Global Embedded Die Packaging Market, 2024-2030

Embedded die packaging involves embedding components inside the substrate through a multi-step manufacturing process. There are two types of packaging technologies, namely, Flip-Chip Chip Scale Packaging (FC CSP) and Wafer Level Chip Scale Packaging (WL CSP), which have shown interesting growth rates in the recent past. This technology is growing rapidly and is expected to maintain this trend in the near future due to additional features, such as considerable cost reduction of whole packaging process, more compact chips, and reduced power loss of the system.

The global embedded die packaging market research report sheds light on the market circumstances by carrying out primary and secondary research for more than 320 hours. As per the report, the global embedded die packaging market is growing at a fast pace and increasing its geographical footprint rapidly. The global embedded die packaging market is valued at US $ xx million dollars in 2018 which is forecast to grow at CAGR of xx% and reach a massive US $ xx million dollars by the end of 2023 in value.

One of the major drivers for this market is the growing miniaturization of devices. The miniaturization of electronic circuits in electronic devices is driving the demand for embedded die packaging. Increase in number of portable electronic devices, rise in application in healthcare and automotive devices, and advantages over other advanced packaging technologies. However, requirement of high cost of these chips restrains the market growth restrains the market growth.

Further, one of the major factors hindering the growth of this market is the technical challenges that are negatively affecting the market’s growth. Embedded die packaging faces technical challenges including bond pad bumping, and end-of-life recycling.

Some of the major market players in the global embedded die packaging market are, Advanced Semiconductor Engineering (ASE) Technology, Amkor Technology , Shinko Electric Industries , TDK.

Research Methodology

The research process includes the market segmentation of the global embedded die packaging market, identifying the growth determinants of every market segment and market forecasts. The primary source from the supply side includes industry experts, CEOs, vice president, directors, and key executives of various industry players. The primary source from demand side includes marketing manager and experts from various application industries. Market Krystal held more than 40 interviews for this study, details of which are mentioned:

By company type:

Manufacturers (40%), Suppliers (20%), Consumers (20%), Researchers (10%), Independent industry consultant (10%)

By geography:

North America (25%), Asia (40%), Europe (20%), Rest of the World (15%)

By designation:

Top level (40%), Operation level (20%), Mid-level (40%)

Contents of the report:

• Insights on the global embedded die packaging industry dynamics
• Estimation of the present global embedded die packaging market size in terms of value and volume
• Global embedded die packaging market breakup based on type and application
• Substantiated global embedded die packaging market forecast for the next five years.
• In depth analysis of the leading companies working across different nodes of global embedded die packaging industry value chain