Global Copper Strip for Ceramic Substrates Market Growth 2025-2031
Description
The global Copper Strip for Ceramic Substrates market size is predicted to grow from US$ 207 million in 2025 to US$ 426 million in 2031; it is expected to grow at a CAGR of 12.8% from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
This report studies copper strips for ceramic substrates, which mainly include DBC and AMB ceramic substrates, and the main specification of copper strips is C1020. Currently, the global copper strips for ceramic substrates are mainly dominated by German and Japanese companies.
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate.
Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global DBC ceramic substrates market is projected to reach US$ 755 million by 2035 from an estimated US$ 470.3 million in 2024, at a CAGR of 4.37% during 2025 and 2035. The market would witness growth owing to driving factors such as the increasing need for IGBT power modules used in new energy vehicles. The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024.
The global AMB Ceramic Substrate market is projected to grow from US$ 443.46 million in 2024 to US$ 1,307 million by 2030, at a Compound Annual Growth Rate (CAGR) of 19.74% during the forecast period. The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue. Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
LP Information, Inc. (LPI) ' newest research report, the “Copper Strip for Ceramic Substrates Industry Forecast” looks at past sales and reviews total world Copper Strip for Ceramic Substrates sales in 2024, providing a comprehensive analysis by region and market sector of projected Copper Strip for Ceramic Substrates sales for 2025 through 2031. With Copper Strip for Ceramic Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Copper Strip for Ceramic Substrates industry.
This Insight Report provides a comprehensive analysis of the global Copper Strip for Ceramic Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Copper Strip for Ceramic Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Copper Strip for Ceramic Substrates market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Copper Strip for Ceramic Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Copper Strip for Ceramic Substrates.
This report presents a comprehensive overview, market shares, and growth opportunities of Copper Strip for Ceramic Substrates market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
C1020 Alloy
Others
Segmentation by Application:
DBC Ceramic Substrate
AMB Ceramic Substrate
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Aurubis AG
Proterial Metals, Ltd
Furukawa Electric
Mitsubishi Materials
Tongling Jinvi Copper Corp.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Copper Strip for Ceramic Substrates market?
What factors are driving Copper Strip for Ceramic Substrates market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Copper Strip for Ceramic Substrates market opportunities vary by end market size?
How does Copper Strip for Ceramic Substrates break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
This report studies copper strips for ceramic substrates, which mainly include DBC and AMB ceramic substrates, and the main specification of copper strips is C1020. Currently, the global copper strips for ceramic substrates are mainly dominated by German and Japanese companies.
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate.
Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.
The global DBC ceramic substrates market is projected to reach US$ 755 million by 2035 from an estimated US$ 470.3 million in 2024, at a CAGR of 4.37% during 2025 and 2035. The market would witness growth owing to driving factors such as the increasing need for IGBT power modules used in new energy vehicles. The global DBC ceramic substrates market is dominated by few players like Rogers Corporation, Ferrotec, NGK Electronics Devices, KCC, Shengda Tech, BYD, Heraeus Electronics and Nanjing Zhongjiang New Material, etc. Global five players hold a share over 79.8 percent in 2024.
The global AMB Ceramic Substrate market is projected to grow from US$ 443.46 million in 2024 to US$ 1,307 million by 2030, at a Compound Annual Growth Rate (CAGR) of 19.74% during the forecast period. The global key manufacturers of AMB Ceramic Substrate include Rogers Corporation, Ferrotec, BYD, Toshiba Materials, Heraeus Electronics, Denka, Proterial and Mitsubishi Materials, etc. In 2023, the global top eight players had a share approximately 85% in terms of revenue. Currently the AMB ceramic substrates are mainly produced in Japan, Germany and China, which account for 27.3%, 24.56% and 43.5% of the market share respectively in 2023. It is expected that China's production share will reach 57% in 2030. As NGK Electronics Devices and Ferrotec have started or built factories to produce AMB in Malaysia, Southeast Asia is expected to play an important role as a production base in the next few years.
LP Information, Inc. (LPI) ' newest research report, the “Copper Strip for Ceramic Substrates Industry Forecast” looks at past sales and reviews total world Copper Strip for Ceramic Substrates sales in 2024, providing a comprehensive analysis by region and market sector of projected Copper Strip for Ceramic Substrates sales for 2025 through 2031. With Copper Strip for Ceramic Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Copper Strip for Ceramic Substrates industry.
This Insight Report provides a comprehensive analysis of the global Copper Strip for Ceramic Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Copper Strip for Ceramic Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Copper Strip for Ceramic Substrates market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Copper Strip for Ceramic Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Copper Strip for Ceramic Substrates.
This report presents a comprehensive overview, market shares, and growth opportunities of Copper Strip for Ceramic Substrates market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
C1020 Alloy
Others
Segmentation by Application:
DBC Ceramic Substrate
AMB Ceramic Substrate
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Aurubis AG
Proterial Metals, Ltd
Furukawa Electric
Mitsubishi Materials
Tongling Jinvi Copper Corp.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Copper Strip for Ceramic Substrates market?
What factors are driving Copper Strip for Ceramic Substrates market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Copper Strip for Ceramic Substrates market opportunities vary by end market size?
How does Copper Strip for Ceramic Substrates break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
Table of Contents
76 Pages
- *This is a tentative TOC and the final deliverable is subject to change.*
- 1 Scope of the Report
- 2 Executive Summary
- 3 Global by Company
- 4 World Historic Review for Copper Strip for Ceramic Substrates by Geographic Region
- 5 Americas
- 6 APAC
- 7 Europe
- 8 Middle East & Africa
- 9 Market Drivers, Challenges and Trends
- 10 Manufacturing Cost Structure Analysis
- 11 Marketing, Distributors and Customer
- 12 World Forecast Review for Copper Strip for Ceramic Substrates by Geographic Region
- 13 Key Players Analysis
- 14 Research Findings and Conclusion
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