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Worldwide Semiconductor Advanced Packaging Technology Market Forecast and Analysis, 2023–2028

Publisher IDC
Published Nov 16, 2023
Length 13 Pages
SKU # IDC18331087

Description

Worldwide Semiconductor Advanced Packaging Technology Market Forecast and Analysis, 2023–2028


This IDC study provides a comprehensive market analysis including key vendors, technology trends, application areas, and competitive scenarios. It is worth mentioning that large enterprises such as TSMC, Samsung, Intel, and ASE occupy an important position in the advanced packaging market and play a core role in the field of advanced packaging by virtue of technologies including flip chip (FC), system-in-package (SiP), fan in/fan out (FI/FO), 2.5D/3D, chiplet, and hybrid bonding.According to Galen Zeng, senior research manager at IDC, "Against the backdrop of semiconductor technology development as a long-term trend and higher requirements for chip function and performance, advanced packaging technologies are becoming increasingly important, as they can integrate multiple chips and components, including digital chips, analog chips, memories, and sensors in a single package. The closer combination of chips with other components in limited space reduces the interconnection distance, thereby improving the data transmission speed and overall performance. Advanced packaging complements advanced processes, pushing further the boundaries of Moore's law and promoting a qualitative leap in the semiconductor industry."

Please Note: Extended description available upon request.

Table of Contents

13 Pages
IDC Market Forecast Figure
Executive Summary
Advice for Technology Suppliers
Market Forecast
Market Trends
Types of Participating Vendors and Industry Trends
Market Context
Drivers and Inhibitors
Drivers
Policy and Industry Collaboration for Promoting Advanced Packaging Technologies
Market Competition and Cooperation
Versatility of Advanced Packaging technology
Inhibitors
Technological Complexity and Huge Demand for R&D Investment
Market Competition and Price Pressure
Significant Market Developments
Main Applications
TSMC's Chip-on-Wafer-on-Substrate
Changes from Prior Forecast
Market Definition
Methodology
Related Research
How Do Licenses Work?
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