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Global 3D Semiconductor Packaging Market to 2027

Publisher QualiKet Research
Published Feb 02, 2022
Length 179 Pages
SKU # QUA17148782

Description

Global 3D Semiconductor Packaging Market to 2027

Global 3D Semiconductor Packaging Market to 2027

Global 3D Semiconductor Packaging Market Introduction

3D semiconductor packaging is the type of advanced packaging technology of semiconductor chips into these two or more layers of active electronic components are stacked with each other. Reduced space consumption, better overall performance, decreased power loss, and enhanced efficiency are the main advantages of 3D semiconductor packaging.

Global 3D Semiconductor Packaging Market Drivers

Increase in demand for 3D semiconductor devices with higher capacity as well as lesser storage is expected to boost the global 3D semiconductor packaging market growth. Furthermore, higher demand for consumer electronic products is expected to propel the growth of global 3D semiconductor packaging market. Moreover, rise in usage of smartphones, tablets, wearable devices, and other connected consumer goods will have the positive impact on global 3D semiconductor packaging market growth.

Global 3D Semiconductor Packaging Market Restraints

However, higher level of integration results in thermal issues is expected to hamper the growth of global 3D semiconductor packaging market.

Global 3D Semiconductor Packaging Market Segmentation

Global 3D Semiconductor Packaging Market is segmented into technology such as 3D Fan out Based, 3D Package on Package, 3D Through Silicon Via, and 3D Wire Bonded, by material such as Die Attach Material, Ceramic Package, Encapsulation Resin, Leadframe, Bonding Wire, and Organic Substrate. Further, Global 3D Semiconductor Packaging Market is segmented into end user such as IT & Telecommunication, Healthcare, Automotive, Aerospace & Defense, and Electronics.

Also, Global 3D Semiconductor Packaging Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East and Africa.

Global 3D Semiconductor Packaging Market Key Players

Various key players are discussed in this report such as Suss Microtec AG, ASE Group, Siliconware Precision Industries Co., Ltd Stmicroelectronics N.V, Taiwan Semiconductor Manufacturing Company Ltd, Intel Corporation, Qualcomm Technology Inc, International Business Machine Corporation (IBM), Jiangsu Changjiang Electronics Technology Co. LTD, and Amkor Technology Inc.

Global 3D Semiconductor Packaging Market Taxonomy

By Technology
  • 3D Fan out Based
  • 3D Package on Package
  • 3D Through Silicon Via
  • 3D Wire Bonded
By Material
  • Die Attach Material
  • Ceramic Package
  • Encapsulation Resin
  • Leadframe
  • Bonding Wire
  • Organic Substrate
By End User
  • IT & Telecommunication
  • Healthcare
  • Automotive
  • Aerospace & Defense
  • Electronics
By Region
  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East and Africa

