Global Tapes for Semiconductor Manufacturing Process Market Growth 2025-2031

The global Tapes for Semiconductor Manufacturing Process market size is predicted to grow from US$ 1035 million in 2025 to US$ 1759 million in 2031; it is expected to grow at a CAGR of 9.2% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

Tapes for Semiconductor Manufacturing Process refer to a range of high-performance adhesive tapes used throughout various stages of wafer fabrication, assembly, and testing in semiconductor production. These functional tapes serve purposes such as temporary bonding, surface protection, wafer thinning, dicing, mounting, and encapsulation. Based on the application stage, the main product types include back grinding tapes, dicing tapes, wafer mounting tapes, surface protection films, UV-release tapes, and encapsulation tapes. These tapes are typically composed of a base material (e.g., PET, PE, PI), a pressure-sensitive adhesive layer (e.g., acrylic, rubber, silicone), and may feature functional coatings such as anti-static, UV-curable, or heat-resistant layers. As semiconductor devices evolve toward higher integration, smaller node sizes, and ultra-thin wafer structures, the demand for tapes with high cleanliness, minimal residue, excellent peel performance, and process compatibility is rapidly increasing.

In terms of consumption side, China Taiwan is currently the world's largest consumer market, accounting for 34.0% of the market share in 2023, followed by mainland China and North America, accounting for 27.4% and 9.27% respectively. Southeast Asia is expected to grow fastest in the next few years, with a CAGR of approximately 10.6% during 2024-2030.

From the production side, Japan is the largest production area, and the key manufacturers are mainly headquartered in Japan. In 2023, Japan accounted for approximately 83% of the production share. It is expected that in the next few years, the production of wafer tape in the Chinese market will maintain the fastest growth rate, and the share is expected to reach 9.41% in 2030.

In terms of product type, UV wafer tape has a higher proportion, with a share of 62.5% in 2023 and an estimated share of 64% in 2030.

From the application point of view, the wafer cutting process accounts for a high proportion, with a share of 54.95% in 2023. It is expected that the wafer grinding process will grow faster in the next few years, and the share will increase from 45.05% in 2023 to 46.01% in 2030.

From the perspective of manufacturers, the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.

LP Information, Inc. (LPI) ' newest research report, the “Tapes for Semiconductor Manufacturing Process Industry Forecast” looks at past sales and reviews total world Tapes for Semiconductor Manufacturing Process sales in 2024, providing a comprehensive analysis by region and market sector of projected Tapes for Semiconductor Manufacturing Process sales for 2025 through 2031. With Tapes for Semiconductor Manufacturing Process sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Tapes for Semiconductor Manufacturing Process industry.

This Insight Report provides a comprehensive analysis of the global Tapes for Semiconductor Manufacturing Process landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Tapes for Semiconductor Manufacturing Process portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Tapes for Semiconductor Manufacturing Process market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Tapes for Semiconductor Manufacturing Process and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Tapes for Semiconductor Manufacturing Process.

This report presents a comprehensive overview, market shares, and growth opportunities of Tapes for Semiconductor Manufacturing Process market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
UV Type Tapes
Non-UV Type Tapes

Segmentation by Application:
Back Grinding Tapes
Dicing Tape

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
Resonac
Sumitomo Bakelite Company
D&X Co., Ltd
KGK Chemical Corporation
AI Technology
Ultron System
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Tapes for Semiconductor Manufacturing Process market?

What factors are driving Tapes for Semiconductor Manufacturing Process market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Tapes for Semiconductor Manufacturing Process market opportunities vary by end market size?

How does Tapes for Semiconductor Manufacturing Process break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.