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Global Chiplets Market

Publisher BCC Research
Published Dec 09, 2024
Length 84 Pages
SKU # WA19440609

Description

Global Chiplets Market



Report Scope

This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs). The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.

The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024–2029.

Report Includes

In-depth assessment of the global market for semiconductor chiplets

Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029

Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region

Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors

Analysis of the industry structure, including companies’ market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook

Company profiles

Companies Mentioned

ACHRONIX SEMICONDUCTOR CORP.
ADVANCED MICRO DEVICES INC.
BROADCOM
GLOBALFOUNDRIES INC.
IBM CORP.
INTEL CORP.
NVIDIA CORP.
RANOVUS
SAMSUNG
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

Table of Contents

84 Pages
Chapter 1 Executive Summary
Market Outlook
Scope of the Report
Market Summary
Chapter 2 Market Overview
Overview
Macroeconomic Factors
Advanced Packaging Technologies
Geopolitical Tensions
Outlook
Chapter 3 Market Dynamics
Overview
Market Drivers
High-Performance Computing
5G's Growing Need for Chiplets
Market Restraints/Challenges
Shortage of Skilled Labor
Global Political and Financial Crises
Market Opportunities
Continuing Investment in the Semiconductor Industry
Use in Advanced Driver-Assistance Systems (ADAS)
Chapter 4 Regulatory Landscape
Overview
North America
Asia-Pacific
Europe
RoW
Chapter 5 Emerging Technologies
Emerging Technologies
Heterogeneous Integration
3D Integration
Advanced Packaging
Co-Packaged Optics
Chiplet-Based Systems-on-Chip
Chapter 6 Market Segmentation Analysis
Segmentation Breakdown
Market Breakdown by Processor
CPUs
Graphics Processing Units
Field-Programmable Gate Arrays
AI-ASIC Coprocessors
Application Processing Units
Market Breakdown by Packaging Technology
2.5D/3D
System-in-Package
Wafer-Level Chip-Scale Packaging
Flip Chip Chip-Scale Package
Flip Chip Ball Grid Array
Fan-Out
Market Breakdown by End-User Industry
Enterprise Electronics
Consumer Electronics
Industrial Automation
Automotive
Healthcare
Military and Aerospace
Other End-User Industries
Geographical Breakdown
Market Breakdown by Region
North America
Europe
Asia-Pacific
Rest of the World
Chapter 7 Competitive Landscape
Market Ecosystem Analysis
Analysis of Leading Companies
Strategic Analysis
Recent Developments
Chapter 8 Appendix
Research Methodology
References
Abbreviations
Company Profiles
ACHRONIX SEMICONDUCTOR CORP.
ADVANCED MICRO DEVICES INC.
BROADCOM
GLOBALFOUNDRIES INC.
IBM CORP.
INTEL CORP.
NVIDIA CORP.
RANOVUS
SAMSUNG
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

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