Global Next-Generation Lithography Materials Market

MARKET SCOPE:

The global Next Generation Lithography Materials market is projected to grow significantly, registering a CAGR of 29.7% during the forecast period (2024 – 2032).

Next-generation lithography materials refer to advanced materials specifically designed for use in cutting-edge lithography processes in semiconductor manufacturing. Lithography is a crucial step in the production of integrated circuits, where a pattern is transferred onto a substrate, typically a semiconductor wafer, to create the intricate structures and features of microelectronic devices. The continuous demand for smaller technology nodes and more densely packed transistors drives the need for lithography materials that can achieve finer feature sizes. The industry's shift towards advanced lithography techniques such as EUV lithography necessitates materials optimized for these technologies. As integrated circuits become more complex with higher transistor counts, the demand for materials that support intricate patterns and multiple functionalities rises. Growing applications of emerging technologies like 5G, artificial intelligence (AI), and the Internet of Things (IoT) drive the demand for advanced lithography materials to meet the performance requirements of these technologies. The adoption of advanced packaging techniques, including 3D stacking and heterogeneous integration, requires precise lithography processes and materials designed for complex structures. Different applications, from high-performance computing to mobile devices, may have unique lithography material requirements, leading to a demand for customizable solutions. The growth of semiconductor manufacturing activities globally contributes to the demand for next-generation lithography materials in fabrication facilities worldwide. Increasing focus on sustainability and environmental responsibility in the semiconductor industry influences the development of materials with reduced environmental impact.

MARKET OVERVIEW:

Driver: Increasing demand for advanced packaging techniques is driving the market growth.

The adoption of advanced packaging techniques, such as 3D stacking and heterogeneous integration, requires precise lithography processes. Next-generation lithography materials are designed to support the fabrication of complex and compact structures in advanced packaging. Advanced packaging often involves stacking multiple dies in three-dimensional configurations. Achieving fine features and precise patterns on each layer is essential for successful 3D stacking. Next-generation lithography materials enable high-resolution patterning, ensuring the creation of intricate structures with accuracy. In 3D stacking, accurate alignment and overlay of different layers are crucial to ensure proper interconnection and functionality. Next-generation lithography materials are designed to provide excellent alignment precision, allowing for the creation of vertically aligned structures with minimal misalignment. Advanced packaging techniques frequently employ Through-Silicon Vias (TSVs) to enable vertical connections between stacked layers. Precise lithography processes are essential for creating TSVs with the required diameter, depth, and alignment. Next-generation lithography materials contribute to achieving these specifications. Compact structures in advanced packaging demand reduced pitches between features. Next-generation lithography materials support pitch scaling, enabling the fabrication of densely packed structures. This is particularly important for achieving high interconnect density in advanced packaging.

Opportunities: Rising need of lithography materials for complex integrated circuits is anticipated for the market growth in the upcoming years.

As integrated circuits become more complex with higher transistor counts and multiple functionalities on a single chip, the demand for advanced lithography materials rises. These materials are essential for creating intricate patterns and features with precision. With higher transistor counts and denser circuitry, the features on semiconductor wafers need to be smaller and more precise. Advanced lithography materials enable the creation of finer patterns and structures required for densely packed circuits. As feature sizes shrink, manufacturers often employ multiple patterning techniques such as double or triple patterning to achieve the desired resolution. Advanced lithography materials are essential for implementing these techniques effectively, allowing for precise overlay and alignment of multiple patterns. Shrinking feature sizes also necessitate reducing the pitch between features on the semiconductor wafer. Advanced lithography materials enable pitch splitting techniques, where larger patterns are decomposed into smaller, closely spaced features, further increasing the complexity of lithographic processes. Advanced lithography materials, such as photoresists with improved sensitivity and chemical properties, enhance the resolution and depth of focus of lithographic processes. This is crucial for achieving sharp, well-defined features even as feature sizes decrease.

COVID IMPACT:

The semiconductor industry, including the production of lithography materials, relies on complex global supply chains. The COVID-19 pandemic disrupted supply chains worldwide, affecting the availability of raw materials, components, and equipment necessary for the manufacturing of advanced lithography materials. Lockdowns, restrictions, and safety measures implemented to curb the spread of the virus may have led to production delays in manufacturing facilities. Delays in the production of next-generation lithography materials could impact the timelines for the adoption of advanced lithography technologies. Laboratories and research facilities faced challenges during the pandemic, with disruptions to normal operations and restrictions on in-person work. This may have affected the progress of research and development activities related to next-generation lithography materials, potentially delaying innovation timelines. The economic uncertainties resulting from the pandemic may have led some companies to reassess their priorities and investments. Depending on financial constraints, organizations might have adjusted their budgets and timelines for projects related to next-generation lithography materials. The shift to remote work for many professionals could have presented challenges for collaborative research and development efforts. Team members involved in the development of next-generation lithography materials may have faced communication and collaboration hurdles, potentially impacting the pace of advancements. The demand for certain semiconductor products, including those requiring advanced lithography materials, may have experienced fluctuations during the pandemic. Changes in market demand could influence the investment decisions and production plans of companies in the sector.

