Global Semiconductor Wafer Processing Tapes Market Growth 2025-2031
Description
The global Semiconductor Wafer Processing Tapes market size is predicted to grow from US$ 1035 million in 2025 to US$ 1759 million in 2031; it is expected to grow at a CAGR of 9.2% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
This report studies the semiconductor wafer processing tapes, include UV tapes and Non-UV tapes used in wafer Back Grinding and wafer dicing process.
UV tape has stronger adhesive strength and can hold wafer firmly in back grinding process or dicing process. After UV irradiation, adhesive strength decreases drastically and easy de-taping or die pick up can be achieved.
Non-UV tape, which is designed to peel-off from wafer material without UV irradiation.
Note: this report only covers the UV tapes and Non-UV tapes used in wafer Back Grinding and wafer dicing process, exclude dicing tapes for PKGs (like QFN, FC-CSP, and BGA).
In terms of consumption side, China Taiwan is currently the world's largest consumer market, accounting for 34.0% of the market share in 2023, followed by mainland China and North America, accounting for 27.4% and 9.27% respectively. Southeast Asia is expected to grow fastest in the next few years, with a CAGR of approximately 10.6% during 2024-2030.
From the production side, Japan is the largest production area, and the key manufacturers are mainly headquartered in Japan. In 2023, Japan accounted for approximately 83% of the production share. It is expected that in the next few years, the production of wafer tape in the Chinese market will maintain the fastest growth rate, and the share is expected to reach 9.41% in 2030.
In terms of product type, UV wafer tape has a higher proportion, with a share of 62.5% in 2023 and an estimated share of 64% in 2030.
From the application point of view, the wafer cutting process accounts for a high proportion, with a share of 54.95% in 2023. It is expected that the wafer grinding process will grow faster in the next few years, and the share will increase from 45.05% in 2023 to 46.01% in 2030.
From the perspective of manufacturers, the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Wafer Processing Tapes Industry Forecast” looks at past sales and reviews total world Semiconductor Wafer Processing Tapes sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Wafer Processing Tapes sales for 2025 through 2031. With Semiconductor Wafer Processing Tapes sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Wafer Processing Tapes industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Wafer Processing Tapes landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Wafer Processing Tapes portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Wafer Processing Tapes market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Wafer Processing Tapes and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Wafer Processing Tapes.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Wafer Processing Tapes market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Tape
Non-UV Tape
Segmentation by Application:
Back Grinding Tape
Dicing Tape
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto Denko Corporation
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
Resonac Corporation
Sumitomo Bakelite Company
D&X Co., Ltd
KGK Chemical Corporation
AI Technology, Inc. (AIT)
Ultron System
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
3M
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology
GTA Material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Wafer Processing Tapes market?
What factors are driving Semiconductor Wafer Processing Tapes market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Wafer Processing Tapes market opportunities vary by end market size?
How does Semiconductor Wafer Processing Tapes break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
This report studies the semiconductor wafer processing tapes, include UV tapes and Non-UV tapes used in wafer Back Grinding and wafer dicing process.
UV tape has stronger adhesive strength and can hold wafer firmly in back grinding process or dicing process. After UV irradiation, adhesive strength decreases drastically and easy de-taping or die pick up can be achieved.
Non-UV tape, which is designed to peel-off from wafer material without UV irradiation.
Note: this report only covers the UV tapes and Non-UV tapes used in wafer Back Grinding and wafer dicing process, exclude dicing tapes for PKGs (like QFN, FC-CSP, and BGA).
In terms of consumption side, China Taiwan is currently the world's largest consumer market, accounting for 34.0% of the market share in 2023, followed by mainland China and North America, accounting for 27.4% and 9.27% respectively. Southeast Asia is expected to grow fastest in the next few years, with a CAGR of approximately 10.6% during 2024-2030.
From the production side, Japan is the largest production area, and the key manufacturers are mainly headquartered in Japan. In 2023, Japan accounted for approximately 83% of the production share. It is expected that in the next few years, the production of wafer tape in the Chinese market will maintain the fastest growth rate, and the share is expected to reach 9.41% in 2030.
In terms of product type, UV wafer tape has a higher proportion, with a share of 62.5% in 2023 and an estimated share of 64% in 2030.
From the application point of view, the wafer cutting process accounts for a high proportion, with a share of 54.95% in 2023. It is expected that the wafer grinding process will grow faster in the next few years, and the share will increase from 45.05% in 2023 to 46.01% in 2030.
From the perspective of manufacturers, the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Wafer Processing Tapes Industry Forecast” looks at past sales and reviews total world Semiconductor Wafer Processing Tapes sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Wafer Processing Tapes sales for 2025 through 2031. With Semiconductor Wafer Processing Tapes sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Wafer Processing Tapes industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Wafer Processing Tapes landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Wafer Processing Tapes portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Wafer Processing Tapes market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Wafer Processing Tapes and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Wafer Processing Tapes.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Wafer Processing Tapes market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
UV Tape
Non-UV Tape
Segmentation by Application:
Back Grinding Tape
Dicing Tape
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto Denko Corporation
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
Resonac Corporation
Sumitomo Bakelite Company
D&X Co., Ltd
KGK Chemical Corporation
AI Technology, Inc. (AIT)
Ultron System
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
3M
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology
GTA Material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Wafer Processing Tapes market?
What factors are driving Semiconductor Wafer Processing Tapes market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Wafer Processing Tapes market opportunities vary by end market size?
How does Semiconductor Wafer Processing Tapes break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
172 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Semiconductor Wafer Processing Tapes by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Semiconductor Wafer Processing Tapes by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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