Global Photonics Integrated Circuit Packaging and Assembly Service Market Growth (Status and Outlook) 2025-2031

According to this study, the global Photonics Integrated Circuit Packaging and Assembly Service market size will reach US$ 1170 million by 2031.

Photonics Integrated Circuit Packaging and Assembly Service provides high-precision back-end manufacturing solutions from wafers to functional modules for photonic chips (PICs). Its core task is to integrate and package the bare photonic chip with external optical fibers, electronic drive circuits, thermal management components, etc., and to build efficient and stable optical signal input/output interfaces (such as fiber array coupling), electrical signal interconnection, and heat dissipation structures through key technologies such as sub-micron optical alignment, micro-nano welding, and sealing protection. This type of service focuses on solving challenges such as high sensitivity, low-loss transmission, airtightness, and reliability of photonic devices, and ultimately forms a plug-and-play optical engine or subsystem that is widely used in high-speed optical communications, data center interconnection, lidar, biosensing, and quantum technology.

United States market for Photonics Integrated Circuit Packaging and Assembly Service is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Photonics Integrated Circuit Packaging and Assembly Service is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Photonics Integrated Circuit Packaging and Assembly Service is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Photonics Integrated Circuit Packaging and Assembly Service players cover IMEC, Intel, TSMC, ASE, ALTER, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LPI (LP Information)' newest research report, the “Photonics Integrated Circuit Packaging and Assembly Service Industry Forecast” looks at past sales and reviews total world Photonics Integrated Circuit Packaging and Assembly Service sales in 2024, providing a comprehensive analysis by region and market sector of projected Photonics Integrated Circuit Packaging and Assembly Service sales for 2025 through 2031. With Photonics Integrated Circuit Packaging and Assembly Service sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Photonics Integrated Circuit Packaging and Assembly Service industry.

This Insight Report provides a comprehensive analysis of the global Photonics Integrated Circuit Packaging and Assembly Service landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Photonics Integrated Circuit Packaging and Assembly Service portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Photonics Integrated Circuit Packaging and Assembly Service market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Photonics Integrated Circuit Packaging and Assembly Service and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Photonics Integrated Circuit Packaging and Assembly Service.

This report presents a comprehensive overview, market shares, and growth opportunities of Photonics Integrated Circuit Packaging and Assembly Service market by product type, application, key players and key regions and countries.

Segmentation by Type:
Optical Coupling & Interconnection
Electrical Interconnection

Segmentation by Application:
Data Center
Communications
Sensor
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
IMEC
Intel
TSMC
ASE
ALTER
GlobalFoundries
LioniX International
EUROPRACTICE
Phix
VLC Photonics
Skorpios Technologies
POET Technologies
PLC Connections
CMC Microsystems
AIM Photonics
Bay Photonics

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