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Next-Gen Lithography for Advanced Nodes: Technologies and Applications

Publisher Frost & Sullivan
Published Dec 02, 2025
Length 52 Pages
SKU # MC20635594

Description

The semiconductor industry is approaching the physical and economic limits of traditional lithography, driving the emergence of next-generation patterning technologies essential for scaling beyond 3 nm and into the sub-2 nm era. This report explores the technological evolution, ecosystem enablers, and strategic implications of next-gen lithography, including high-NA EUV, multiple e-beam, nanoimprint, and soft X-ray lithography.

It examines how advancements in resists, pellicles, photomasks, metrology, and computational lithography are enabling unprecedented precision and yield improvements for logic, memory, and heterogeneous integration applications. The study highlights recent deployments by leading foundries and toolmakers, including ASML, Zeiss, TSMC, Intel, and EVG, and analyzes the patent landscape shaping future innovation.

Through detailed coverage of growth drivers, restraints, and emerging opportunities, Frost & Sullivan identifies key growth avenues including high-NA EUV for sub-2 nm nodes, soft X-ray lithography (beyond EUV), and AI-integrated digital twin solutions for process optimization. The report concludes with strategic recommendations for foundries, policymakers, and ecosystem partners to secure technological leadership, manage high capital risks, and extend Moore’s Law into the next decade.

Table of Contents

52 Pages
    • Why Is It Increasingly Difficult to Grow?
    • The Strategic Imperative 8
    • The Impact of the Top 3 Strategic Imperatives on the Next-Gen Lithography Industry
    • Growth Opportunities Fuel the Growth Pipeline Engine ne
    • Research Methodology
    • Scope of Analysis
    • Segmentation
    • Growth Drivers
    • Growth Restraints
    • Definition and Scope
    • Evolution in the Lithography Industry
    • Enablers and Ecosystem
    • Extreme Ultraviolet Lithography and High-Numerical Aperture EUV
    • Recent Deployments in EUV and High-NA EUV
    • Multiple E-Beam Lithography
    • Recent Deployments in MEBL
    • Nanoimprint Lithography
    • Recent Deployments in NIL
    • Deep-UV Lithography with Multi-Patterning
    • Recent Deployments in DUV Lithography with Multi-Patterning
    • Lithography Advances Enabling Next-Gen Logic: GAA/CFET
    • Lithography Advances Enabling Next-Gen Memory: DRAM and 3D NAND
    • Lithography Advances Enabling Advanced Packaging and Heterogeneous Integration
    • Lithography Advances Enabling Photonics, Micro-LEDs, and Specialty Devices
    • Patent Landscape and Top Applicants
    • Research and Patents by Region
    • Future of Next-Gen Lithography and Impact on Moore’s Law
    • Strategic Implications and Recommendations
    • Growth Opportunity 1: High-NA EUV Lithography: Sub-2nm Nodes
    • Growth Opportunity 2: Soft X-Ray Lithography (Beyond EUV)
    • Growth Opportunity 3: Integrating AI and Digital Twin Technologies
    • Benefits and Impacts of Growth Opportunities
    • Next Steps

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