Global Fully Automatic BGA Solder Ball Mounter Market Growth 2026-2032
Description
The global Fully Automatic BGA Solder Ball Mounter market size is predicted to grow from US$ 348 million in 2025 to US$ 530 million in 2032; it is expected to grow at a CAGR of 6.3% from 2026 to 2032.
Fully Automatic BGA Solder Ball Mounter is a high-precision electronic device that uses ultrasonic vibration to inject silicone gel material into the hole of the PCB board through a special mold, so that the PCB board and the curing agent react chemically, thereby completing the installation of the circuit and the realization of the function. It has high precision, high efficiency, and high degree of automation, and is widely used in the field of chip and wafer processing.
United States market for Fully Automatic BGA Solder Ball Mounter is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
China market for Fully Automatic BGA Solder Ball Mounter is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Europe market for Fully Automatic BGA Solder Ball Mounter is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Global key Fully Automatic BGA Solder Ball Mounter players cover Epson Corporation, ASMPT, Shibuya Corporation, Aurigin Technology, Athlete FA Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2025.
LP Information, Inc. (LPI) ' newest research report, the “Fully Automatic BGA Solder Ball Mounter Industry Forecast” looks at past sales and reviews total world Fully Automatic BGA Solder Ball Mounter sales in 2025, providing a comprehensive analysis by region and market sector of projected Fully Automatic BGA Solder Ball Mounter sales for 2026 through 2032. With Fully Automatic BGA Solder Ball Mounter sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fully Automatic BGA Solder Ball Mounter industry.
This Insight Report provides a comprehensive analysis of the global Fully Automatic BGA Solder Ball Mounter landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Fully Automatic BGA Solder Ball Mounter portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Fully Automatic BGA Solder Ball Mounter market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fully Automatic BGA Solder Ball Mounter and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fully Automatic BGA Solder Ball Mounter.
This report presents a comprehensive overview, market shares, and growth opportunities of Fully Automatic BGA Solder Ball Mounter market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Ball Planting Accuracy ±0.015mm
Ball Planting Accuracy ±0.025mm
Ball Planting Accuracy ±0.030mm
Segmentation by Application:
Substrate
Chip
Wafer
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Epson Corporation
ASMPT
Shibuya Corporation
Aurigin Technology
Athlete FA Corporation
KOSES Co.,Ltd
Rokko
Shinapex Co
SSP Inc
ZEN VOCE CORPORATION
Shenzhen Dez Smart Tech
Shanghai Techsense
Shenzhen Dataifeng Technology
Fortune Tell Co., Ltd.
Meeyear Group
Key Questions Addressed in this Report
What is the 10-year outlook for the global Fully Automatic BGA Solder Ball Mounter market?
What factors are driving Fully Automatic BGA Solder Ball Mounter market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Fully Automatic BGA Solder Ball Mounter market opportunities vary by end market size?
How does Fully Automatic BGA Solder Ball Mounter break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Fully Automatic BGA Solder Ball Mounter is a high-precision electronic device that uses ultrasonic vibration to inject silicone gel material into the hole of the PCB board through a special mold, so that the PCB board and the curing agent react chemically, thereby completing the installation of the circuit and the realization of the function. It has high precision, high efficiency, and high degree of automation, and is widely used in the field of chip and wafer processing.
United States market for Fully Automatic BGA Solder Ball Mounter is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
China market for Fully Automatic BGA Solder Ball Mounter is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Europe market for Fully Automatic BGA Solder Ball Mounter is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Global key Fully Automatic BGA Solder Ball Mounter players cover Epson Corporation, ASMPT, Shibuya Corporation, Aurigin Technology, Athlete FA Corporation, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2025.
LP Information, Inc. (LPI) ' newest research report, the “Fully Automatic BGA Solder Ball Mounter Industry Forecast” looks at past sales and reviews total world Fully Automatic BGA Solder Ball Mounter sales in 2025, providing a comprehensive analysis by region and market sector of projected Fully Automatic BGA Solder Ball Mounter sales for 2026 through 2032. With Fully Automatic BGA Solder Ball Mounter sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fully Automatic BGA Solder Ball Mounter industry.
This Insight Report provides a comprehensive analysis of the global Fully Automatic BGA Solder Ball Mounter landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Fully Automatic BGA Solder Ball Mounter portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Fully Automatic BGA Solder Ball Mounter market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fully Automatic BGA Solder Ball Mounter and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fully Automatic BGA Solder Ball Mounter.
This report presents a comprehensive overview, market shares, and growth opportunities of Fully Automatic BGA Solder Ball Mounter market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Ball Planting Accuracy ±0.015mm
Ball Planting Accuracy ±0.025mm
Ball Planting Accuracy ±0.030mm
Segmentation by Application:
Substrate
Chip
Wafer
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Epson Corporation
ASMPT
Shibuya Corporation
Aurigin Technology
Athlete FA Corporation
KOSES Co.,Ltd
Rokko
Shinapex Co
SSP Inc
ZEN VOCE CORPORATION
Shenzhen Dez Smart Tech
Shanghai Techsense
Shenzhen Dataifeng Technology
Fortune Tell Co., Ltd.
Meeyear Group
Key Questions Addressed in this Report
What is the 10-year outlook for the global Fully Automatic BGA Solder Ball Mounter market?
What factors are driving Fully Automatic BGA Solder Ball Mounter market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Fully Automatic BGA Solder Ball Mounter market opportunities vary by end market size?
How does Fully Automatic BGA Solder Ball Mounter break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
120 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Fully Automatic BGA Solder Ball Mounter by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Fully Automatic BGA Solder Ball Mounter by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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