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Electronics Parts Forward Logistics Market in APAC 2022-2026

Publisher TechNavio
Published Jul 15, 2022
Length 120 Pages
SKU # INF17311171

Description

Electronics Parts Forward Logistics Market in APAC 2022-2026

Technavio has been monitoring the electronics parts forward logistics market in APAC and it is poised to grow by $ 1.47 bn during 2022-2026, decelerating at a CAGR of 8.5% during the forecast period. Our report on the electronics parts forward logistics market in APAC provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis of the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing electronic parts trade between China and India, increasing hardware spending in APAC, and growing government support for the logistics industry in China.

The electronics parts forward logistics market in APAC analysis includes the end-user segment and geographic landscape.

Technavio's electronics parts forward logistics market in APAC is segmented as below:

By End-user
  • Industrial
  • Consumer electronics
  • Others
By Geographical Landscape
  • China
  • Japan
  • Rest of APAC
This study identifies the penetration of blockchain technology in logistics supply chains as one of the prime reasons driving the electronics parts forward logistics market growth in APAC during the next few years. Also, the growing requirement for green logistics and an increase in mergers and acquisitions activities will lead to sizable demand in the market.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on the electronics parts forward logistics market in APAC covers the following areas:
  • Electronics parts forward logistics market sizing
  • Electronics parts forward logistics market forecast
  • Electronics parts forward logistics market industry analysis
Technavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading electronics parts forward logistics market vendors in APAC that include AP Moller Maersk AS, CMA CGM Group, Deutsche Bahn AG, Deutsche Post DHL Group, DSV Panalpina AS, Expeditors International of Washington Inc., FedEx Corp., Hitachi Transport System Ltd., Kuehne Nagel International AG, Seashell Logistics Pvt Ltd, United Parcel Service Inc., and XPO Logistics Inc. Also, the electronics parts forward logistics market in APAC analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.

Table of Contents

120 Pages
    • Market overview
    • Market ecosystem
    • Market definition
    • Market segment analysis
    • Market size 2021
    • Market outlook: Forecast for 2021-2026
    • Five forces summary
    • Bargaining power of buyers
    • Bargaining power of suppliers
    • Threat of new entrants
    • Threat of substitutes
    • Threat of rivalry
    • Market condition
    • Market segments
    • Comparison by End-user
    • Industrial - Market size and forecast 2021-2026
    • Consumer electronics - Market size and forecast 2021- 2026
    • Others - Market size and forecast 2021-2026
    • Market opportunity by End-user
    • Customer landscape overview
    • Geographic segmentation
    • Geographic comparison
    • China - Market size and forecast 2021-2026
    • Japan - Market size and forecast 2021-2026
    • Rest of APAC - Market size and forecast 2021-2026
    • Market opportunity by geography
    • Market drivers
    • Market challenges
    • Impact of drivers and challenges
    • Market trends
    • Overview
    • Vendor landscape
    • Landscape disruption
    • Industry risks
    • Vendors covered
    • Market positioning of vendors
    • CMA CGM Group
    • Deutsche Bahn AG
    • Deutsche Post DHL Group
    • DSV Panalpina AS
    • Expeditors International of Washington Inc.
    • FedEx Corp.
    • Hitachi Transport System Ltd.
    • Kuehne Nagel International AG
    • United Parcel Service Inc.
    • XPO Logistics Inc.
    • Scope of the report
    • Inclusions and exclusions checklist
    • Currency conversion rates for US$
    • Research methodology
    • List of abbreviations
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