Global System-in-Package Market 2016-2020
A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.
Technavio’s analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global SiP Market 2016-2020
Technavio recognizes the following companies as the key players in the global SiP market: Amkor Technology, ASE, JCET, SPIL, and UTAC
Other prominent vendors in the market are: ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, and Samsung Electro-Mechanics.
Commenting on the report, an analyst from Technavio’s team said: “One trend gaining traction in this market is growth of OSAT vendors. The number of OSATs in APAC, especially China, is growing at a considerable pace, as these companies have strong liquidity and financial backing. This enables OSATs to have adequate funds for R&D and capacity expansion. Moreover, governmental support toward the development of the semiconductor industry from major APAC countries such as South Korea, China, and Japan is propelling the growth of these facilities.”
According to the report, the increasing requirement in the semiconductor market to offer cost-effective and efficient semiconductor products is driving the demand for SiP packaging technology. The utilization of copper wires instead of the conventional gold wires for the connections within the chips in 3D semiconductor packaging is allowing vendors to reduce their costs significantly.
Further, the report states that the semiconductor packaging vendors are affected by the fluctuating foreign exchange rates due to the need of importing and exporting raw material across the globe. The instability of the world economy such as the slowdown of the Chinese economy and Britain's exit from the EU has led to volatile and unpredictable exchange rates. As a result, global players in the market are not able to anticipate future conditions and are likely to incur significant monetary losses in international trade.
Amkor Technology, ASE, JCET, SPIL, UTAC, ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, Samsung Electro-Mechanics.
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