Board-to-Board Connector Market by Type (Male Connectors, Socket), Connector Type (Mezzanine, Backplane), Mounting (Surface-mount Technology, Through-hole Technology, Press-Fit, Hybrid), Pitch (<1 mm, 1 mm to 2 mm, >2 mm) - Global Forecast to 2030

The global board-to-board connector market is anticipated to reach USD 12.42 billion in 2025 and USD 16.05 billion by 2030, exhibiting a CAGR of 5.3% during the forecast period. The increasing demand for industrial automation and robotics fuels the market growth as factories and production systems adopt more innovative, interconnected technologies. These connectors are crucial in enabling the reliable transmission of data, power, and signals between control units, sensors, and robotic components. As industries transition to Industry 4.0, there is a growing demand for compact, vibration-resistant, and high-speed connectors that can withstand harsh operating environments. Robots, programmable logic controllers (PLCs), and automated machinery rely on these connectors for precision and efficiency, driving continuous adoption across manufacturing, logistics, and process automation sectors.

“1 mm to 2 mm segment is expected to hold the largest market share in 2030.”

The 1 mm to 2 mm pitch segment in the board-to-board connector market is expected to dominate due to its optimal balance between miniaturization, signal integrity, and mechanical reliability. This pitch range is widely adopted in consumer electronics, industrial automation, and automotive applications where compact designs are critical without compromising electrical performance. Smaller pitches below 1 mm often face challenges in handling high current and ensuring durability, while larger pitches above 2 mm occupy more space and limit device miniaturization. The 1–2 mm range supports high-speed data transmission and reliable power delivery, making it suitable for advanced devices like IoT modules, wearables, and automotive control units. Additionally, manufacturers prefer this segment because it offers easier assembly, lower manufacturing complexity, and broad compatibility with existing PCB layouts. These factors collectively make the 1–2 mm segment the preferred choice for balancing performance, size, and cost efficiency across multiple industries.

“Automotive segment to grow at the fastest rate during the forecast period. “

The automotive segment is projected to grow the fastest in the board-to-board connector market due to the rapid adoption of electric vehicles (EVs), autonomous driving technologies, and advanced infotainment systems. Modern cars rely on numerous electronic control units (ECUs), sensors, and battery management systems that require compact, high-reliability connectors to ensure seamless power and data transmission. The shift toward connected and smart vehicles further boosts the demand for high-speed, vibration-resistant connectors that can withstand harsh automotive environments. Additionally, the growing investment in vehicle electrification, ADAS, and in-vehicle connectivity continues to drive the need for advanced board-to-board connector solutions in the automotive industry.

“US is expected to hold a significant market share in North America during the forecast period.”

The US dominates the board-to-board connector market in North America due to its strong presence of leading manufacturers in the automotive, aerospace, defense, and electronics sectors. The country’s advanced technological infrastructure and high adoption of automation, 5G, and IoT-enabled systems drive significant demand for reliable, high-speed interconnect solutions. Major players, such as TE Connectivity and Molex, have extensive operations and R&D facilities in the US, supporting innovation and large-scale production. Additionally, the growing use of electric vehicles, data centers, and industrial robotics further strengthens the US market position, making it the primary hub for board-to-board connector demand and development in North America.

In-depth interviews have been conducted with chief executive officers (CEOs), directors, and other executives from various key organizations operating in the board-to-board connector marketplace.

• By Company Type: Tier 1 – 40%, Tier 2 – 35%, and Tier 3 – 25%
• By Designation: C-level Executives – 45%, Directors – 35%, and Others – 20%
• By Region: North America – 45%, Europe – 25%, Asia Pacific – 20%, and RoW – 10%

The study includes an in-depth competitive analysis of these key players in the board-to-board connector market, with their company profiles, recent developments, and key market strategies.

Research Coverage

This research report categorizes the board-to-board connector market by type, connector type, pitch, mounting type, application, end user, and region (North America, Europe, Asia Pacific, RoW). The report provides detailed information on the significant factors influencing market growth, including drivers, restraints, challenges, and opportunities. A thorough analysis of the key industry players has provided insights into their business overview, solutions and services, key strategies, contracts, partnerships, and agreements. Product and service launches, acquisitions, and recent developments associated with the market. This report covers a competitive analysis of upcoming startups in the board-to-board connector ecosystem.

Reasons to Buy This Report

The report will assist market leaders and new entrants with information on the closest approximations of revenue numbers for the board-to-board connector market and its subsegments. It will also help stakeholders understand the competitive landscape and gain more insights to position their businesses better and plan suitable go-to-market strategies. The report also helps stakeholders understand the market pulse and provides information on key market drivers, restraints, challenges, and opportunities.

The report provides insights into the following pointers:

• Analysis of key drivers (expansion of 5G networks and high-speed data communication, increasing focus on industrial automation and robotics, rising deployment of Internet of Things devices), restraints (technological complexities associated with developing application-specific board-to-board connectors, environmental and regulatory compliance), opportunities (expansion of electric vehicles, increasing demand for rugged connectors), and challenges (signal integrity and high-speed data transmission, cost optimization and pricing pressure) influencing the growth of the board-to-board connector market.
• Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and product launches in the board-to-board connector market
• Market Development: Comprehensive information about lucrative markets with an analysis of the board-to-board connector market across varied regions
• Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the board-to-board connector market
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players in the board-to-board connector market, such as TE Connectivity (Ireland), Amphenol Corporation (US), Hirose Electric Co. Ltd. (Japan), Molex (US), and Japan Aviation Electronics Industry, Ltd (Japan)

Show more