Global Semiconductor Assembly Adhesive Market Growth 2025-2031
Description
The global Semiconductor Assembly Adhesive market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.53% year-on-year.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Assembly Adhesive Industry Forecast” looks at past sales and reviews total world Semiconductor Assembly Adhesive sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Assembly Adhesive sales for 2025 through 2031. With Semiconductor Assembly Adhesive sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Assembly Adhesive industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Assembly Adhesive landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Assembly Adhesive portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Assembly Adhesive market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Assembly Adhesive and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Assembly Adhesive.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Assembly Adhesive market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Epoxy Adhesive
Silicone Adhesive
Polyimide Adhesive
Segmentation by Application:
Industrial
Automobile
Communication
Consumer Electronics
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Parker Hannifin
Momentive
DeepMaterial
Master Bond
DELO
DuPont
Henkel
MacDermid Alpha Electronics Solutions
AI Technology
Taichem Materials
Indium Corporation
3M
Everwide Chemical
Timtronics
Alfa Chemistry
H.B. Fuller
Sekisui Chemical
Arkema
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Assembly Adhesive market?
What factors are driving Semiconductor Assembly Adhesive market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Assembly Adhesive market opportunities vary by end market size?
How does Semiconductor Assembly Adhesive break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.53% year-on-year.
LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Assembly Adhesive Industry Forecast” looks at past sales and reviews total world Semiconductor Assembly Adhesive sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Assembly Adhesive sales for 2025 through 2031. With Semiconductor Assembly Adhesive sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Assembly Adhesive industry.
This Insight Report provides a comprehensive analysis of the global Semiconductor Assembly Adhesive landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Assembly Adhesive portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Assembly Adhesive market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Assembly Adhesive and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Assembly Adhesive.
This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Assembly Adhesive market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Epoxy Adhesive
Silicone Adhesive
Polyimide Adhesive
Segmentation by Application:
Industrial
Automobile
Communication
Consumer Electronics
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Parker Hannifin
Momentive
DeepMaterial
Master Bond
DELO
DuPont
Henkel
MacDermid Alpha Electronics Solutions
AI Technology
Taichem Materials
Indium Corporation
3M
Everwide Chemical
Timtronics
Alfa Chemistry
H.B. Fuller
Sekisui Chemical
Arkema
Key Questions Addressed in this Report
What is the 10-year outlook for the global Semiconductor Assembly Adhesive market?
What factors are driving Semiconductor Assembly Adhesive market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Assembly Adhesive market opportunities vary by end market size?
How does Semiconductor Assembly Adhesive break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
140 Pages
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Semiconductor Assembly Adhesive by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Semiconductor Assembly Adhesive by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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