Global Market for Mixed-signal System-on-Chip Applications with a Focus on Node Geometries

Global Market for Mixed-signal System-on-Chip Applications with a Focus on Node Geometries

Report Includes:

- An overview of the global market for mixed-signal SoC applications and a detailed study on node geometries
- Analyses of global market trends, with data from 2018, estimates for 2019, and projections of compound annual growth rates (CAGRs) through 2024
- Characterization and quantification of SoC application market by design, technology node, application and region
- Comparative study on digital vs manual signals
- Detailed information about the major factors influencing the market growth and recent developments within the industry
- Company profiles of the leading players in the industry, including Broadcom Corp., Intel Corp., Micron Technology Inc., Qualcomm Inc., Taiwan Semiconductor, and Toshiba Corp.


Chapter 1 Introduction
Reason for Doing This Study
Information Sources
Key Data from Secondary Sources
Key Data from Primary Sources
Methodology
Geographic Breakdown
Analyst's Credentials
Related BCC Research Reports
Chapter 2 Evolution, Roadmap and Summary
Development and Evolution of Mixed-Signal SoC
Report Summary
Chapter 3 Mixed-Signal SoC: Future and Growth Prospects
Introduction
Future Prospects
Market Dynamics: Drivers and Restraints
Market Drivers
Restraints
Opportunities
Chapter 4 Mixed-Signal SoC by Design Combination Ratio
Introduction
Analog Digital Combination (Ratio-70:30)
Analog Digital Combination (Ratio-30:70)
Other Combination Ratios
Chapter 5 Mixed-Signal SoC by Technology Node
Introduction
22 nm and Above
16 Less Than x Less Than Equal to 22
12 Less Than x Less Than Equal to 16
9 Less Than x Less Than Equal to 12
Others
Chapter 6 Mixed-Signal SoC by Application
Introduction
Automotive
Industrial
Handheld Devices
Communications
Others
Chapter 7 Mixed-Signal SoC by Geography
Introduction
North America
Europe
Asia-Pacific
Rest of the World
Chapter 8 Company Profiles
BROADCOM
INTEL
MICRON TECHNOLOGY
NXP
QUALCOMM
SAMSUNG ELECTRONICS CO., LTD.
SK HYNIX INC.
TAIWAN SEMICONDUCTOR
TEXAS INSTRUMENTS
TOSHIBA
Chapter 9 Mixed-Signal SoC Patent Analysis
Patent Review by Region
Important Patents on Mixed-Signal SoC Focusing Node Geometry
List of Tables
Summary Table : Global Market for Mixed-Signal SoC, by Region, Through 2024
Table 1 : Global Market for Mixed-Signal SoC, by Design Combination Ratio, Through 2024
Table 2 : Global Market for Mixed-Signal SoC, by Technology Node, Through 2024
Table 3 : Global Market for Mixed-Signal SoC, by Application, Through 2024
Table 4 : Global Market for Mixed-Signal SoC, by Region, Through 2024
List of Figures
Summary Figure : Global Market for Mixed-Signal SoC, by Region, 2018-2024
Figure 1 : Global Market for Mixed-Signal SoC, by Design Combination Ratio, 2018-2024
Figure 2 : Global Market for Mixed-Signal SoC, by Technology Node, 2018-2024
Figure 3 : Global Market for Mixed-Signal SoC, by Application, 2018-2024
Figure 4 : Global Market for Mixed-Signal SoC, by Region, 2018-2024
Figure 5 : Global Mixed-Signal SoC Patents Share Analysis, by Country, 2018

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