
Asia-Pacific Electronics Adhesives Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)
Description
Asia-Pacific Electronics Adhesives Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)
IBM Corporation
Oracle Corporation
Internap Corporation
Packet Inc. (An Equinix Inc. Company)
Scaleway Inc.
Amazon Web Services Inc
Rackspace Inc.
CenturyLink, Inc.
LightEdge Solutions, Inc
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The Asia-Pacific electronics adhesives market is expected to grow at with a CAGR greater than 8% during the forecast period. One of the major factors driving the market is the growing technological advancements in manufacturing electronic adhesives. However, volatility of the raw material prices is hindering the growth of the market studied.
Key Highlights- Shift towards environment-friendly water based adhesives is expected to provide a major growth opportunity for the market studied.
- China accounted for the highest share of the market and is likely to continue dominating the market during the forecast period.
- Among the application areas, surface mounting is expected to dominate the market during the forecast period.
- Surface mounting, also known as chip bonding, accounts for the highest share of the Asia-Pacific electronics adhesives industry.
- The major types of adhesives used in this application include mostly one-component systems, made from acrylics, epoxies, or urethane acrylates, and can be either electrically or thermally conductive.
- These adhesives used have superior physical and chemical quality which helps them to have a long shelf life, a high wet strength, rapid curing, strength, and flexibility.
- Hence, according to the above-mentioned reasons, surface mounting is likely to dominate the market studied during the forecast period.
- China accounts for the highest share of the total Asia-Pacific electronics adhesives market currently and is the biggest market both in terms of consumption and production of the electronic adhesives.
- The increasing urbanization, growing connectivity, combined with the usage of advanced technology in the manufacturing of automotive safety technologies and infotainment systems, is boosting the demand for printed circuit boards.This in turn is boosting the demand for electronic adhesives in the country.
- Additionally, the investments in the electronic industry in the country have growing consistently over the past few years. This is also driving the growth of electronic adhesives market in the country.
- Hence, owing tot he above-mentioned factors, China is expected to dominate the Asia-Pacific electronics adhesives market during the forecast period.
The Asia-Pacific electronics adhesives market is moderately consolidated as the market of the market share is divided among a few players. Some of the key players in the market include Henkel AG & Co. KGaA, Dow, H.B. Fuller Company, 3M, and BASF SE among others.
Additional Benefits:- The market estimate (ME) sheet in Excel format
- 3 months of analyst support
IBM Corporation
Oracle Corporation
Internap Corporation
Packet Inc. (An Equinix Inc. Company)
Scaleway Inc.
Amazon Web Services Inc
Rackspace Inc.
CenturyLink, Inc.
LightEdge Solutions, Inc
Please note: This publisher does offer titles that are created upon receipt of order. If you are purchasing a PDF Email Delivery option above, the report will take approximately 2 business days to prepare and deliver.
Table of Contents
140 Pages
- 1 INTRODUCTION
- 1.1 Study Assumptions
- 1.2 Scope of the Study
- 2 RESEARCH METHODOLOGY
- 3 EXECUTIVE SUMMARY
- 4 MARKET DYNAMICS
- 4.1 Drivers
- 4.1.1 Growing Technological Advancements in Manufacturing Electronic Adhesives
- 4.1.2 Other Drivers
- 4.2 Restraints
- 4.2.1 Volatility in Raw Material Prices
- 4.2.2 Regulations Related to the VOCs
- 4.2.3 Other Restraints
- 4.3 Industry Value-chain Analysis
- 4.4 Porter's Five Forces Analysis
- 4.4.1 Bargaining Power of Suppliers
- 4.4.2 Bargaining Power of Consumers
- 4.4.3 Threat of New Entrants
- 4.4.4 Threat of Substitute Products and Services
- 4.4.5 Degree of Competition
- 5 MARKET SEGMENTATION
- 5.1 Resin Type
- 5.1.1 Epoxy
- 5.1.2 Acrylics
- 5.1.3 Polyurethane
- 5.1.4 Other Resin Types
- 5.2 Application
- 5.2.1 Conformal Coatings
- 5.2.2 Surface Mounting
- 5.2.3 Encapsulation
- 5.2.4 Wire Tacking
- 5.2.5 Other Applications
- 5.3 Geography
- 5.3.1 Asia-Pacific
- 5.3.1.1 China
- 5.3.1.2 India
- 5.3.1.3 Japan
- 5.3.1.4 South Korea
- 5.3.1.5 ASEAN Countries
- 5.3.1.6 Rest of Asia-Pacific
- 6 COMPETITIVE LANDSCAPE
- 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
- 6.2 Market Share/Ranking Analysis**
- 6.3 Strategies Adopted by Leading Players
- 6.4 Company Profiles
- 6.4.1 3M
- 6.4.2 Arkema
- 6.4.3 Ashland
- 6.4.4 AVERY DENNISON CORPORATION
- 6.4.5 BASF SE
- 6.4.6 Beardow Adams
- 6.4.7 CHEMENCE
- 6.4.8 Covestro AG
- 6.4.9 Dow
- 6.4.10 H.B. Fuller Company
- 6.4.11 Henkel AG & Co. KGaA
- 6.4.12 Huntsman International LLC.
- 6.4.13 Sika AG
- 6.4.14 Illinois Tool Works Inc.
- 7 MARKET OPPORTUNITIES AND FUTURE TRENDS
- 7.1 Shift Towards Environment-friendly Water-based Adhesives
Pricing
Currency Rates
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