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Global System-in-Package Market 2016-2020

Global System-in-Package Market 2016-2020

About SiP

A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.

Technavio’s analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.The market is divided into the following segments based on geography:

  • Americas
  • APAC
  • EMEA
Technavio's report, Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Amkor Technology
  • ASE
  • JCET
  • SPIL
  • UTAC
Other prominent vendors
  • ChipMOS Technology
  • ChipSiP Technology
  • NANIUM
  • Octavo Systems
  • Samsung Electro-Mechanics
Market driver
  • Need to control rising costs
  • For a full, detailed list, view our report
Market challenge
  • High inventory levels in supply chain
  • For a full, detailed list, view our report
Market trend
  • Growth of OSAT vendors
  • For a full, detailed list, view our report
Key questions answered in this report
  • What will the market size be in 2020 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
  • What are the market opportunities and threats faced by the key vendors?
  • What are the strengths and weaknesses of the key vendors?


Press Release

Technavio Announces the Publication of its Research Report – Global SiP Market 2016-2020

Technavio recognizes the following companies as the key players in the global SiP market: Amkor Technology, ASE, JCET, SPIL, and UTAC

Other prominent vendors in the market are: ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, and Samsung Electro-Mechanics.

Commenting on the report, an analyst from Technavio’s team said: “One trend gaining traction in this market is growth of OSAT vendors. The number of OSATs in APAC, especially China, is growing at a considerable pace, as these companies have strong liquidity and financial backing. This enables OSATs to have adequate funds for R&D and capacity expansion. Moreover, governmental support toward the development of the semiconductor industry from major APAC countries such as South Korea, China, and Japan is propelling the growth of these facilities.”

According to the report, the increasing requirement in the semiconductor market to offer cost-effective and efficient semiconductor products is driving the demand for SiP packaging technology. The utilization of copper wires instead of the conventional gold wires for the connections within the chips in 3D semiconductor packaging is allowing vendors to reduce their costs significantly.

Further, the report states that the semiconductor packaging vendors are affected by the fluctuating foreign exchange rates due to the need of importing and exporting raw material across the globe. The instability of the world economy such as the slowdown of the Chinese economy and Britain's exit from the EU has led to volatile and unpredictable exchange rates. As a result, global players in the market are not able to anticipate future conditions and are likely to incur significant monetary losses in international trade.



Companies Mentioned

Amkor Technology, ASE, JCET, SPIL, UTAC, ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, Samsung Electro-Mechanics.

  • Executive summary
    • Highlights
  • Scope of the report
    • Definition
    • Source year and forecast period
    • Market overview
    • Segmentation
      • Table Global SiP market segmentation
    • Geographical coverage
      • Table List of countries in key geographies
    • Vendor segmentation
      • Table Market vendors
    • Common currency conversion rates
      • Table Currency conversions
    • Top-vendor offerings
      • Table Product offerings
  • Market research methodology
    • Research methodology
    • Economic indicators
  • Introduction
    • Key market highlights
  • Technology overview
    • Back-end chip formation
      • Table Back-end chip formation steps
    • Wafer-level versus die-level packaging and assembly
    • Evolution of semiconductor packaging industry
      • Table 2.5D IC block diagram
      • Table 3D IC block diagram
    • Eco-system of semiconductor IC packaging industry
      • Table Old semiconductor IC packaging industry supply chain
      • Table New semiconductor IC packaging industry supply chain
  • Market landscape
    • Market overview
    • Comparison between SoC, SiP, and chip-on-board (CoB)
      • Table SoC, SiP, and CoB ranking on functioning parameters
    • Market size and forecast
      • Table Global SiP market 2015-2020 ($ billions)
    • Five forces analysis
      • Table Five forces analysis
  • Market segmentation by application
    • Table Percentage share of SiP usage in applications (2015-2020)
    • Table Percentage share of SiP usage in applications 2015-2020 ($ billions)
    • Communications sector
      • Table Global SiP market for communications sector 2015-2020 ($ billions)
    • Consumer electronics sector
      • Table Global SiP market for consumer electronics sector 2015-2020 ($ billions)
    • Computers sector
      • Table Global SiP market for computer sector 2015-2020 ($ billions)
    • Automotive sector
      • Table Global SiP market for automotive sector 2015-2020 ($ billions)
      • Table Expected automotive shipment forecast y-o-y (%)
    • Medical sector
      • Table Global SiP market for medical sector 2015-2020 ($ billions)
  • Market segmentation by interconnect technology
    • Table Bonding technologies for SiP, 2015-2020 (% share)
    • Table Bonding technologies for SiP, 2015-2020 ($ billions)
    • Wire bond packaging
      • Table Global SiP market for wire bond packaging 2015-2020 ($ billions)
    • Flip-chip packaging
      • Table Global SiP market for flip-chip packaging 2015-2020 ($ billions)
  • Market segmentation by end-user
    • Table Global SiP market by end-user 2015-2020 (% share)
    • Table Global SiP market by end-user 2015-2020 ($ billions)
    • Foundries
      • Table Global SiP market of foundries 2015-2020 ($ billions)
    • IDMs
      • Table Global SiP market for IDMs 2015-2020 ($ billions)
  • Geographical segmentation
    • Table Global SiP market by geography 2015-2020 (% share)
    • Table Global SiP market by geography 2015-2020 (% share)
    • APAC
      • Table SiP market in APAC 2015-2020 ($ billions)
    • Americas
      • Table SiP market in Americas 2015-2020 ($ billions)
    • EMEA
      • Table SiP market in EMEA 2015-2020 ($ billions)
  • Market drivers
    • Need to control rising costs
    • Emergence of advanced and compact consumer electronic devices
    • Rise in number of fabs
    • Increasing number of IoT devices
    • Design complexities in SoC
  • Impact of drivers
    • Table Impact of drivers
  • Market challenges
    • High inventory levels in supply chain
      • Table Global semiconductor market trend 1992-2015 ($ billions)
    • Fluctuation of foreign exchange rates
    • High investment market
  • Impact of drivers and challenges
    • Table Impact of drivers and challenges
  • Market trends
    • Growth of OSAT vendors
    • Emergence of FOWLP technology
    • Automation in automobiles
  • Vendor landscape
    • Competitive scenario
    • Key vendors
    • Other prominent vendors
      • Table Other vendors in global SiP market
  • Appendix
  • List of abbreviations
  • Explore Technavio

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