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Wafer level Packaging - Global Market Outlook (2017-2026)

Wafer level Packaging - Global Market Outlook (2017-2026)

According to Stratistics MRC, the global Wafer level Packaging Equipment market is estimated at $3.12 billion in 2017 and is projected to reach $15.21 billion by 2026, at a CAGR of 19.2%. The increasing demand for high-speed and compact size of electronic products has expanded the need for wafer-level packaging market. In addition, Internet of Things (IoT) has been gaining popularity and is considered as the third wave of technology. The rising popularity of IoT and portable electronics market is expected to foster the high growth of the wafer-level packaging industry. Moreover, WLP’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices acts as drivers of the market growth. However, encapsulation being a challenge for fan-out wafer-level packaging and high initial investment functions is key constraints to the market.

Packaging industry has made strides in terms of design incorporating functionality into the mix. Packaging has encompassed almost all the industries in the world and they have individually experienced a shift in their packaging designs. Innovations in packaging have become key to keeping up with the changing needs of the consumers as well as the manufacturers. One of the most interesting industries to incorporate packaging innovation into their operations is the semiconductor and technology industry. Wafer-level packaging (WLP) is used for interconnecting electronic components, such as capacitors, transistors, resistors, and others onto a single chip to make an integrated circuit, while utilizing deposited solder bumps onto the chip pads.

Based on End User, the electronics segment held steady growth during the forecast period. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed, and improvement in efficiency collectively fuel the replacement of conventional packaging with WLP in electronics industry. By geography, Asia pacific held the largest market and will continue to show due to the rising disposable incomes in the market. This is accredited to the presence of various manufacturing facilities, high consumption, and production of electronic products where WLP is steadily replacing wire bond and ongoing R&D. The growing adoption of smartphones in India will permit the market to experience a tumultuous rise in demand. The production of wafer level packaging will be focused more in the APAC region.

Some of the key players in Water Leaf packaging equipment market are Jiangsu Changjiang Electronics Technology Co. Ltd, Siliconware Precision Industries, Infineon Technologies AG, Deca Technologies, KLA-Tencor Corration, Nanium SA, and China Wafer Level CSP Co. Ltd, STATS ChipPAC Ltd, Marvell Technology Group Ltd, Amkor Technology Inc, Qualcomm Inc, Fujitsu Ltd, Toshiba Corp, Tokyo Electron Ltd and Applied Materials, Inc.
Integration Types Covered:
• Fan-in Wafer Level Chip Scale Package
• Fan-in wafer level packaging
• Fan-out wafer level packaging
• Flip chip

Packaging Technology Covered:
• Wafer Level Chip Scale Package (WLCSP)
• Nano WLP
• 3D TSV WLP
• 5D TSV WLP
• Other Packaging Technologies

Bumping Technologies Covered:
• Solder bumping
• Gold bumping
• Copper Bumping
• Other Bumping Technologies

End Users Covered:
• Mobile & Wireless communications
• IT & Telecommunication
• Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Other End Users



Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country level segments
- Market share analysis of the top industry players
- Strategic recommendations for the new entrants
- Market forecasts for a minimum of 9 years of all the mentioned segments, sub segments and the regional markets
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements


