About Non-Volatile Dual In-Line Memory Module
Many new technologies have emerged in the semiconductor memory market. These technologies include DRAM, negative-AND (NAND) flash, pseudo static RAM, static RAM (SRAM), NOR Flash, erasable programmable read-only memory (EPROM), and electrically erasable programmable read-only memory (EEPROM).
Technavio’s analysts forecast the global non-volatile dual in-line memory module market to grow at a CAGR of 64.49% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global non-volatile dual in-line memory module market for 2016-2020. To calculate the market size, the report considers the revenue generated from the retail sales of haircare products to individual consumers and salons.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Non-Volatile Dual In-Line Memory Module Market 2016-2020
Technavio recognizes the following companies as the key players in the global non-volatile dual in-line memory module market: AgigA Tech, Diablo Technologies, HP, Micron Technology, Netlist, SK Hynix, SMART Modular Technologies, and Viking Technology.
Commenting on the report, an analyst from Technavio’s team said: “One of latest trends in the market is rapid growth in non-volatile market. The global non-volatile market size in 2015 was around $1.6 billion and is expected to grow rapidly by 2020. Enterprise servers and storage will be the largest adapters of NVDIMM, expected to account for nearly 60% of the market by the end of 2018, followed by workstations and networking equipment. By regions, North America is the largest market in 2015 accounting for 3/4 of the total NVDIMM sales globally followed by Europe and Asia accounting for 12% and 10%, respectively. North America is expected to be the leader until 2020, due to increasing demand from the server industry.”
According to the report, one of the primary drivers in the market is increasing number of data centers. The increasing use of connected computers, internet, and networking technologies is generating large amount of digital information, which is estimated to be 35 zettabytes (35x1021 bytes) by 2020. Such large amount of data requires storage that is reliable, safe and quickly accessible for seamless performance of a computing system. Currently, RAM, which is quick but unable to store data when power is turned off, performs processing work in a computing device. Hence, data centers are moving toward non-volatile memory devices such as NVDIMMs that have longer life spans than SSDs and are as quick as RAMs at reading metadata.
Further, the report states that one major challenge in the market is packaging and board assembly of NVDIMMs. Product packaging and mounting on printed circuit board are one of the issues pertaining to NVDIMMs. Prior to PCB mounting, users write data on to NVDIMMs that must remain post packaging along with the memory cell functionality. Infrared (IR) solder process is carried out at a temperature of 2,600°C for around three minutes, and the mold used for packaging is incubated for six hours under the temperature ranging from 1750°C to 1800°C. NVDIMM's performance is affected due to this operating temperature. Overcoming this challenges is crucial for success of NVDIMMs as this packaging technology is expected to remain around for a few years ahead.
AgigA Tech, Diablo Technologies, HP, Micron Technology, Netlist, SK Hynix, SMART Modular Technologies, Viking Technology.
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