Global TGV Substrate Market Growth 2025-2031
Description
The global TGV Substrate market size is predicted to grow from US$ 567 million in 2025 to US$ 2230 million in 2031; it is expected to grow at a CAGR of 25.6% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
TGV (Through Glass Via) technology is to make tiny vertical through holes on a glass substrate and fill the holes with conductive materials to achieve electrical connections between different layers. TGV uses high-quality borosilicate glass and quartz glass as substrates, and achieves 3D interconnection through seed layer sputtering, electroplating filling, chemical mechanical planarization, RDL rewiring, and bump process. It is regarded as a key technology for the next generation of advanced packaging integration.
The growing demand for bandwidth in high-performance computing, fifth-generation (5G) communications, and Internet of Things (IOT) applications has driven the migration to 2.5D and 3D interposers, which requires lower high-frequency losses and higher vertical interconnect hole depth/size ratios, thus requiring TGVs with high aspect ratios.
LP Information, Inc. (LPI) ' newest research report, the “TGV Substrate Industry Forecast” looks at past sales and reviews total world TGV Substrate sales in 2024, providing a comprehensive analysis by region and market sector of projected TGV Substrate sales for 2025 through 2031. With TGV Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world TGV Substrate industry.
This Insight Report provides a comprehensive analysis of the global TGV Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on TGV Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global TGV Substrate market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for TGV Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global TGV Substrate.
This report presents a comprehensive overview, market shares, and growth opportunities of TGV Substrate market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
100 mm
150 mm
200 mm
300 mm
Segmentation by Application:
Chip Packaging
Sensor Packaging
LED Packaging
High Performance Computing
Industrial IOT
Consumer Electronics
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
SCHOTT
Corning
Samtec
Tecnisco
Group
Samsung Electro-Mechanics
JNTC
LPKF
Absolics（SKC）
NEG
AGC
DNP
Toppan Printing
LG Innotek
PLANOPTIK AG
Hubei W-OLF Photoelectric Technology Co., Ltd.
WG Tech (JiangXi) Group Co., Ltd.
Chengdu Macko
Guangdong Cellwise Microelectronics Co., Ltd.
Xiamen Sky Semiconductor Co., Ltd.
BOE
Shenzhen Laibao Hi-Tech Co., Ltd.
Guangzhou Triassic Technology Co., Ltd.
Fozhixin
Chengdu ECHINT Technology Co., Ltd.
Jiangsu Changjiang Electronics Technology Co., Ltd.
Zhejiang Lante Optics Co., Ltd.
Key Questions Addressed in this Report
What is the 10-year outlook for the global TGV Substrate market?
What factors are driving TGV Substrate market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do TGV Substrate market opportunities vary by end market size?
How does TGV Substrate break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
TGV (Through Glass Via) technology is to make tiny vertical through holes on a glass substrate and fill the holes with conductive materials to achieve electrical connections between different layers. TGV uses high-quality borosilicate glass and quartz glass as substrates, and achieves 3D interconnection through seed layer sputtering, electroplating filling, chemical mechanical planarization, RDL rewiring, and bump process. It is regarded as a key technology for the next generation of advanced packaging integration.
The growing demand for bandwidth in high-performance computing, fifth-generation (5G) communications, and Internet of Things (IOT) applications has driven the migration to 2.5D and 3D interposers, which requires lower high-frequency losses and higher vertical interconnect hole depth/size ratios, thus requiring TGVs with high aspect ratios.
LP Information, Inc. (LPI) ' newest research report, the “TGV Substrate Industry Forecast” looks at past sales and reviews total world TGV Substrate sales in 2024, providing a comprehensive analysis by region and market sector of projected TGV Substrate sales for 2025 through 2031. With TGV Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world TGV Substrate industry.
This Insight Report provides a comprehensive analysis of the global TGV Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on TGV Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global TGV Substrate market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for TGV Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global TGV Substrate.
This report presents a comprehensive overview, market shares, and growth opportunities of TGV Substrate market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
100 mm
150 mm
200 mm
300 mm
Segmentation by Application:
Chip Packaging
Sensor Packaging
LED Packaging
High Performance Computing
Industrial IOT
Consumer Electronics
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
SCHOTT
Corning
Samtec
Tecnisco
Group
Samsung Electro-Mechanics
JNTC
LPKF
Absolics（SKC）
NEG
AGC
DNP
Toppan Printing
LG Innotek
PLANOPTIK AG
Hubei W-OLF Photoelectric Technology Co., Ltd.
WG Tech (JiangXi) Group Co., Ltd.
Chengdu Macko
Guangdong Cellwise Microelectronics Co., Ltd.
Xiamen Sky Semiconductor Co., Ltd.
BOE
Shenzhen Laibao Hi-Tech Co., Ltd.
Guangzhou Triassic Technology Co., Ltd.
Fozhixin
Chengdu ECHINT Technology Co., Ltd.
Jiangsu Changjiang Electronics Technology Co., Ltd.
Zhejiang Lante Optics Co., Ltd.
Key Questions Addressed in this Report
What is the 10-year outlook for the global TGV Substrate market?
What factors are driving TGV Substrate market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do TGV Substrate market opportunities vary by end market size?
How does TGV Substrate break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
184 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for TGV Substrate by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for TGV Substrate by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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