Molded Interconnect Substrate (MIS) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025

The global Molded Interconnect Substrate (MIS) market is projected to reach US$ 297 million by 2031 from an estimated US$ 97.54 million in 2024, at a CAGR of 15.78% during 2025 and 2031.

North American market for MIS Substrates was valued at $ 24.4 million in 2024 and will reach $ 69.8 million by 2031, at a CAGR of 14.73 % during the forecast period of 2025 through 2031.

Asia-Pacific market for MIS Substrates was valued at $ 56.45 million in 2024 and will reach $ 189.84 million by 2031, at a CAGR of 17.22 % during the forecast period of 2025 through 2031.

Europe market for MIS Substrates was valued at $ 15.13 million in 2024 and will reach $ 33.94 million by 2031, at a CAGR of 11.43 % during the forecast period of 2025 through 2031.

In terms of volume, in 2024 the global MIS substrates shipments were 3,545 kk pieces, and will reach 11,804 kk pieces in 2031.

Currently, there are currently only three companies in the world that manufacture MIS substrates, China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates

The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.

In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.

Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.

As technology continues to update, 5G applications require high speed, low latency technology and stable signals. With the demand for electronicization and intelligence, new applications continue to emerge in the consumer electronics and Industrial markets. This drives the performance requirements of Semiconductor chips to continue, towards high-speed computing, high performance, low loss, etc.

The development direction has also increased the demand for IC packaging substrates to have fine, narrow spacing, high heat dissipation and other characteeristics. The MIS substrates manufacturers have be cultivating its product production Technology capabilities for a long time and has currently developed Narrow pitch, winding, multi-layer board production technologies will be used in 5G, a lot, electric vehicles, etc.

In addition, in terms of consumer electronic smartphone applications, global well-known brand mobile phone manufacturers have a large presence in the market. When launching new mobile phones, the specifications of camera modules are continuously improved, and high-specification camera modules are constantly being. The penetration into new mobile phones has also accelerated the development of major Chinese mobile phone manufacturers due to theimpact of the Sino-US trade war. By introducing local raw Material supply, The MIS substrates manufacturers have laid out multiple plans in the field of mobile phone camera module applications. As new mobile phones are launched in the market one after another, it is expected that the market penetration rate of MIS substrates manufacturers products will increase.

This report aims to provide a comprehensive presentation of the global market for MIS Substrates, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of MIS Substrates by region & country, by Layer, and by Application.

The MIS Substrates market size, estimations, and forecasts are provided in terms of sales volume (KK pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding MIS Substrates.

Market Segmentation

By Company

• PPt
• MiSpak Technology
• QDOS

Segment by Layer

• Single-layer MIS
• Multi-layer MIS

Segment by Application

• Consumer Electronics
• Smart Home
• Automotive Electronics
• Industrial Control
• Servers/Data Center
• Others

By Region

• North America
• United States
• Canada
• Mexico
• Asia-Pacific
• China
• Japan
• South Korea
• Southeast Asia
• China Taiwan
• Others
• Europe
• Germany
• UK
• France
• Netherlands
• Switzerland & Sweden
• Italy
• Nordic Countries
• Others
• South America
• Brazil
• Others
• Middle East & Africa
• Israel
• Others

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of MIS Substrates manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Layer, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of MIS Substrates in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of MIS Substrates in country level. It provides sigmate data by Layer, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.