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Next-Gen Lithography for Advanced Nodes: Technologies and Applications

Publisher Frost & Sullivan
Published Dec 02, 2025
Length 52 Pages
SKU # MC20635594

Description

The semiconductor industry is approaching the physical and economic limits of traditional lithography, driving the emergence of next-generation patterning technologies essential for scaling beyond 3 nm and into the sub-2 nm era. This report explores the technological evolution, ecosystem enablers, and strategic implications of next-gen lithography, including high-NA EUV, multiple e-beam, nanoimprint, and soft X-ray lithography.

It examines how advancements in resists, pellicles, photomasks, metrology, and computational lithography are enabling unprecedented precision and yield improvements for logic, memory, and heterogeneous integration applications. The study highlights recent deployments by leading foundries and toolmakers, including ASML, Zeiss, TSMC, Intel, and EVG, and analyzes the patent landscape shaping future innovation.

Through detailed coverage of growth drivers, restraints, and emerging opportunities, Frost & Sullivan identifies key growth avenues including high-NA EUV for sub-2 nm nodes, soft X-ray lithography (beyond EUV), and AI-integrated digital twin solutions for process optimization. The report concludes with strategic recommendations for foundries, policymakers, and ecosystem partners to secure technological leadership, manage high capital risks, and extend Moore’s Law into the next decade.

Table of Contents

52 Pages

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