Global Fab Material Market 2015-2019
About fab materials
Fab materials are used in different stages of processes such as etching, oxidation, deposition, and planarization. The global fab materials market is dominated by APAC, owing to a strong base in fabrication materials. These countries provide cheap labour and have a large end-customer base. Moreover, increasing demand for smart devices, especially smartphones, is creating a huge demand in these countries for fab materials.
Technavio's analysts forecast the global fab materials market to grow at a CAGR of 7.07% over the period 2014-2019.
Covered in this report
This report covers the present market conditions and growth prospects of the global fab materials market for the period 2015-2019. The report talks about the various leading vendors of fab materials. It also highlights the vendor landscape and a corresponding detailed analysis of the top seven vendors in the global fab materials market. The market segmentation is done based on the following:
Press Release
Technavio Announces the Publication of its Research Report – Global Fab Material Market 2015-2019
Technavio recognizes the following companies as the key players in the Global Fab Material Market: Air Liquide, BASF, Dow Corning, DuPont, Hitachi Chemical, Kanto Chemicals and Linde
Other Prominent Vendors in the market are: Evergreen Semiconductor Materials, Guangdong Rongtai, Henkel and Honeywell Electronic Materials
Commenting on the report, an analyst from Technavio’s team said: “The global fab materials market is witnessing certain trends that are expected to contribute to the growth of the market during the forecast period. One such trend is, a shift toward the captive market. Companies are developing photomasks by in-house operations in order to get a competitive advantage from other vendors.”
According to the report, various drivers are contributing to the growth of the global fab materials market; the most important of these is the development of NEMS. The miniaturization of microelectromechanical systems is creating a need for more advanced photoresists and photoresists ancillaries. These advanced photoresists will experience new advancements in order to form specific patterns on miniature devices.
Further, the report states that one of the major challenges in the market is to overcome the defects of CMP. This process does not define the end point of the polishing process and therefore, the process needs to be repeated again, which takes time.
Companies Mentioned
Air Liquide, BASF, Dow Corning, DuPont, Hitachi Chemical, Kanto Chemicals, Linde, Evergreen Semiconductor Materials, Guangdong Rongtai, Henkel, Honeywell Electronic Materials
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