The global Semiconductor Cleaning and Etching Gas market size is predicted to grow from US$ 2758 million in 2025 to US$ 4336 million in 2031; it is expected to grow at a CAGR of 7.8% from 2025 to 2031.
Semiconductor Cleaning Gas are gases utilized to remove various contaminants from the surface of semiconductor wafers. Contaminants can include organic substances, metal ions, particles, and residual substances from previous process steps. Cleaning gases work through physical or chemical actions to ensure the wafer surface is clean and suitable for subsequent manufacturing processes.
Common Types
Hydrogen Chloride (HCl): It is often used to remove metal impurities on the wafer surface. HCl can react with metal oxides to form soluble metal chlorides, which can then be easily washed away.
Ammonia (NH₃): Ammonia is commonly employed for cleaning organic contaminants. It can dissolve and remove organic substances through chemical reactions and hydrogen bonding interactions.
Oxygen (O₂): Oxygen is frequently used in plasma cleaning processes. In a plasma environment, oxygen can react with organic contaminants to form carbon dioxide and water, which are volatile and can be removed from the wafer surface.
Etching gases are gases that are used to selectively remove or etch specific materials from the semiconductor wafer surface to create precise patterns and structures. This is a crucial process in defining the various components and circuits on the semiconductor device.
Common Types
Chlorine-based Gases: Such as chlorine (Cl₂) and boron trichloride (BCl₃). They are often used for etching metals and silicon. For example, Cl₂ can react with silicon to form silicon tetrachloride (SiCl₄), which is a volatile compound and can be removed from the wafer surface, thereby achieving the etching of silicon.
Fluorine-based Gases: Such as fluorine (F₂), sulfur hexafluoride (SF₆), and nitrogen trifluoride (NF₃). Fluorine-based gases are widely used for etching silicon dioxide and silicon nitride. SF₆, for instance, can react with silicon dioxide in a plasma environment to form silicon tetrafluoride (SiF₄) and other volatile fluorides, enabling the precise removal of silicon dioxide layers.
Hydrogen Bromide (HBr): HBr is used for etching certain metal layers and silicon in some semiconductor processes. It can react with the target material to form volatile bromides, which are then removed from the surface.
The Semiconductor Industry Association (SIA) announced global semiconductor sales hit $627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of $526.8 billion. Additionally, fourth-quarter sales of $170.9 billion were 17.1% more than the fourth quarter of 2023, and 3.0% higher than the third quarter of 2024. And global sales for the month of December 2024 were $57.0 billion, a decrease of 1.2% compared to the November 2024 total.
“The global semiconductor market experienced its highest-ever sales year in 2024, topping $600 billion in annual sales for the first time, and double-digit market growth is projected for 2025,” said John Neuffer, SIA president and CEO. “Semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, advanced transportation, and countless others – and the long-term industry outlook is incredibly strong.”
Semiconductor cleaning and etching gases are special gases used in the semiconductor manufacturing process to clean semiconductor wafers and etch specific materials on them.In terms of semiconductor cleaning and etching gas production, Japan and South Korea are currently the world's largest high-end semiconductor cleaning and etching gas production regions, and export to many countries around the world. At the same time, with the development of industry, customers have put forward more quality requirements and higher technical indicators for Semiconductor Cleaning and Etching Gass as their key raw materials. Semiconductor Cleaning and Etching Gas companies should actively improve product quality to make their products attractive in the market.
The main semiconductor cleaning and etching gas manufacturers in the market include SK Materials, Kanto Denka Kogyo, Resonac, Linde Group, Peric, Hyosung, etc. Japanese and Korean companies have a large share in the high-end market, among which the top five companies in 2023 accounted for 49.44% of the revenue market share. With the rapid rise of China's semiconductor industry and the government's strong support for the semiconductor industry, Chinese companies will continue to increase their R&D investment, enhance their independent R&D capabilities, and develop a series of high-purity, high-performance cleaning and etching gases.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Cleaning and Etching Gas Industry Forecast” looks at past sales and reviews total world Semiconductor Cleaning and Etching Gas sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Cleaning and Etching Gas sales for 2025 through 2031. With Semiconductor Cleaning and Etching Gas sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Cleaning and Etching Gas industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Cleaning and Etching Gas landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Cleaning and Etching Gas portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Cleaning and Etching Gas market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Cleaning and Etching Gas and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Cleaning and Etching Gas.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Cleaning and Etching Gas market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Fluoride Gas
Chloride Gas
Others
Segmentation by Application:
Semiconductor Cleaning
Semiconductor Etching
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
SK Materials
Kanto Denka Kogyo
Resonac
Linde Group
Peric
Hyosung
Taiyo Nippon Sanso
Merck KGaA
Mitsui Chemical
Central Glass
Haohua Chemical Science & Technology
Shandong FeiYuan
Messer Group
Air Liquide
Huate Gas
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Cleaning and Etching Gas market?
What factors are driving Semiconductor Cleaning and Etching Gas market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Cleaning and Etching Gas market opportunities vary by end market size?
How does Semiconductor Cleaning and Etching Gas break out by Type, by Application?
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