
The Market for Thermal Management Technologies
Description
The Market for Thermal Management Technologies
Report Scope:
The scope of this report is broad, covering several product areas. The individual materials, hardware and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and they are projected through 2028. The application sections feature forecasts for the most important applications by product.
The report also offers an in-depth analysis of the competitive landscape within the thermal management technologies market, focusing on key dynamics that drive success. It examines critical factors, such as research and development capabilities, and the influence of ecosystems and partnerships. The report includes profiles of thermal management manufacturers, providing valuable insights into their strategies and offerings. The report also assesses the impact of the COVID-19 pandemic on the market, considering the challenges and opportunities that have emerged as a result.
The report addresses the global market for thermal management products during the period from 2022 through 2028, including
Thermal management hardware.
Thermal management software.
Thermal management interface products.
Thermal management substrates.
Thermal management application areas.
Report Includes:
97 data tables and 39 additional tables
An overview of the global market for thermal management technologies
Analyses of the global market trends, with historic market revenue data (sales figures) for 2022, estimates for 2023, forecasts for 2024 and 2026, and projection of compound annual growth rates (CAGRs) through 2028
Estimate of the actual market size and revenue forecast for thermal management technologies market, and corresponding market share analysis based on product type, application, device type, and geographic region
Analysis of the market dynamics, including drivers, inhibitors and opportunities, along with insights into the regulatory environment
Description of concept development of and hardware test for effective thermal designs, and power dissipation and environmental factors affecting thermal management systems
Information on rapid prototyping, thermal sensing technologies, new manufacturing processes and developments in thermal management software such as computational fluid design and heat transfer
A look at environmental, social and corporate governance (ESG) developments, along with an analysis of relevant patents, mergers and acquisitions (M&A), venture fundings and emerging technologies
Profiles of major players in the industry
Companies Mentioned
3M
AAVID THERMALLOY
AI TECHNOLOGY
ALCOA CORP.
ALTAIR ENGINEERING INC.
AMETEK INC.
Amkor Technology
ANSYS INC.
Asetek Inc.
Chomerics (Division of Parker Hannifin)
Comair Rotron
Cool Innovations
Cooler Master Technology Inc.
COOLIT SYSTEMS
CPS TECHNOLOGIES CORP.
Daat Research Corp.
Dynatron Corp.
Gentherm
HENKEL AG & CO. KGAA
HEXAGON AB
HONEYWELL INTERNATIONAL INC.
LAIRD TECHNOLOGIES INC.
LORD CORP.
MASTER BOND INC.
MATERION CORP.
MORGAN TECHNICAL CERAMICS
Motivair Corp.
STATS ChipPAC Ltd.
Table of Contents
243 Pages
- Chapter 1 Introduction
- Study Goals and Objectives
- Reasons for Doing This Study
- Scope of Report
- What's New in This Update?
- Research Methodology
- Information Sources
- Geographic Breakdown
- Chapter 2 Summary and Highlights
- Market Outlook
- Market Summary
- Chapter 3 Market Overview
- Overview
- Examples of Passive Cooling Methods
- Examples of Active Cooling Methods
- Thermal Management Technique Types
- Air Cooling, Liquid Cooling and Two-Phase Cooling
- Conduction Cooling
- Importance of Thermal Management Techniques
- Importance of Thermal Management
- Power Dissipation
- Environmental and Regulatory Factors
- Effective Thermal Design for Electronic Systems
- Concept Development
- Detailed Design
- Hardware Test
- Other Developments
- Packaging Designed for Thermal Performance
- Thermal Test Dies