1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 End User Analysis
3.8 Emerging Markets
3.9 Futuristic Market Scenario
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Wafer level Packaging Equipment Market, By Integration Type
5.1 Introduction
5.2 Fan-in Wafer Level Chip Scale Package
5.3 Fan-In Wafer Level Packaging
5.4 Fan-Out Wafer Level Packaging
5.5 Flip Chip
6 Global Wafer level Packaging Equipment Market, By Packaging Technology
6.1 Introduction
6.2 Wafer Level Chip Scale Package (WLCSP)
6.3 Nano WLP
6.4 3D TSV WLP
6.5 5D TSV WLP
6.6 Other Packaging Technologies
6.6.1 Compliant WLP
6.6.2 2D TSV WLP
7 Global Wafer level Packaging Equipment Market, By Bumping Technology
7.1 Introduction
7.2 Solder bumping
7.3 Gold bumping
7.4 Copper Bumping
7.5 Other Bumping Technologies
7.5.1 Aluminum & Conductive Polymer Bumping
8 Global Wafer level Packaging Equipment Market, By End User
8.1 Introduction
8.2 Mobile & Wireless communications
8.3 IT & Telecommunication
8.4 Electronics
8.5 Automotive
8.6 Industrial
8.7 Healthcare
8.8 Aerospace & Defense
8.9 Other End Users
8.9.1 Non-Conventional Energy Resources
8.9.2 Media & Entertainment
9 Global Wafer level Packaging Equipment Market, By Geography
9.1 Introduction
9.2 North America
9.2.1 US
9.2.2 Canada
9.2.3 Mexico
9.3 Europe
9.3.1 Germany
9.3.2 UK
9.3.3 Italy
9.3.4 France
9.3.5 Spain
9.3.6 Rest of Europe
9.4 Asia Pacific
9.4.1 Japan
9.4.2 China
9.4.3 India
9.4.4 Australia
9.4.5 New Zealand
9.4.6 South Korea
9.4.7 Rest of Asia Pacific
9.5 South America
9.5.1 Argentina
9.5.2 Brazil
9.5.3 Chile
9.5.4 Rest of South America
9.6 Middle East & Africa
9.6.1 Saudi Arabia
9.6.2 UAE
9.6.3 Qatar
9.6.4 South Africa
9.6.5 Rest of Middle East & Africa
10 Key Developments
10.1 Agreements, Partnerships, Collaborations and Joint Ventures
10.2 Acquisitions & Mergers
10.3 New Product Launch
10.4 Expansions
10.5 Other Key Strategies
11 Company Profiling
11.1 Jiangsu Changjiang Electronics Technology Co. Ltd
11.2 Siliconware Precision Industries
11.3 Infineon Technologies AG
11.4 Deca Technologies
11.5 KLA-Tencor Corration
11.6 Nanium SA
11.7 China Wafer Level CSP Co. Ltd
11.8 STATS ChipPAC Ltd
11.9 Marvell Technology Group Ltd
11.10 Amkor Technology Inc
11.11 Qualcomm Inc
11.12 Fujitsu Ltd
11.13 Toshiba Corp
11.14 Tokyo Electron Ltd
11.15 Applied Materials, Inc
List of Tables
Table 1 Global Wafer level Packaging Equipment Market Outlook, By Region (2016-2026) (US $MN)
Table 2 Global Wafer level Packaging Equipment Market Outlook, By Integration Type (2016-2026) (US $MN)
Table 3 Global Wafer level Packaging Equipment Market Outlook, By Fan-in Wafer Level Chip Scale Package (2016-2026) (US $MN)
Table 4 Global Wafer level Packaging Equipment Market Outlook, By Fan-In Wafer Level Packaging (2016-2026) (US $MN)
Table 5 Global Wafer level Packaging Equipment Market Outlook, By Fan-Out Wafer Level Packaging (2016-2026) (US $MN)
Table 6 Global Wafer level Packaging Equipment Market Outlook, By Flip Chip (2016-2026) (US $MN)
Table 7 Global Wafer level Packaging Equipment Market Outlook, By Packaging Technology (2016-2026) (US $MN)
Table 8 Global Wafer level Packaging Equipment Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2016-2026) (US $MN)
Table 9 Global Wafer level Packaging Equipment Market Outlook, By Nano WLP (2016-2026) (US $MN)
Table 10 Global Wafer level Packaging Equipment Market Outlook, By 3D TSV WLP (2016-2026) (US $MN)
Table 11 Global Wafer level Packaging Equipment Market Outlook, By 5D TSV WLP (2016-2026) (US $MN)
Table 12 Global Wafer level Packaging Equipment Market Outlook, By Other Packaging Technologies (2016-2026) (US $MN)
Table 13 Global Wafer level Packaging Equipment Market Outlook, By Compliant WLP (2016-2026) (US $MN)
Table 14 Global Wafer level Packaging Equipment Market Outlook, By 2D TSV WLP (2016-2026) (US $MN)
Table 15 Global Wafer level Packaging Equipment Market Outlook, By Bumping Technology (2016-2026) (US $MN)
Table 16 Global Wafer level Packaging Equipment Market Outlook, By Solder bumping (2016-2026) (US $MN)
Table 17 Global Wafer level Packaging Equipment Market Outlook, By Gold bumping (2016-2026) (US $MN)
Table 18 Global Wafer level Packaging Equipment Market Outlook, By Copper Bumping (2016-2026) (US $MN)
Table 19 Global Wafer level Packaging Equipment Market Outlook, By Other Bumping Technologies (2016-2026) (US $MN)
Table 20 Global Wafer level Packaging Equipment Market Outlook, By Aluminum & Conductive Polymer Bumping (2016-2026) (US $MN)
