Global Production Equipment for IC Substrate Market Growth (Status and Outlook) 2025-2031

The global Production Equipment for IC Substrate market size is predicted to grow from US$ 2005 million in 2025 to US$ 2662 million in 2031; it is expected to grow at a CAGR of 4.8% from 2025 to 2031.

This report studies the Production Equipment for IC Substrates, include the Direct Imaging Exposure System, Drilling Machine, AOI, Routing Machine, AVI, ABF Film Laminator, VCP Equipment, Flying Probe Tester, and PTH, etc. Currently FC-BGA (ABF) is the largest and fastest-growing segment of IC Substrate, driven by the demand from PCs, server, AI Chips, Data Center, HPC Chips, and Communication, etc.

United States market for Production Equipment for IC Substrate is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Production Equipment for IC Substrate is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Production Equipment for IC Substrate is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Production Equipment for IC Substrate players cover Orbotech (KLA), ADTEC, SCREEN, Chime Ball Technology, ORC Manufacturing, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LPI (LP Information)' newest research report, the “Production Equipment for IC Substrate Industry Forecast” looks at past sales and reviews total world Production Equipment for IC Substrate sales in 2024, providing a comprehensive analysis by region and market sector of projected Production Equipment for IC Substrate sales for 2025 through 2031. With Production Equipment for IC Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Production Equipment for IC Substrate industry.

This Insight Report provides a comprehensive analysis of the global Production Equipment for IC Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Production Equipment for IC Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Production Equipment for IC Substrate market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Production Equipment for IC Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Production Equipment for IC Substrate.

This report presents a comprehensive overview, market shares, and growth opportunities of Production Equipment for IC Substrate market by product type, application, key players and key regions and countries.

Segmentation by Type:
Direct Imaging Exposure System/LDI
Drilling Machine for IC Substrate
Automated Optical Inspection (AOI) for IC Substrate
Routing Machine for IC Substrate
Automated Vision Inspection (AVI) for IC Substrate
ABF Film Laminator
VCP Equipment
Flying Probe Tester
PTH
Others

Segmentation by Application:
FC-BGA (ABF)
FC-CSP
BGA/CSP
SiP and RF Modules
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Orbotech (KLA)
ADTEC
SCREEN
Chime Ball Technology
ORC Manufacturing
Manz (KLEO)
Ofuna Technology Co., Ltd.
Symtek Automation
C SUN
AMPOC
GROUP UP Industrial (GP)
Gallant Precision Machining (GPM)
Eclat Forever Company
Utechzone
Ta Liang Technology
MACHVISION Inc Co., LTD
GigaVis
CIMS
Favite
FUSEI MENIX
Mycronic (atg)
Circuit Fabology Microelectronics Equipment Co.,Ltd.
TZTEK Company
Han's Laser
Jiangsu Yingsu IC Equipment
Kun Shan Korbe Precision Equipment
Kunshan Dongwei Technology
INSPEC
Saki Corporation
Via Mechanics
MKS (ESI)
Tongtai Machine & Tool

Please note: The report will take approximately 2 business days to prepare and deliver.


*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Production Equipment for IC Substrate Market Size by Player
4 Production Equipment for IC Substrate by Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Global Production Equipment for IC Substrate Market Forecast
11 Key Players Analysis
12 Research Findings and Conclusion

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