Table of Contents

179 Pages
1. Executive Summary
1.1. Market Taxonomy
2. Global 3 D Semiconductor Packaging Market Demand (in Value or Size in US$ Mn) Analysis and Forecast
3. Market Background
3.1. Forecast Factor
3.2. Market Dynamics
3.2.1. Drivers
3.2.2. Challenges
3.2.3. Trends
4. Global 3 D Semiconductor Packaging Market Snapshot
5. Global 3 D Semiconductor Packaging Market Analysis, By Technology
5.1. Y-o-Y Growth Comparison, By Technology
5.2. Global 3 D Semiconductor Packaging Market Share Analysis, By Technology
5.3. Global 3 D Semiconductor Packaging Market Size and Forecast, By Technology
5.3.1 3 D Fan Out Based
5.3.2 3 D Package on Package
5.3.3 3 D Through Silicon Via
5.3.4 3 D Wire Bonded
6. Global 3 D Semiconductor Packaging Market Analysis, By Material
6.1. Y-o-Y Growth Comparison, By Material
6.2. Global 3 D Semiconductor Packaging Market Share Analysis, By Material
6.3. Global 3 D Semiconductor Packaging Market Size and Forecast, By Material
6.3.1 Die Attach Material
6.3.2 Ceramic Package
6.3.3 Encapsulation Resin
6.3.4 Leadframe
6.3.5 Bonding Wire
6.3.6 Organic Substrate
7. Global 3 D Semiconductor Packaging Market Analysis, By End User
7.1. Y-o-Y Growth Comparison, By End User
7.2. Global 3 D Semiconductor Packaging Market Share Analysis, By End User
7.3. Global 3 D Semiconductor Packaging Market Size and Forecast, By End User
7.3.1 IT & Telecommunication
7.3.2 Healthcare
7.3.3 Automotive
7.3.4 Aerospace & Defense
7.3.5 Electronics
8. Global 3 D Semiconductor Packaging Market Analysis, By Region
8.1. Y-o-Y Growth Comparison, By Region
8.2. Global 3 D Semiconductor Packaging Market Share Analysis, By Region
9. North America 3 D Semiconductor Packaging Market Analysis and Forecast (2017-2027)
9.1 Introduction
9.2 North America 3 D Semiconductor Packaging Market Analysis, By Technology
9.3 North America 3 D Semiconductor Packaging Market Analysis, By Material
9.4 North America 3 D Semiconductor Packaging Market Analysis, By End User
9.5 North America 3 D Semiconductor Packaging Market Analysis, By Country
9.5.1 USA
9.5.2 Canada
9.5.3 Mexico
10. Europe 3 D Semiconductor Packaging Market Analysis and Forecast (2017-2027)
10.1 Introduction
10.2 Europe 3 D Semiconductor Packaging Market Analysis, By Technology
10.3 Europe 3 D Semiconductor Packaging Market Analysis, By Material
10.4 Europe 3 D Semiconductor Packaging Market Analysis, By End User
10.5 Europe 3 D Semiconductor Packaging Market Analysis, By Country
10.5 .1 Germany
10.5 .2 France
10.5 .3 UK
10.5 .4 Rest of Europe
11. Asia Pacific 3 D Semiconductor Packaging Market Analysis and Forecast (2017-2027)
11.1 Introduction
11.2 Asia Pacific 3 D Semiconductor Packaging Market Analysis, By Technology
11.3 Asia Pacific 3 D Semiconductor Packaging Market Analysis, By Material
11.3 Asia Pacific 3 D Semiconductor Packaging Market Analysis, By End User
11.4 Asia Pacific 3 D Semiconductor Packaging Market Analysis, By Country
11.4.1 China
11.4.2 India
11.4.3 Japan
11.4.4 Rest of Asia Pacific
12. Latin America 3 D Semiconductor Packaging Market Analysis and Forecast (2017-2027)
12.1 Introduction
12.2 Latin America 3 D Semiconductor Packaging Market Analysis, By Technology
12.3 Latin America 3 D Semiconductor Packaging Market Analysis, By Material
12.4 Latin America 3 D Semiconductor Packaging Market Analysis, By End User
13. Middle East & Africa 3 D Semiconductor Packaging Market Analysis and Forecast (2017-2027)
13.1 Introduction
13.2 Middle East & Africa 3 D Semiconductor Packaging Market Analysis, By Technology
13.3 Middle East & Africa 3 D Semiconductor Packaging Market Analysis, By Material
13.4 Middle East & Africa 3 D Semiconductor Packaging Market Analysis, By End User
14. Competition Analysis
14.1 Competition Dashboard
14.2 Market Share Analysis of Top Vendors
14.3 Key Development Strategies
15. Company Profiles
15.1 Suss Microtec AG
15.1.1 Overview
15.1.2 Offerings
15.1.3 Key Financial
15.1.4 Business Segment & Geographic Overview
15.1.5 Key Market Developments
15.1.6 Key Strategies
15.2 ASE Group
15.3 Siliconware Precision Industries Co., Ltd
15.4 Stmicroelectronics N.V
15.5 Taiwan Semiconductor Manufacturing Company Ltd
15.6 Intel Corporation
15.7 Qualcomm Technology Inc
15.8 International Business Machine Corporation (IBM)
15.9 Jiangsu Changjiang Electronics Technology Co. LTD
15.10 Amkor Technology Inc

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