Table 21 Global Wafer level Packaging Equipment Market Outlook, By End User (2016-2026) (US $MN)
Table 22 Global Wafer level Packaging Equipment Market Outlook, By Mobile & Wireless communications (2016-2026) (US $MN)
Table 23 Global Wafer level Packaging Equipment Market Outlook, By IT & Telecommunication (2016-2026) (US $MN)
Table 24 Global Wafer level Packaging Equipment Market Outlook, By Electronics (2016-2026) (US $MN)
Table 25 Global Wafer level Packaging Equipment Market Outlook, By Automotive (2016-2026) (US $MN)
Table 26 Global Wafer level Packaging Equipment Market Outlook, By Industrial (2016-2026) (US $MN)
Table 27 Global Wafer level Packaging Equipment Market Outlook, By Healthcare (2016-2026) (US $MN)
Table 28 Global Wafer level Packaging Equipment Market Outlook, By Aerospace & Defense (2016-2026) (US $MN)
Table 29 Global Wafer level Packaging Equipment Market Outlook, By Other End Users (2016-2026) (US $MN)
Table 30 Global Wafer level Packaging Equipment Market Outlook, By Non-Conventional Energy Resources (2016-2026) (US $MN)
Table 31 Global Wafer level Packaging Equipment Market Outlook, By Media & Entertainment (2016-2026) (US $MN)
Table 32 North America Wafer level Packaging Equipment Market Outlook, By Country (2016-2026) (US $MN)
Table 33 North America Wafer level Packaging Equipment Market Outlook, By Integration Type (2016-2026) (US $MN)
Table 34 North America Wafer level Packaging Equipment Market Outlook, By Fan-in Wafer Level Chip Scale Package (2016-2026) (US $MN)
Table 35 North America Wafer level Packaging Equipment Market Outlook, By Fan-In Wafer Level Packaging (2016-2026) (US $MN)
Table 36 North America Wafer level Packaging Equipment Market Outlook, By Fan-Out Wafer Level Packaging (2016-2026) (US $MN)
Table 37 North America Wafer level Packaging Equipment Market Outlook, By Flip Chip (2016-2026) (US $MN)
Table 38 North America Wafer level Packaging Equipment Market Outlook, By Packaging Technology (2016-2026) (US $MN)
Table 39 North America Wafer level Packaging Equipment Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2016-2026) (US $MN)
Table 40 North America Wafer level Packaging Equipment Market Outlook, By Nano WLP (2016-2026) (US $MN)
Table 41 North America Wafer level Packaging Equipment Market Outlook, By 3D TSV WLP (2016-2026) (US $MN)
Table 42 North America Wafer level Packaging Equipment Market Outlook, By 5D TSV WLP (2016-2026) (US $MN)
Table 43 North America Wafer level Packaging Equipment Market Outlook, By Other Packaging Technologies (2016-2026) (US $MN)
Table 44 North America Wafer level Packaging Equipment Market Outlook, By Compliant WLP (2016-2026) (US $MN)
Table 45 North America Wafer level Packaging Equipment Market Outlook, By 2D TSV WLP (2016-2026) (US $MN)
Table 46 North America Wafer level Packaging Equipment Market Outlook, By Bumping Technology (2016-2026) (US $MN)
Table 47 North America Wafer level Packaging Equipment Market Outlook, By Solder bumping (2016-2026) (US $MN)
Table 48 North America Wafer level Packaging Equipment Market Outlook, By Gold bumping (2016-2026) (US $MN)
Table 49 North America Wafer level Packaging Equipment Market Outlook, By Copper Bumping (2016-2026) (US $MN)
Table 50 North America Wafer level Packaging Equipment Market Outlook, By Other Bumping Technologies (2016-2026) (US $MN)
Table 51 North America Wafer level Packaging Equipment Market Outlook, By Aluminum & Conductive Polymer Bumping (2016-2026) (US $MN)
Table 52 North America Wafer level Packaging Equipment Market Outlook, By End User (2016-2026) (US $MN)
Table 53 North America Wafer level Packaging Equipment Market Outlook, By Mobile & Wireless communications (2016-2026) (US $MN)
Table 54 North America Wafer level Packaging Equipment Market Outlook, By IT & Telecommunication (2016-2026) (US $MN)
Table 55 North America Wafer level Packaging Equipment Market Outlook, By Electronics (2016-2026) (US $MN)
Table 56 North America Wafer level Packaging Equipment Market Outlook, By Automotive (2016-2026) (US $MN)
Table 57 North America Wafer level Packaging Equipment Market Outlook, By Industrial (2016-2026) (US $MN)
Table 58 North America Wafer level Packaging Equipment Market Outlook, By Healthcare (2016-2026) (US $MN)
Table 59 North America Wafer level Packaging Equipment Market Outlook, By Aerospace & Defense (2016-2026) (US $MN)
Table 60 North America Wafer level Packaging Equipment Market Outlook, By Other End Users (2016-2026) (US $MN)
Table 61 North America Wafer level Packaging Equipment Market Outlook, By Non-Conventional Energy Resources (2016-2026) (US $MN)
