Global IC Package Heat Spreaders Market Growth 2025-2031

The global IC Package Heat Spreaders market size is predicted to grow from US$ 731 million in 2025 to US$ 1243 million in 2031; it is expected to grow at a CAGR of 9.3% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

A heat spreader is high thermal conductive metallic materials for efficient heat dissipation from an IC chip in a semiconductor package.

This report studies the Heat Spreaders for semiconductor IC package, include FC (Flip Chip) heat spreaders and BGA heat spreaders. The Flip Chip heat spreaders include Lid/Ring type, Hat type, Flat Top type and Cavity type heat spreaders, etc. These spreaders are used in CPU packages for personal computers, CPU packages for servers, SoC/FPGA packages for automotive devices, Processor packages for communication equipment, and AI processor packages, etc.

Heat spreaders are one of the fundamental heat dissipation components used in various industries. They are typically made of high thermal conductivity metals such as copper or aluminum. In the electronics industry, heat spreaders or heat sinks are installed on electronic components or chips to transfer or dissipate the heat generated by the components using the thermal conductivity of the heat dissipation material itself. Heat spreaders find wide applications in the electronic information industry, semiconductor industry, and optoelectronic component industry, with downstream applications extending to the 3C industry.

Furthermore, electric vehicles (EVs) and hybrid electric vehicles (HEVs) have become a major trend in automotive development. In the inverters and rectifiers of electric vehicles, high-power chip modules pose thermal dissipation challenges. Currently, the mainstream solution for such designs is to use water-cooled heat spreaders. By utilizing highly thermally conductive metal materials, along with metal processing techniques and surface treatments, the chip temperature can be controlled within an acceptable range using water cooling. The thermal design of water-cooled heat spreaders needs to effectively dissipate the heat generated by the chips, while considering the cost and manufacturability aspects of the design for mass production.

Global key IC Package Heat Spreaders players cover Shinko, Honeywell Advanced Materials, Jentech Precision Industrial, I-Chiun, Favor Precision Technology and Shandong Ruisi Precision Industry etc. In terms of revenue, the global three largest companies occupied for a share nearly 85% in 2024.

In terms of heat spreaders size, in past few years, the large size (35*35mm and Above) heat spreaders grew faster, the share will be 66.8% in 2031, from 51.15% in 2024.

In terms of materials, in 2024 the copper heat spreaders are domiating the market, hold 86.14% and in next six years, the stainless steel heat spreaders will grow faster.

In terms of application, in past few years, PC CPU/GPU is the largest application, hold 52.07% in 2024, while Server/Data Center are growing faster.

The future trends in technology will focus on personalized lifestyles, environmental sustainability, aging societies, and human-machine interface. As computer functions become more diverse, computation becomes more complex and faster, and new packaging processes emerge, the demand for heat spreaders with excellent heat dissipation capabilities will increase.

Heat spreaders are fundamental in thermal management in electronic design. In cases where natural convection is insufficient for timely heat dissipation, and forced convection using fans is not yet necessary, heat spreaders are widely used as a solution.

With the advancement of performance and miniaturization processes, the number of transistors in relation to the chip area has increased. This complexity in circuit design does not always result in a 100% improvement in performance. As a result, a significant portion of electrical energy is converted into thermal energy. Additionally, as process miniaturization progresses, leakage power consumption increases, leading to higher power requirements and waste heat generation within the same unit area. Furthermore, with the trend towards compact desktop computers and all-in-one functionality, future mini PCs will need to handle multiple tasks such as information processing and multimedia performance simultaneously. Therefore, effective heat dissipation becomes crucial, making heat spreaders an indispensable solution for efficient thermal management.

Major thermal solution providers are actively exploring new market applications, including gaming consoles, communication devices, servers, automotive electronics, home electronics, and smartphones. The emerging trends of cloud services and the Internet of Things (IoT) in the market contribute to the increasing demand for servers and data centers. As a result, the need for effective heat dissipation in central processing units (CPUs) and connectors becomes more prominent and represents a promising area for further exploration.

LP Information, Inc. (LPI) ' newest research report, the “IC Package Heat Spreaders Industry Forecast” looks at past sales and reviews total world IC Package Heat Spreaders sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Package Heat Spreaders sales for 2025 through 2031. With IC Package Heat Spreaders sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Package Heat Spreaders industry.

This Insight Report provides a comprehensive analysis of the global IC Package Heat Spreaders landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Package Heat Spreaders portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global IC Package Heat Spreaders market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Package Heat Spreaders and breaks down the forecast by Material, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Package Heat Spreaders.

This report presents a comprehensive overview, market shares, and growth opportunities of IC Package Heat Spreaders market by product type, application, key manufacturers and key regions and countries.

Segmentation by Material:
Cu Heat Spreader
Stainless Steel Heat Spreader

Segmentation by Application:
PC CPU/GPU Package
Server/Data Center/AI Chip Package
Automotive SoC/FPGA Package
Gaming Console
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Shinko
Honeywell Advanced Materials
Jentech Precision Industrial
I-Chiun
Favor Precision Technology
Niching Industrial Corporation
Fastrong Technologies Corp.
ECE (Excel Cell Electronic)
Shandong Ruisi Precision Industry
HongRiDa Electronics (HRD)
TBT Co., Ltd

Key Questions Addressed in this Report

What is the 10-year outlook for the global IC Package Heat Spreaders market?

What factors are driving IC Package Heat Spreaders market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do IC Package Heat Spreaders market opportunities vary by end market size?

How does IC Package Heat Spreaders break out by Material, by Application?

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