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Semiconductor Advanced Packaging Technology and Market Assessment, 2023

Publisher IDC
Published Nov 16, 2023
Length 15 Pages
SKU # IDC18331088

Description

Semiconductor Advanced Packaging Technology and Market Assessment, 2023


This IDC Technology Assessment delves into the major suppliers, technologies, applications, competition and cooperation, and markets of advanced semiconductor packaging. The main suppliers mentioned include Taiwan Semiconductor Manufacturing Company Limited (TSMC), Samsung, Intel, and ASE Group, and the technologies include flip chip, system-in-package (SiP), fan in/fan out, 2.5D/3D, chiplet, and hybrid bonding. The applications include consumer electronics, computing, communications, and automobiles, and the coopetition and cooperation parties include outsourced semiconductor assembly and testing (OSAT), integrated device manufacturers (IDM), and foundry. The market segment analyzes the overall development of the advanced packaging market.“With the continuous development of the semiconductor industry and increasing requirements for chip performance, advanced packaging technologies have become key and can carry on the development of traditional packaging. They allow the integration of multiple functional components, such as chips, memories, and sensors in one package, to realize more functions in limited space and improve the performance of chips that have become one of the important ways to continue Moore’s law,” says Galen Zeng, senior research manager, IDC.

Please Note: Extended description available upon request.

Table of Contents

15 Pages
IDC Opinion
In This Study
Methodology
Situation Overview
Market Snapshot
Advanced Packaging Technologies of Major Manufacturers
TSMC
Samsung
Intel
ASE Group
Future Outlook
Chiplet
Hybrid Bonding
Essential Guidance
Learn More
Related Research
Synopsis

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