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Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024

Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024

“High adoption of SLP by leading OEMs to drive overall growth of substrate-like PCB market”
The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The substrate-like PCB market is driven by various factors, such as the high adoption of SLPs by leading OEMs, the surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs. However, higher setup costs associated with SLPs can hinder the growth of the market.

“Based on line/space, less than 25/25 µm line/space to witness highest CAGR during forecast period”
The line spacing of the copper track embedded into the PCB is important as it is directly related to the size of the PCB and eventually the size of the product. As miniaturization of the product has become an important factor in applications such as consumer electronics, medical, and computing and communications, the line spacing is expected to decrease further. With modified semi-additive method (mSAP), manufacturing smaller size PCBs can be achieved by reducing the track width, which ultimately makes it possible to have more number of electrical connections on the same area of the PCB. The PCB industry is striving continuously to improve the mSAP process capability and achieve unprecedented densities, which, in turn, helps fabricators to offer SLPs with line/space of less than 25/25 µm.

“Based on inspection technologies, automated optical shaping to grow at highest CAGR during forecast period”
AOS technology helps to remove excess copper and complete PCB tracks (patterns) on the SLP board where copper is missing. With this technology, PCB manufacturers can benefit from common problems observed on PCB boards such as short tracks and open tracks as this technology has the potential to remove the short tracks and connect the open tracks automatically. Due to the additional benefits of AOS as compared to other inspection technologies, it is expected that AOS will grow at the highest CAGR during the forecast period.

“APAC to record highest growth rate during forecast period”
APAC is an emerging market for substrate-like PCBs. APAC has become a global focal point for large investments and business expansion opportunities. More than 50% of the global mobile subscribers live in APAC—mostly in China and India. There has been a paradigm shift of users from 3G to 4G technology in this region. Key factors that drive the SLP market growth in APAC include the increasing adoption of smartphones, a growing number of internet users, rising demand for connectivity solutions, expansion of telecommunications infrastructure, and expanding bandwidth-intensive applications in the region. As most of the smartphone providers are from the APAC region, it is expected that there would be a major demand for SLP in the APAC region during the forecast period. Taiwan has become one of the center places for the development of SLP technology.

In-depth interviews were conducted with chief executive officers (CEOs), marketing directors, other innovation and technology directors, and executives from various key organizations operating in the substrate-like PCB marketplace.

By Company Type: Tier 1 = 35%, Tier 2 =45%, and Tier 3 = 20%
By Designation: C-Level Executives = 35%, Directors = 25%, and Others = 40%
By Region: North America = 30%, Europe = 20%, APAC = 45%, RoW = 5%

The substrate-like PCB market comprises major players, namely, AT & S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); and LG Innotek (South Korea).

The study includes an in-depth competitive analysis of these key players in the substrate-like PCB market, with their company profiles, recent developments, and key market strategies.

Research Coverage:
The report defines, describes, and forecasts the substrate-like PCB market based on line/space, inspection technologies, application, and geography. It provides detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the growth of the substrate-like PCB market. It also analyzes the competitive developments such as joint ventures, collaborations, agreements, contracts, partnerships, mergers and acquisitions, and product launches carried out by the key players to grow in the market.

Key Benefits of Buying the Report
The report will help the market leaders/new entrants in this market with information on the closest approximations of the revenue numbers for the overall substrate-like PCB market and the subsegments. This report will help stakeholders understand the competitive landscape and gain more insights to better position their businesses and to plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, challenges, and opportunities.


