Global Underfills for Semiconductor Market Growth 2025-2031

The global Underfills for Semiconductor market size is predicted to grow from US$ 298 million in 2025 to US$ 457 million in 2031; it is expected to grow at a CAGR of 7.4% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

Underfills for Semiconductor is a key packaging material for connecting chips to substrates. Its core functions include: filling the gap between the chip and the substrate through capillary action to disperse surface stress, effectively alleviating the internal stress caused by the difference in thermal expansion coefficients between the chip, solder and substrate; at the same time, forming a physical protective layer to enhance the impact resistance of the solder balls, significantly improving the reliability of the chip under drop shock and thermal cycling conditions.

From the perspective of application scenarios, underfill can be divided into two categories: board-level packaging applications (PCB) and wafer/panel-level packaging applications. Among them, BGA Underfill is the leading field in the field of board-level packaging, which is mainly used to achieve the gap filling of the solder ball array between the packaging substrate and the PCB circuit board, and its process accuracy is required to reach the millimeter level; while the chip-level packaging field corresponds to the flip-chip underfill (Flip-Chip Underfill), which is specially used for the precision filling of the micro-bump array between the chip and the packaging substrate, and the process window requires micron-level accuracy.

In the Underfill market, the leading companies are mainly from Japan and Europe, such as NAMICS, Henkel, RESONAC, Nagase ChemteX Corporation, Shin-Etsu Chemical, Zymet, MacDermid Alpha, etc. There are certain differences in the applications faced by different companies. In the semiconductor (chip-level packaging) market, the mainstream company is Japan's NAMICS, and the Chinese local company is Darbond Technology. In the PCB field, the core company is Henkel.

LP Information, Inc. (LPI) ' newest research report, the “Underfills for Semiconductor Industry Forecast” looks at past sales and reviews total world Underfills for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Underfills for Semiconductor sales for 2025 through 2031. With Underfills for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfills for Semiconductor industry.

This Insight Report provides a comprehensive analysis of the global Underfills for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfills for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Underfills for Semiconductor market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfills for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfills for Semiconductor.

This report presents a comprehensive overview, market shares, and growth opportunities of Underfills for Semiconductor market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
PLP Underfill
WLP Underfill

Segmentation by Application:
Consumer Electronics
Automotive
Telecom & Infrastructure
Medical
Industrial
Aerospace & Defense
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
NAMICS
Henkel
RESONAC
Nagase ChemteX Corporation
Shin-Etsu Chemical
Panasonic
MacDermid Alpha
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Jiangsu HHCK Advanced Materials Co.,Ltd
Parker Hannifin
Asec Co., Ltd.
Panacol-Elosol
United Adhesives
Henan Siny Optic-com Co., Ltd
Dongguan Hanstars
GTA Material
H.B.Fuller

Key Questions Addressed in this Report

What is the 10-year outlook for the global Underfills for Semiconductor market?

What factors are driving Underfills for Semiconductor market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Underfills for Semiconductor market opportunities vary by end market size?

How does Underfills for Semiconductor break out by Type, by Application?

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