SEGMENTATION ANALYSIS:

Ancillary Material segment is anticipated to grow significantly during the forecast period

Ancillary materials play a crucial role in mask manufacturing, a fundamental component of lithography. Next-generation lithography, particularly techniques like extreme ultraviolet (EUV) lithography, requires sophisticated masks with high precision. Ancillary materials involved in mask production, such as pellicles and mask blanks, are essential for ensuring the quality and reliability of the lithographic process. The ancillary material segment may encompass advanced photoresists and developers used in the lithography process. As lithography technologies advance, the demand for photoresist materials with improved sensitivity, resolution, and chemical properties is likely to grow. These materials are critical for transferring the desired patterns onto semiconductor substrates. Ancillary materials may include chemicals and solutions used for optimizing the lithographic process. This could involve materials for cleaning, rinsing, and treating surfaces to ensure the effectiveness of lithography and enhance the quality of semiconductor manufacturing.

The Automotive segment is anticipated to grow significantly during the forecast period

The automotive industry is increasingly incorporating advanced semiconductor components for various applications, including in-vehicle electronics, sensor systems, and advanced driver assistance systems (ADAS). Next-generation lithography materials may be crucial in producing the high-density and high-performance semiconductor devices required for these applications. The growing demand for electric vehicles (EVs) requires advanced semiconductor technologies to support electric drivetrains, battery management systems, and in-cabin electronics. Next-generation lithography materials can play a role in manufacturing more efficient and compact semiconductor components for electric vehicles. The development of autonomous driving technologies relies on sophisticated sensor systems, image recognition, and processing units. Next-generation lithography materials can contribute to the fabrication of advanced sensors and processors with smaller feature sizes, enhancing the capabilities of autonomous vehicles.

REGIONAL ANALYSIS:

The Asia Pacific region is set to witness significant growth during the forecast period.

Extreme Ultraviolet (EUV) lithography is considered a next-generation lithography technology. EUV lithography uses shorter wavelengths of light compared to traditional optical lithography, enabling higher resolution and finer feature sizes. The adoption of EUV lithography requires specialized materials optimized for the unique properties of EUV radiation. The Asia Pacific region, and specifically countries like Taiwan and South Korea, has established itself as a key hub for semiconductor manufacturing. Leading semiconductor fabrication plants in the region may invest in and adopt next-generation lithography materials and technologies to stay competitive and meet the demand for advanced semiconductor devices. Companies in the Asia Pacific region that manufacture semiconductor manufacturing equipment may play a significant role in the development and supply of tools and materials for next-generation lithography. These companies contribute to the regional adoption of advanced lithographic technologies. Asia Pacific is home to numerous research and development centers focused on semiconductor technology. Collaboration between academic institutions, research organizations, and industry players in the region may drive advancements in lithography materials and processes. The Asia Pacific region has a growing demand for advanced semiconductor devices in various industries, including consumer electronics, automotive, and telecommunications. This demand can drive investments in cutting-edge lithography technologies to meet the requirements for smaller feature sizes and increased device performance.

COMPETITIVE ANALYSIS

The global Next Generation Lithography Materials market is reasonably competitive with mergers, acquisitions, and product launches. See some of the major key players in the market.

JSR Corporation

• To build a subsidiary in Shanghai, JSR Corporation inked an investment agreement with the Lingang Special Area Government in August 2023. This is anticipated to increase JSR Group's semiconductor material-related commercial activity in the Chinese market. The estimated start of operations is set for December 2023.

DuPont de Nemours, Inc.

• In January 2021, a semiconductor materials laboratory was built in Hsinchu, Taiwan by the Industrial Technology Research Institute (ITRI) and DuPont de Nemours, Inc. In order to serve its clients in their pursuit of the next generation of semiconductors in Taiwan, DuPont is anticipated to work with ITRI to perform research, development, and enhancement of semiconductor materials. Additionally, DuPont plans to expedite pilot testing and commercial viability.

Tokyo Ohka Kogyo Co., Ltd (TOK)

Shin-Etsu Chemical Co., Ltd

Fujifilm Corporation.

Sumitomo Chemical Co., Ltd.

Allresist GmbH

Micro resist technology GmbH

Merck KGaA

Dongjin Semichem Co. Ltd.

Brewer Science, Inc.

SACHEM, INC.

Kayaku Advanced Materials, Inc.

Avantor Performance Materials Inc.

Irresistible Materials Ltd

Weifang Startech Microelectronic Materials Co., Ltd.

KemLab Inc.

Scope of the Report

By Material

• Photoresist Material
• Ancillary Material

By Application

• Automotive
• Consumer Electronics
• IT & Telecommunications
• Others

By Region

• North America (the United States & Canada)
• Europe (Germany, UK, France, Spain, Italy, and the Rest of Europe)
• Asia Pacific (China, Japan, India, and Rest of Asia Pacific)
• Rest of the World (the Middle East & Africa, and Latin America)

Key reasons to purchase this report

It provides a technological development map over time to understand the industry’s growth rate and indicates how the Next Generation Lithography Materials market is evolving.

The report offers a dynamic method to various factors that drive or restrain the growth of the market and specifies which Next Generation Lithography Materials submarket will be the main driver of the overall market from 2024 to 2032.

It renders a definite analysis of changing competitive dynamics and stipulates the leading players and what are their prospects over the forecast period.

It builds a nine-year estimate based on how the market is predicted to grow and shows what will market shares of the global region change by 2032 and which country will lead the market in 2032.