Global IGBT Module Bonding Machine Market Growth 2025-2031

The global IGBT Module Bonding Machine market size is predicted to grow from US$ 199 million in 2025 to US$ 268 million in 2031; it is expected to grow at a CAGR of 5.1% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

IGBT module bonding machine is a semiconductor device specifically designed for the manufacturing of IGBT modules. It is used to precisely fix IGBT chips onto substrates or frames, achieving electrical connection and mechanical stability. Its core purpose is to ensure the high reliability and excellent performance of IGBT modules in high-voltage and high-current applications through processes such as soft soldering or copper/silver sintering. This device supports single-chip or multi-chip module packaging, featuring high-precision positioning, process compatibility, and automated production capabilities, making it suitable for new energy, industrial drives, and other fields. The IGBT module bonding machine enhances packaging efficiency and device performance, meeting the needs of the modern power electronics industry for high-power modules.

United States market for IGBT Module Bonding Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for IGBT Module Bonding Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for IGBT Module Bonding Machine is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key IGBT Module Bonding Machine players cover Infotech AG, ASMPT, Tresky, Mycronic, BESI, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “IGBT Module Bonding Machine Industry Forecast” looks at past sales and reviews total world IGBT Module Bonding Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected IGBT Module Bonding Machine sales for 2025 through 2031. With IGBT Module Bonding Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IGBT Module Bonding Machine industry.

This Insight Report provides a comprehensive analysis of the global IGBT Module Bonding Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IGBT Module Bonding Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IGBT Module Bonding Machine market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IGBT Module Bonding Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IGBT Module Bonding Machine.

This report presents a comprehensive overview, market shares, and growth opportunities of IGBT Module Bonding Machine market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Soft Solder Die Bonder
Cu/Ag Epoxy Sinter Bonder

Segmentation by Application:
Chip
Solder Lug
Spacer
Stacked DBC
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Infotech AG
ASMPT
Tresky
Mycronic
BESI
Canon Machinery
Palomar Technologies
Manncorp
ISP Systems
i3 Engineering
Finetech
Boschman
3S Silicon Tech
Microview Intelligent Packaging Technology (Shenzhen)
Energy Intelligent (Wuxi)
Silicool Innovation Technologies(Zhuhai)
Shenzhen S-King Intelligent Equipment
Shenzhen Xinyichang Technology
Quick Intelligent Equipment
Suzhou Bozhon Semiconductor
Shenzhen Rob
Guangzhou Top-leading Intelligent Technology
Shenzhen Liande Automatic Equipment

Key Questions Addressed in this Report

What is the 10-year outlook for the global IGBT Module Bonding Machine market?

What factors are driving IGBT Module Bonding Machine market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do IGBT Module Bonding Machine market opportunities vary by end market size?

How does IGBT Module Bonding Machine break out by Type, by Application?

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