materials, manufacture techniques (printed and non printed), power, sensors, conductors and much more - this handbook explains the technologies and terms you need to know Terms Covered In total, over 380 terms are explained, including: Addressability Ad hoc networks Algorithm Amorphous Anilox rollers Antenna Application standards Authentication BPI BPM BSI Banknotes Batteries, printed Battery testers Bi-directional Biometrics Bit Byte CEN CENELEC CEPT CMOS CPG Capacitive coupling Capacity Capture field Capture window Chip Card Chip famines Chip tag Chipless tag Chipless first generation Chipless second generation Cipher Ciphertext Client Code Conductors Conjugated polymers Computer Network Conditional Conformance standards Consumer goods Contacted Chip Card Contactless Chip Card Cryptography Crystalline DB DES DOD DPM DRAM DUST Data elements Data Standards Decryption Dedicated Network Demographic timebomb Digital Dip pen nano-lithography Disposable flexible circuits Drive circuits Dumb EAN EAS ECMA ECP ECR EDI EEPROM EID EID EL EPC or ePC EPC and RFID EPROM EMID ETSI Electric Field Coupling Electro-chemical displays Electro-chromic displays Electroluminescence Electro-magnetic coupling Electro-magnetic EAS Electro-magnetic RFID Electro-phoretic display Electrostatic coupling Encryption EPCglobal Error rate FET FMCG Factory programming Ferroelectric memory Field Effect Transistor Flash memory Flat panel antenna Flexography Foodtrace Frequency GAV GB GCI GHz GIS GPRS GPS GS1 GSM Gravure Gyricon HF H Field Hierarchy of networks Hibiki Hydrophilic Hydrophobic IATA IC IC Cards ID IEC IEE IEEE IP ISO IT ITU IWG In use programming Indium tin oxide Inductive Coupling Infineon Information Mediary Ink jet Insult Rate Intelligent packaging Inter-operability Internet of Things Interrogator Iontophoresis Item level RFID JEIDA JEITA JTAV Kb KB Key Key Management Key-Distribution Centre LAN LC LC Array LCD LED LITI Laminar electronics Large area displays Leisure Letterpress Level Libraries Light Emitting Diodes Liquid crystal display Liquid embossing (Offset) liquid embossing MEMS (Electronic) MEMS (Medical) mS Magnetic stripe cards Magneto-striction Membrane keyboard Memory of tag Memory Card Mesh networks Metadata Microbatteries Microcontact printing. Microsensors Microtransfer patterning Microwave Middleware Military RFID Misread Modulation Multipacks Multi-Purpose Card Multi-tag reading NFC NMOS NOS ns Nanoscale Nanotechnology Nanotubes Near Field Communication |NFC) Near real time OFET OLE OLED ONS OSI Oligomer Omnidirectional Optical Memory Off-line On-line Offset lithography Offset gravure Oligophenylene Open System Open System Architecture Operating System OrganicID Organic Light Emitting Diode (OLED) Organic Light Emitting Diode large molecule Organic Light Emitting Diode small molecule Organic Light Emitting Diode Displays Origami Electronics PCM PCMCIA PDA PDMS PEDs PEDOT PEDOT: PSS PhRMA PIN PLED PML PMOS PMR PPV PVDF Pad Packaging Pad printing Parity Passive tag Passports Pathogen Pedestal antennas Pelikon Pentacene Personal authentication Personal identification number (PIN) Photovoltaic Polymers Piezoelectric Polyaniline Polydimethyl-siloxane Polymer light emitting diodes Polymer photodiodes Polymer transistor Polyphenyl-enevinylene Polypyrrole Polythienyl-enevinylene Polythiophenes Polyvinylidene fluoride Power levels Precursor Primary packaging Printed electronics Printing processes Printing technology - depressed Printing technology - other Printing technology - raised Product internet Programmability Programmer Protocol Proximity sensor Public key system RFAIS RFID RM RO RSA RTLS Radiation regulations Range Read Read-Access Reader Read only Read rate Readability Reader Read writer Remote Remote Magnetics Reprogrammable Regioregular polythiophenes Retail RFID Reverse supply chain Real Time Location System RTLS Redistribution of assets Roll up displays Rotary letterpress Rotary screen printing RFID system SAL SAM SAVANT SAW SHOT SST START SVC Screen printing Secondary packaging Segment Segmental numbering schemes Self adjusting use by date Self assembly Semi-active RFID Semi-passive RFID Sequential numbering systems Short range wireless Shrinkage Signpost Silicon chip Simple Logic Chip Cards Smart Active Label Smart Cards Smart labels Smart packaging Smart shelves Smart skin patches Smart stores Soft lithography Source tagging Smart dust Smart tickets Super Smart Cards Swept RF EAS and RFID TAV TFE TFEM TFTC TREAD TTB TTI TCP/IP Tag Tampography Technology Standards Tertiary packaging Tetracene Thermal ablation Thermal transfer Timers Time Temperature Biosensor (TTB) Transfer printing Transdermal Transistor TREAD Act UCC UHF UID ULD UMTS UPU Ubiquitous ID Center Ubiquitous Sensor Networks (USN) Ultra Wide Band (UWB) Unique signature Viscoelastic WHO WLAN Write Write rate ZigBee Get Full Details About This Report >> |
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