Three-Dimensional Integrated Circuit Market - Forecasts from 2025 to 2030
Description
The Three-Dimensional Integrated Circuit Market is expected to grow from US$12.899 billion in 2025 to US$20.681 billion in 2030, at a CAGR of 9.90%.
Three-Dimensional Integrated Circuit Market Trends:
3D integrated circuits (ICs) are metal oxide semiconductor (MOS) electronic devices constructed by stacking silicon dies or wafers vertically and connecting them through-silicon vias (TSVs) or copper connections (Cu-Cu), achieving performance improvements at lower power consumption with a smaller footprint compared to two-dimensional methods. Further, it has a high bandwidth and heterogeneous integration providing greater flexibility.
Growing investment in R&D has been a strategic development for several companies. It has broadened the scope to the industry. Further, with the significant advancement of technology, 3D IC will propel the 3DIC market. The increasing advent of artificial intelligence (AI), Internet of Things (IoT), wearable electronics, AR/VR, and high-performing computers will be snowballing the demand for 3D IC.
Three-Dimensional Integrated Circuit Market Segment Analysis:
Based on application, the three-dimensional integrated circuit market has been segmented into MEMS, storage devices, sensors, and others. The sensor application was valued at US$XX billion in the year 2020 and is projected to grow at a CAGR of XX% to attain a market size of US$XX billion by 2027. A sensor is a device used to measure a property, such as pressure, position, temperature, or acceleration, and respond with feedback. Also known as transducers, sensors are one of the fundamental building blocks of modern data acquisition systems. They have a wide range of applications from flood & water level monitoring systems, environmental monitoring, traffic monitoring & controlling, energy saving in artificial lighting, remote system monitoring & equipment fault diagnostics, and precision agriculture & animal tracking.
These diverse applications across several industry verticals like healthcare, automotive, and manufacturing industries, among others, are driving the market ahead in the current period. It makes the functioning of the sensor superior and better. Hence, the sensors market is projected to grow at an exponential rate, driving demand for 3-D IC. A 3-D IC in sensors gives the sensor a technological edge over a normal IC. Furthermore, the rise in IoT and superior demand for better screening and sensing technology is anticipated to expand the market demand at a significant pace.
Three-Dimensional Integrated Circuit Market Growth Drivers:
Growing research and innovation in 3D IC is driving the market growth. Increasing adoption of innovative technologies like AR/VR, Artificial Intelligence, IoT, and high-performing computers is propelling the use of 3D ICs. This is anticipated to grow with the fourth industrial revolution. Increasing R&D and innovation is a top priority for several companies to stay in the game. Companies are entering into strategic mergers and acquisitions to stay at the top of the game. In February 2021, ASM Pacific Technology and EV Group entered into a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding is a crucial process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology. This technology combines chips with various process nodes to power new applications like 5G, high-performance computing (HPC), and artificial intelligence (AI).
Further, increasing technology is also increasing the patents and copyrights worldwide. In August 2022, GBT Technologies Inc. received an issue notification from the United States Patent and Trademark Office (USPTO) for its 3D, Multi-Planar IC design and manufacturing technology continuation patent application. This is the second patent application for its 3D, MP microchip architecture. The original innovation offered a novel approach to integrated circuit design and production that allows for the integration of cutting-edge analog, digital, and mixed-type ICs on a silicon wafer.
The current patent aims to provide a design to reduce the cost and energy and produce sophisticated microchips with higher performance. These techniques aim to make it possible to design and manufacture them on silicon with a smaller footprint. Such innovation and research are anticipated to significantly boost the market in the forecast period.
Three-Dimensional Integrated Circuit Companies:
Taiwan Semiconductor Manufacturing Company
Invensas Corporation
Amkor Technology Inc.
Xilinx, Inc.
Tezzaron Semiconductor Corporation
Three-Dimensional Integrated Circuit Market Segmentation:
By Technology
Monolithic
Wafer on Water
Die on Wafer
Die on Die
By Application
MEMS
Storage Device
Sensors
Others
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
UAE
Others
Asia Pacific
China
India
Japan
South Korea
Indoensia
Thailand
Others
Three-Dimensional Integrated Circuit Market Trends:
3D integrated circuits (ICs) are metal oxide semiconductor (MOS) electronic devices constructed by stacking silicon dies or wafers vertically and connecting them through-silicon vias (TSVs) or copper connections (Cu-Cu), achieving performance improvements at lower power consumption with a smaller footprint compared to two-dimensional methods. Further, it has a high bandwidth and heterogeneous integration providing greater flexibility.
Growing investment in R&D has been a strategic development for several companies. It has broadened the scope to the industry. Further, with the significant advancement of technology, 3D IC will propel the 3DIC market. The increasing advent of artificial intelligence (AI), Internet of Things (IoT), wearable electronics, AR/VR, and high-performing computers will be snowballing the demand for 3D IC.
Three-Dimensional Integrated Circuit Market Segment Analysis:
Based on application, the three-dimensional integrated circuit market has been segmented into MEMS, storage devices, sensors, and others. The sensor application was valued at US$XX billion in the year 2020 and is projected to grow at a CAGR of XX% to attain a market size of US$XX billion by 2027. A sensor is a device used to measure a property, such as pressure, position, temperature, or acceleration, and respond with feedback. Also known as transducers, sensors are one of the fundamental building blocks of modern data acquisition systems. They have a wide range of applications from flood & water level monitoring systems, environmental monitoring, traffic monitoring & controlling, energy saving in artificial lighting, remote system monitoring & equipment fault diagnostics, and precision agriculture & animal tracking.