Table 62 North America Wafer level Packaging Equipment Market Outlook, By Media & Entertainment (2016-2026) (US $MN)
Table 63 Europe Wafer level Packaging Equipment Market Outlook, By Country (2016-2026) (US $MN)
Table 64 Europe Wafer level Packaging Equipment Market Outlook, By Integration Type (2016-2026) (US $MN)
Table 65 Europe Wafer level Packaging Equipment Market Outlook, By Fan-in Wafer Level Chip Scale Package (2016-2026) (US $MN)
Table 66 Europe Wafer level Packaging Equipment Market Outlook, By Fan-In Wafer Level Packaging (2016-2026) (US $MN)
Table 67 Europe Wafer level Packaging Equipment Market Outlook, By Fan-Out Wafer Level Packaging (2016-2026) (US $MN)
Table 68 Europe Wafer level Packaging Equipment Market Outlook, By Flip Chip (2016-2026) (US $MN)
Table 69 Europe Wafer level Packaging Equipment Market Outlook, By Packaging Technology (2016-2026) (US $MN)
Table 70 Europe Wafer level Packaging Equipment Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2016-2026) (US $MN)
Table 71 Europe Wafer level Packaging Equipment Market Outlook, By Nano WLP (2016-2026) (US $MN)
Table 72 Europe Wafer level Packaging Equipment Market Outlook, By 3D TSV WLP (2016-2026) (US $MN)
Table 73 Europe Wafer level Packaging Equipment Market Outlook, By 5D TSV WLP (2016-2026) (US $MN)
Table 74 Europe Wafer level Packaging Equipment Market Outlook, By Other Packaging Technologies (2016-2026) (US $MN)
Table 75 Europe Wafer level Packaging Equipment Market Outlook, By Compliant WLP (2016-2026) (US $MN)
Table 76 Europe Wafer level Packaging Equipment Market Outlook, By 2D TSV WLP (2016-2026) (US $MN)
Table 77 Europe Wafer level Packaging Equipment Market Outlook, By Bumping Technology (2016-2026) (US $MN)
Table 78 Europe Wafer level Packaging Equipment Market Outlook, By Solder bumping (2016-2026) (US $MN)
Table 79 Europe Wafer level Packaging Equipment Market Outlook, By Gold bumping (2016-2026) (US $MN)
Table 80 Europe Wafer level Packaging Equipment Market Outlook, By Copper Bumping (2016-2026) (US $MN)
Table 81 Europe Wafer level Packaging Equipment Market Outlook, By Other Bumping Technologies (2016-2026) (US $MN)
Table 82 Europe Wafer level Packaging Equipment Market Outlook, By Aluminum & Conductive Polymer Bumping (2016-2026) (US $MN)
Table 83 Europe Wafer level Packaging Equipment Market Outlook, By End User (2016-2026) (US $MN)
Table 84 Europe Wafer level Packaging Equipment Market Outlook, By Mobile & Wireless communications (2016-2026) (US $MN)
Table 85 Europe Wafer level Packaging Equipment Market Outlook, By IT & Telecommunication (2016-2026) (US $MN)
Table 86 Europe Wafer level Packaging Equipment Market Outlook, By Electronics (2016-2026) (US $MN)
Table 87 Europe Wafer level Packaging Equipment Market Outlook, By Automotive (2016-2026) (US $MN)
Table 88 Europe Wafer level Packaging Equipment Market Outlook, By Industrial (2016-2026) (US $MN)
Table 89 Europe Wafer level Packaging Equipment Market Outlook, By Healthcare (2016-2026) (US $MN)
Table 90 Europe Wafer level Packaging Equipment Market Outlook, By Aerospace & Defense (2016-2026) (US $MN)
Table 91 Europe Wafer level Packaging Equipment Market Outlook, By Other End Users (2016-2026) (US $MN)
Table 92 Europe Wafer level Packaging Equipment Market Outlook, By Non-Conventional Energy Resources (2016-2026) (US $MN)
Table 93 Europe Wafer level Packaging Equipment Market Outlook, By Media & Entertainment (2016-2026) (US $MN)
Table 94 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Country (2016-2026) (US $MN)
Table 95 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Integration Type (2016-2026) (US $MN)
Table 96 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Fan-in Wafer Level Chip Scale Package (2016-2026) (US $MN)
Table 97 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Fan-In Wafer Level Packaging (2016-2026) (US $MN)
Table 98 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Fan-Out Wafer Level Packaging (2016-2026) (US $MN)
Table 99 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Flip Chip (2016-2026) (US $MN)
Table 100 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Packaging Technology (2016-2026) (US $MN)
Table 101 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2016-2026) (US $MN)
Table 102 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Nano WLP (2016-2026) (US $MN)
Table 103 Asia Pacific Wafer level Packaging Equipment Market Outlook, By 3D TSV WLP (2016-2026) (US $MN)