  • INTRODUCTION
    • STUDY OBJECTIVES
    • DEFINITION
    • STUDY SCOPE
      • MARKETS COVERED
    • YEARS CONSIDERED
    • CURRENCY
    • STAKEHOLDERS
  • RESEARCH METHODOLOGY
    • RESEARCH DATA
      • SECONDARY DATA
      • PRIMARY DATA
    • MARKET SIZE ESTIMATION
      • BOTTOM-UP APPROACH
      • TOP-DOWN APPROACH
    • MARKET BREAKDOWN AND DATA TRIANGULATION
    • RESEARCH ASSUMPTIONS
  • EXECUTIVE SUMMARY
  • PREMIUM INSIGHTS
    • ATTRACTIVE OPPORTUNITIES IN SUBSTRATE-LIKE PCB MARKET
    • SUBSTRATE LIKE PCB MARKET IN APAC, BY APPLICATION AND COUNTRY
    • COUNTRY-WISE SUBSTRATE-LIKE PCB MARKET GROWTH RATE
  • MARKET OVERVIEW
    • INTRODUCTION
    • MARKET DYNAMICS
      • DRIVERS
      • RESTRAINTS
      • OPPORTUNITIES
      • CHALLENGES
  • SUBSTRATE-LIKE PCB MARKET, BY LINE/SPACE
    • INTRODUCTION
      • Table SUBSTRATE-LIKE PCB MARKET, BY LINE/SPACE, 2017–2024 (USD MILLION)
    • 25/25ìM AND 30/30ìM LINE/SPACE
      • 25/25ìM & 30/30ìM LINE/SPACE SEGMENT DOMINATE SLP MARKET, IN TERMS OF SIZE, OWING TO THE RISING ADOPTION OF MINIATURE DEVICES
        • Table SUBSTRATE LIKE PCB MARKET FOR 25/25 AND 30/30 ìM LINE/SPACE, BY INSPECTION TECHNOLOGY, 2017–2024 (USD MILLION)
        • Table SLP MARKET FOR 25/25 AND 30/30 ìM LINE/SPACE, BY APPLICATION, 2017–2024 (USD MILLION)
    • LESS THAN 25/25 ìM LINE/SPACE
      • SUBSTANTIAL GROWTH RATE OF MARKET FOR SLPS WITH LESS THAN 25/25 ìM LINE/SPACE DUE TO ADOPTION OF ADDITIVE PROCESS IN MANUFACTURING THESE SLPS
        • Table SUBSTRATE-LIKE PCB MARKET FOR LESS THAN 25/25 LINE/SPACE, BY INSPECTION TECHNOLOGY, 2020–2024 (USD MILLION)
        • Table SLP MARKET FOR LESS THAN 25/25 ìM LINE/SPACE, BY APPLICATION, 2020–2024 (USD MILLION)
  • SUBSTRATE-LIKE PCB MARKET, BY APPLICATION
    • INTRODUCTION
      • Table SUBSTRATE-LIKE PCB MARKET, BY APPLICATION, 2017–2024 (USD MILLION)
    • CONSUMER ELECTRONICS
      • CONSUMER ELECTRONICS EXPECTED TO HOLD LARGEST SIZE OF SLP MARKET OWING TO ADOPTION OF SLP BY LEADING ORIGINAL EQUIPMENT MANUFACTURERS IN THEIR SMARTPHONES
        • Table SUBSTRATE-LIKE PCB MARKET FOR CONSUMER ELECTRONICS APPLICATION, BY REGION, 2017–2024 (USD MILLION)
        • Table SUBSTRATE-LIKE PCB MARKET FOR CONSUMER ELECTRONICS APPLICATION, BY LINE/SPACE, 2017–2024 (USD MILLION)
    • COMPUTING AND COMMUNICATIONS
      • INCREASING ADOPTION OF ADVANCED COMMUNICATION TECHNOLOGIES WOULD LEAD TO HIGH DEMAND FOR SLP FOR COMPUTING AND COMMUNICATIONS APPLICATIONS
        • Table SUBSTRATE-LIKE PCB MARKET FOR COMPUTING AND COMMUNICATIONS APPLICATION, BY REGION, 2019–2024 (USD MILLION)
        • Table SUBSTRATE-LIKE PCB MARKET FOR COMPUTING & COMMUNICATIONS APPLICATION, BY LINE/SPACE, 2019–2024 (USD MILLION)
    • AUTOMOTIVE
      • INCREASING DEMAND FOR MULTILAYER PRINTED CIRCUIT BOARDS IN AUTOMOTIVE ELECTRONICS WILL SPUR SLP MARKET GROWTH
        • Table SUBSTRATE-LIKE PCB MARKET FOR AUTOMOTIVE APPLICATION, BY REGION, 2019–2024 (USD MILLION)
        • Table SUBSTRATE-LIKE PCB MARKET FOR AUTOMOTIVE APPLICATION, BY LINE/SPACE, 2019–2024 (USD MILLION)
    • MEDICAL
      • RISING TREND OF MINIATURIZATION OF ADVANCED MEDICAL EQUIPMENT AND DEVICES EXPECTED TO PROVIDE OPPORTUNITIES FOR SLP MARKET PLAYERS
        • Table SUBSTRATE-LIKE PCB MARKET FOR MEDICAL APPLICATION, BY REGION, 2020–2024 (USD MILLION)
        • Table SUBSTRATE-LIKE PCB MARKET FOR MEDICAL APPLICATION, BY LINE/SPACE, 2020–2024 (USD MILLION)
    • INDUSTRIAL
      • GROWING TREND OF IIOT AND INDUSTRY 4.0 TO DRIVE DEMAND FOR SLP IN INDUSTRIAL APPLICATIONS
        • Table SUBSTRATE-LIKE PCB MARKET FOR INDUSTRIAL APPLICATION, BY REGION, 2020–2024 (USD MILLION)
        • Table SUBSTRATE-LIKE PCB MARKET FOR INDUSTRIAL APPLICATION, BY LINE/SPACE, 2020–2024 (USD MILLION)
