Global Anti-static Packaging Market 2016-2020
About Anti-Static Packaging
Anti-static packaging is used for devices or products that can be damaged by ESD. It is specially meant for devices that are prone to triboelectric charging. Triboelectric charging occurs due to friction between two material surfaces. The intensity of electrical charge depends on various factors such as surface roughness, strain, temperature, and other properties of the materials. There are various types of ESD protective materials as listed below:
Technavio’s analysts forecast the global anti-static packaging market to grow at a CAGR of 8.47% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of global anti-static packaging market for 2016-2020. To calculate the market size, the report considers the major drivers that influence the growth of the global anti-static packaging market.
The market is divided into the following segments based on geography:
Technavio Announces the Publication of its Research Report – Global Anti-Static Packaging Market 2016-2020
Technavio recognizes the following companies as the key players in the global anti-static packaging market: 3M, BASF, and Dow Chemical.
Other Prominent Vendors in the market are: DaklaPack, Desco Industries, Dou Yee, GWP, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP, and Uline.
Commenting on the report, an analyst from Technavio’s team said: “There is lot of room for innovation in anti-static packaging products, especially in anti-static coatings. With the development of nanomaterials and the emergence of a trend toward the miniaturization of electronic chips, anti-static packaging products need to evolve according to industry requirements.”
According to the report, increasing miniaturization of electronic devices will be a key driver for market growth. The growing demand for compact electronic products has increased miniaturization of semiconductors, further increasing the demand for anti-static packaging.
Further, the report states that complying with the strict material specifications set down by packaging assemblers and testers is a major challenge that vendors of anti-static packaging materials face. The demand for lead-free packages integrated with various epoxy resins, wires, and chips is placing pressure on the material suppliers to strictly adhere to specifications.
3M, BASF, Dow Chemical, DaklaPack, Desco Industries, Dou Yee, GWP, Kao-Chia Plastics, Miller Supply, Polyplus Packaging, TIP, Uline.
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