Table 104 Asia Pacific Wafer level Packaging Equipment Market Outlook, By 5D TSV WLP (2016-2026) (US $MN)
Table 105 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Other Packaging Technologies (2016-2026) (US $MN)
Table 106 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Compliant WLP (2016-2026) (US $MN)
Table 107 Asia Pacific Wafer level Packaging Equipment Market Outlook, By 2D TSV WLP (2016-2026) (US $MN)
Table 108 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Bumping Technology (2016-2026) (US $MN)
Table 109 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Solder bumping (2016-2026) (US $MN)
Table 110 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Gold bumping (2016-2026) (US $MN)
Table 111 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Copper Bumping (2016-2026) (US $MN)
Table 112 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Other Bumping Technologies (2016-2026) (US $MN)
Table 113 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Aluminum & Conductive Polymer Bumping (2016-2026) (US $MN)
Table 114 Asia Pacific Wafer level Packaging Equipment Market Outlook, By End User (2016-2026) (US $MN)
Table 115 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Mobile & Wireless communications (2016-2026) (US $MN)
Table 116 Asia Pacific Wafer level Packaging Equipment Market Outlook, By IT & Telecommunication (2016-2026) (US $MN)
Table 117 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Electronics (2016-2026) (US $MN)
Table 118 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Automotive (2016-2026) (US $MN)
Table 119 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Industrial (2016-2026) (US $MN)
Table 120 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Healthcare (2016-2026) (US $MN)
Table 121 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Aerospace & Defense (2016-2026) (US $MN)
Table 122 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Other End Users (2016-2026) (US $MN)
Table 123 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Non-Conventional Energy Resources (2016-2026) (US $MN)
Table 124 Asia Pacific Wafer level Packaging Equipment Market Outlook, By Media & Entertainment (2016-2026) (US $MN)
Table 125 South America Wafer level Packaging Equipment Market Outlook, By Country (2016-2026) (US $MN)
Table 126 South America Wafer level Packaging Equipment Market Outlook, By Integration Type (2016-2026) (US $MN)
Table 127 South America Wafer level Packaging Equipment Market Outlook, By Fan-in Wafer Level Chip Scale Package (2016-2026) (US $MN)
Table 128 South America Wafer level Packaging Equipment Market Outlook, By Fan-In Wafer Level Packaging (2016-2026) (US $MN)
Table 129 South America Wafer level Packaging Equipment Market Outlook, By Fan-Out Wafer Level Packaging (2016-2026) (US $MN)
Table 130 South America Wafer level Packaging Equipment Market Outlook, By Flip Chip (2016-2026) (US $MN)
Table 131 South America Wafer level Packaging Equipment Market Outlook, By Packaging Technology (2016-2026) (US $MN)
Table 132 South America Wafer level Packaging Equipment Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2016-2026) (US $MN)
Table 133 South America Wafer level Packaging Equipment Market Outlook, By Nano WLP (2016-2026) (US $MN)
Table 134 South America Wafer level Packaging Equipment Market Outlook, By 3D TSV WLP (2016-2026) (US $MN)
Table 135 South America Wafer level Packaging Equipment Market Outlook, By 5D TSV WLP (2016-2026) (US $MN)
Table 136 South America Wafer level Packaging Equipment Market Outlook, By Other Packaging Technologies (2016-2026) (US $MN)
Table 137 South America Wafer level Packaging Equipment Market Outlook, By Compliant WLP (2016-2026) (US $MN)
Table 138 South America Wafer level Packaging Equipment Market Outlook, By 2D TSV WLP (2016-2026) (US $MN)
Table 139 South America Wafer level Packaging Equipment Market Outlook, By Bumping Technology (2016-2026) (US $MN)
Table 140 South America Wafer level Packaging Equipment Market Outlook, By Solder bumping (2016-2026) (US $MN)
Table 141 South America Wafer level Packaging Equipment Market Outlook, By Gold bumping (2016-2026) (US $MN)
Table 142 South America Wafer level Packaging Equipment Market Outlook, By Copper Bumping (2016-2026) (US $MN)
Table 143 South America Wafer level Packaging Equipment Market Outlook, By Other Bumping Technologies (2016-2026) (US $MN)
Table 144 South America Wafer level Packaging Equipment Market Outlook, By Aluminum & Conductive Polymer Bumping (2016-2026) (US $MN)