These diverse applications across several industry verticals like healthcare, automotive, and manufacturing industries, among others, are driving the market ahead in the current period. It makes the functioning of the sensor superior and better. Hence, the sensors market is projected to grow at an exponential rate, driving demand for 3-D IC. A 3-D IC in sensors gives the sensor a technological edge over a normal IC. Furthermore, the rise in IoT and superior demand for better screening and sensing technology is anticipated to expand the market demand at a significant pace.
Three-Dimensional Integrated Circuit Market Growth Drivers:
Growing research and innovation in 3D IC is driving the market growth. Increasing adoption of innovative technologies like AR/VR, Artificial Intelligence, IoT, and high-performing computers is propelling the use of 3D ICs. This is anticipated to grow with the fourth industrial revolution. Increasing R&D and innovation is a top priority for several companies to stay in the game. Companies are entering into strategic mergers and acquisitions to stay at the top of the game. In February 2021, ASM Pacific Technology and EV Group entered into a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding is a crucial process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology. This technology combines chips with various process nodes to power new applications like 5G, high-performance computing (HPC), and artificial intelligence (AI).
Further, increasing technology is also increasing the patents and copyrights worldwide. In August 2022, GBT Technologies Inc. received an issue notification from the United States Patent and Trademark Office (USPTO) for its 3D, Multi-Planar IC design and manufacturing technology continuation patent application. This is the second patent application for its 3D, MP microchip architecture. The original innovation offered a novel approach to integrated circuit design and production that allows for the integration of cutting-edge analog, digital, and mixed-type ICs on a silicon wafer.
The current patent aims to provide a design to reduce the cost and energy and produce sophisticated microchips with higher performance. These techniques aim to make it possible to design and manufacture them on silicon with a smaller footprint. Such innovation and research are anticipated to significantly boost the market in the forecast period.
Three-Dimensional Integrated Circuit Companies:
Taiwan Semiconductor Manufacturing Company
Invensas Corporation
Amkor Technology Inc.
Xilinx, Inc.
Tezzaron Semiconductor Corporation
Three-Dimensional Integrated Circuit Market Segmentation:
By Technology
Monolithic
Wafer on Water
Die on Wafer
Die on Die
By Application
MEMS
Storage Device
Sensors
Others
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
UAE
Others
Asia Pacific
China
India
Japan
South Korea
Indoensia
Thailand
Others
Table of Contents
142 Pages
- 1. EXECUTIVE SUMMARY
- 2. MARKET SNAPSHOT
- 2.1. Market Overview
- 2.2. Market Definition
- 2.3. Scope of the Study
- 2.4. Market Segmentation
- 3. BUSINESS LANDSCAPE
- 3.1. Market Drivers
- 3.2. Market Restraints
- 3.3. Market Opportunities
- 3.4. Porter’s Five Forces Analysis
- 3.5. Industry Value Chain Analysis
- 3.6. Policies and Regulations
- 3.7. Strategic Recommendations
- 4. TECHNOLOGICAL OUTLOOK
- 5. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY TECHNOLOGY
- 5.1. Introduction
- 5.2. Monolithic
- 5.3. Wafer on Water
- 5.4. Die on Wafer
- 5.5. Die on Die
- 6. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY APPLICATION
- 6.1. Introduction
- 6.2. MEMS
- 6.3. Storage Device
- 6.4. Sensors
- 6.5. Others
- 7. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY GEOGRAPHY
- 7.1. Introduction
- 7.2. North America
- 7.2.1. USA
- 7.2.2. Canada
- 7.2.3. Mexico
- 7.3. South America
- 7.3.1. Brazil
- 7.3.2. Argentina
- 7.3.3. Others
- 7.4. Europe
- 7.4.1. Germany
- 7.4.2. France
- 7.4.3. United Kingdom
- 7.4.4. Spain
- 7.4.5. Others
- 7.5. Middle East and Africa
- 7.5.1. Saudi Arabia
- 7.5.2. UAE
- 7.5.3. Others
- 7.6. Asia Pacific
- 7.6.1. China
- 7.6.2. India
- 7.6.3. Japan
- 7.6.4. South Korea
- 7.6.5. Indonesia
- 7.6.6. Thailand
- 7.6.7. Others
- 8. COMPETITIVE ENVIRONMENT AND ANALYSIS
- 8.1. Major Players and Strategy Analysis
- 8.2. Market Share Analysis
- 8.3. Mergers, Acquisitions, Agreements, and Collaborations
- 8.4. Competitive Dashboard
- 9. COMPANY PROFILES
- 9.1. Taiwan Semiconductor Manufacturing Company
- 9.2. Invensas Corporation
- 9.3. Amkor Technology Inc.
- 9.4. Xilinx, Inc.
- 9.5. Tezzaron Semiconductor Corporation
- 9.6. Aveni Inc.
- 9.7. JCET Group
- 9.8. STMicroelectronics
- 9.9. Advanced Semiconductor Engineering Inc. (ASE)
- 9.10. IBM
- 10. APPENDIX
- 10.1. Currency
- 10.2. Assumptions
- 10.3. Base and Forecast Years Timeline
- 10.4. Key Benefits for the Stakeholders
- 10.5. Research Methodology
- 10.6. Abbreviations
Pricing
Currency Rates
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