    • MILITARY, DEFENSE, AND AEROSPACE
      • NORTH AMERICA TO LEAD SLP MARKET FOR MILITARY, DEFENSE AND AEROSPACE APPLICATIONS DUE TO INCREASING DEMAND FOR HIGH-PERFORMANCE PRINTED CIRCUIT BOARDS
        • Table SUBSTRATE-LIKE PCB MARKET FOR MILITARY, DEFENSE, AND AEROSPACE APPLICATION, BY REGION, 2020–2024 (USD MILLION)
        • Table SUBSTRATE-LIKE PCB MARKET FOR MILITARY, DEFENSE, AND AEROSPACE APPLICATION, BY LINE/SPACE, 2020–2024 (USD MILLION)
  • SUBSTRATE-LIKE PCB MARKET, BY INSPECTION TECHNOLOGY
    • INTRODUCTION
      • Table SUBSTRATE-LIKE PCB MARKET, BY INSPECTION TECHNOLOGY, 2017–2024 (USD MILLION)
    • AUTOMATED OPTICAL INSPECTION (AOI)
      • AOI TECHNOLOGY TO HOLD LARGEST SHARE OF SLP MARKET OWING TO INCREASED INTEREST OF SLP MANUFACTURERS IN ADOPTING ADVANCED INSPECTION TECHNOLOGIES
        • Table SUBSTRATE-LIKE PCB MARKET FOR AUTOMATIC OPTICAL INSPECTION, BY LINE/SPACE, 2017–2024 (USD MILLION)
    • DIRECT IMAGING (DI) OR LASER DIRECT IMAGING (LDI)
      • STURDY GROWTH OF DI IN SLP MARKET BASED ON INSPECTION TECHNOLOGY AS IT OFFERS OPTIMAL QUALITY AT HIGH SPEED
        • Table SUBSTRATE-LIKE PCB MARKET FOR DIRECT IMAGING, BY LINE/SPACE, 2017–2024 (USD MILLION)
    • AUTOMATED OPTICAL SHAPING (AOS)
      • SLP MARKET FOR AOS TECHNOLOGY TO GROW AT HIGHEST CAGR DUE TO ITS HIGH POTENTIAL FOR FINDINGS FAULTS AND SHAPING COPPER TRACKS
        • Table SUBSTRATE-LIKE PCB MARKET FOR AUTOMATED OPTICAL SHAPING, BY LINE/SPACE, 2017–2024 (USD MILLION)
  • GEOGRAPHIC ANALYSIS
    • INTRODUCTION
      • Table SUBSTRATE-LIKE PCB MARKET, BY REGION, 2017–2024 (USD MILLION)
    • NORTH AMERICA
      • Table SUBSTRATE-LIKE PCB MARKET IN NORTH AMERICA, BY COUNTRY, 2017–2024 (USD MILLION)
      • Table SUBSTRATE-LIKE PCB MARKET IN NORTH AMERICA, BY APPLICATION, 2017–2024 (USD MILLION)
      • US
      • CANADA
      • MEXICO
    • EUROPE
      • Table SUBSTRATE-LIKE PCB MARKET IN EUROPE, BY COUNTRY, 2019–2024 (USD MILLION)
      • Table SUBSTRATE-LIKE PCB MARKET IN EUROPE, BY APPLICATION, 2019–2024 (USD MILLION)
      • GERMANY
      • UK
      • FRANCE
      • ITALY
      • REST OF EUROPE
    • ASIA PACIFIC
      • Table SUBSTRATE-LIKE PCB MARKET IN APAC, BY COUNTRY, 2018–2024 (USD MILLION)
      • Table SUBSTRATE-LIKE PCB MARKET IN APAC, BY APPLICATION, 2018–2024 (USD MILLION)
      • CHINA
      • JAPAN
      • SOUTH KOREA
      • TAIWAN
      • REST OF APAC
    • ROW
      • Table SUBSTRATE-LIKE PCB MARKET IN ROW, BY REGION, 2019–2024 (USD MILLION)
      • Table SUBSTRATE-LIKE PCB MARKET IN ROW, BY APPLICATION, 2019–2024 (USD MILLION)
      • MIDDLE EAST AND AFRICA
      • SOUTH AMERICA
  • COMPETITIVE LANDSCAPE
    • OVERVIEW
    • RANKING ANALYSIS OF MARKET PLAYERS
      • Table RANKING ANALYSIS OF MARKET PLAYERS, 2017
      • PRODUCT LAUNCHES/DEVELOPMENTS
        • Table PRODUCT LAUNCHES, 2016–2018
      • AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS
        • Table AGREEMENTS, COLLABORATIONS, PARTNERSHIPS, AND CONTRACTS, 2017–2018
      • ACQUISITIONS
        • Table ACQUISITIONS, 2018
      • EXPANSIONS
        • Table EXPANSIONS, 2017–2018
  • COMPANY PROFILES
    • OVERVIEW
    • KEY PLAYERS
      • KINSUS INTERCONNECT TECHNOLOGY
      • IBIDEN
      • COMPEQ
      • UNIMICRON
      • AT&S
      • TTM TECHNOLOGIES
      • SAMSUNG ELECTRO-MECHANICS
      • KOREA CIRCUIT
      • ZHEN DING TECHNOLOGY
    • OTHER PLAYERS
      • DAEDUCK GDS COMPANY
      • ISU PETASYS
      • TRIPOD TECHNOLOGY CORP
      • LG INNOTEK
  • APPENDIX
    • DISCUSSION GUIDE
    • KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
    • RELATED REPORTS
    • AUTHOR DETAILS

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