Table 145 South America Wafer level Packaging Equipment Market Outlook, By End User (2016-2026) (US $MN)
Table 146 South America Wafer level Packaging Equipment Market Outlook, By Mobile & Wireless communications (2016-2026) (US $MN)
Table 147 South America Wafer level Packaging Equipment Market Outlook, By IT & Telecommunication (2016-2026) (US $MN)
Table 148 South America Wafer level Packaging Equipment Market Outlook, By Electronics (2016-2026) (US $MN)
Table 149 South America Wafer level Packaging Equipment Market Outlook, By Automotive (2016-2026) (US $MN)
Table 150 South America Wafer level Packaging Equipment Market Outlook, By Industrial (2016-2026) (US $MN)
Table 151 South America Wafer level Packaging Equipment Market Outlook, By Healthcare (2016-2026) (US $MN)
Table 152 South America Wafer level Packaging Equipment Market Outlook, By Aerospace & Defense (2016-2026) (US $MN)
Table 153 South America Wafer level Packaging Equipment Market Outlook, By Other End Users (2016-2026) (US $MN)
Table 154 South America Wafer level Packaging Equipment Market Outlook, By Non-Conventional Energy Resources (2016-2026) (US $MN)
Table 155 South America Wafer level Packaging Equipment Market Outlook, By Media & Entertainment (2016-2026) (US $MN)
Table 156 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Country (2016-2026) (US $MN)
Table 157 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Integration Type (2016-2026) (US $MN)
Table 158 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Fan-in Wafer Level Chip Scale Package (2016-2026) (US $MN)
Table 159 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Fan-In Wafer Level Packaging (2016-2026) (US $MN)
Table 160 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Fan-Out Wafer Level Packaging (2016-2026) (US $MN)
Table 161 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Flip Chip (2016-2026) (US $MN)
Table 162 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Packaging Technology (2016-2026) (US $MN)
Table 163 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2016-2026) (US $MN)
Table 164 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Nano WLP (2016-2026) (US $MN)
Table 165 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By 3D TSV WLP (2016-2026) (US $MN)
Table 166 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By 5D TSV WLP (2016-2026) (US $MN)
Table 167 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Other Packaging Technologies (2016-2026) (US $MN)
Table 168 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Compliant WLP (2016-2026) (US $MN)
Table 169 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By 2D TSV WLP (2016-2026) (US $MN)
Table 170 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Bumping Technology (2016-2026) (US $MN)
Table 171 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Solder bumping (2016-2026) (US $MN)
Table 172 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Gold bumping (2016-2026) (US $MN)
Table 173 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Copper Bumping (2016-2026) (US $MN)
Table 174 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Other Bumping Technologies (2016-2026) (US $MN)
Table 175 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Aluminum & Conductive Polymer Bumping (2016-2026) (US $MN)
Table 176 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By End User (2016-2026) (US $MN)
Table 177 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Mobile & Wireless communications (2016-2026) (US $MN)
Table 178 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By IT & Telecommunication (2016-2026) (US $MN)
Table 179 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Electronics (2016-2026) (US $MN)
Table 180 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Automotive (2016-2026) (US $MN)
Table 181 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Industrial (2016-2026) (US $MN)
Table 182 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Healthcare (2016-2026) (US $MN)
Table 183 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Aerospace & Defense (2016-2026) (US $MN)
Table 184 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Other End Users (2016-2026) (US $MN)
Table 185 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Non-Conventional Energy Resources (2016-2026) (US $MN)
Table 186 Middle East & Africa Wafer level Packaging Equipment Market Outlook, By Media & Entertainment (2016-2026) (US $MN)

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