- Thermal Sensing Technologies
- New Manufacturing Processes
- Rapid Prototyping and Fast Delivery of Final Product
- Thermal Management of Outdoor Enclosures
- Portable Device
- Light-Emitting Diodes
- Data Centers
- High-Performance Computing
- High-Performance Embedded Computers
- Thermal Management Product Types
- Value Chain Analysis
- Porter's Five Forces Analysis
- Bargaining Power of Suppliers
- Bargaining Power of Consumers
- Threat of New Entrants
- Competitive Rivalry
- Threat of Substitutes
- Impact of COVID-19 on the Thermal Management Technologies Market
- Positive Impact
- Negative Impact
- Post-COVID-19 Scenario
- Impact of Russia-Ukraine War on the Thermal Management Technologies Market
- Chapter 4 Thermal Management Technologies: Market Dynamics
- Market Dynamics
- Market Drivers
- Market Restraints
- Market Opportunities
- Chapter 5 Market Breakdown by Product Type
- Overview
- Hardware
- Main Types of Thermal Management Hardware
- Heat Sinks
- Fans and Blowers
- Heat Pipes
- Fan Sinks
- Cold Plates
- Other Cooling Hardware Types
- Software
- Main Thermal Management Software Types
- Computational Fluid Design
- Computational Heat Transfer
- Circuit Design
- Power Management
- Other Software
- Thermal Management Interface Materials
- Thermal Interface Materials
- Main Thermal Interface Product Types
- Thermal Greases
- Adhesive Film and Thermal Tapes
- Thermal Compounds
- Thermal Pads
- Epoxy
- Phase Change Materials
- Other Materials
- Technology Trends in Thermal Interface Materials
- Substrate
- Main Thermal Substrate Types
- Thermally Enhanced Packages
- Heat Spreaders
- Services
- Main Service Types
- Installation and Calibration
- Optimization and Post-Sales Support
- Chapter 6 Market Breakdown by Application
- Overview
- Consumer Electronics
- Telecommunications
- Data Centers
- Automotive
- Industrial/Military Electronics
- Healthcare Products
- Renewable Energy
- Others
- Chapter 7 Market Breakdown by Device
- Overview
- Convection Cooling Devices
- Conduction Cooling Devices
- Hybrid Cooling Devices
- Chapter 8 Market Breakdown by Region
- Overview
- North America
- U.S.
- Canada
- Europe
- Germany
- The U.K.
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
- Rest of the World
- Chapter 9 ESG Development
- Key ESG Issues in the Thermal Management Industry
- Thermal Management Industry ESG Performance Analysis
- Case Study
- Concluding Remarks from BCC Research
- Chapter 10 Emerging Technologies
- Overview
- Emerging Technologies in the Market
- Nanostructured Materials
- Smart Fibers and Textiles for Personal Thermal Management
- Thermal Transistor
- Battery Thermal Management
- Chapter 11 Patent Analysis
- Overview
- Recently Granted Key Patents
- Chapter 12 Merger and Acquisition and Funding Outlook
- Merger and Acquisition Analysis
- Chapter 13 Competitive Landscape
- Top Companies
- Strategic Analysis
- Key Product Launches and Developments
- Key Acquisitions and Expansions
- Key Collaborations and Partnerships
- Chapter 14 Company Profiles
- Thermal Management Solutions Providers
- 3M
- GENTHERM
- HONEYWELL INTERNATIONAL INC.
- LAIRD TECHNOLOGIES INC.
- SPECTRA-MAT INC.
- Thermal Management Hardware Providers
- AAVID THERMALLOY
- ALCOA CORP.
- ASETEK INC.
- COMAIR ROTRON
- COOL INNOVATIONS
- COOLIT SYSTEMS
- CPS TECHNOLOGIES CORP.
- DYNATRON CORP.
- MOTIVAIR CORP.
- Thermal Management Software Providers
- ALTAIR ENGINEERING INC.
- ANSYS INC.
- DAAT RESEARCH CORP.
- HEXAGON AB
- NETZSCH-GERATEBAU GMBH
- Thermal Management Interface Materials Providers
- AI TECHNOLOGY
- AMETEK INC.
- CHOMERICS (DIVISION OF PARKER HANNIFIN)
- HENKEL AG & CO. KGAA
- LORD CORP.
- MASTER BOND INC.
- Thermal Management Substrates Providers
- AMKOR TECHNOLOGY
- COOLER MASTER TECHNOLOGY INC.
- MATERION CORP.
- MORGAN TECHNICAL CERAMICS
- STATS CHIPPAC LTD.
- Chapter 15 Appendix: Abbreviations/Acronyms
Pricing
Currency Rates
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