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Global LCP Based Molded Interconnect Devices Market Size, Share & Industry Analysis Report By Process (Laser Direct Structuring (LDS), Two-Shot Molding, and Other Process), By Product (Antennas, Connectors & Interconnects, Sensor Housings, and Other Produ

Publisher Knowledge Based Value (KBV) Research
Published Nov 04, 2025
Length 548 Pages
SKU # KBV20576012

Description

The Global LCP Based Molded Interconnect Devices Market size is expected to reach USD 2.33 billion by 2032, rising at a market growth of 17.0% CAGR during the forecast period.

Key Highlights:
  • The Asia Pacific LCP Based Molded Interconnect Devices market dominated the Global Market in 2024, accounting for a 35.69% revenue share in 2024.
  • The US LCP Based Molded Interconnect Devices market is expected to continue its dominance in North America region, thereby reaching a market size of 446.14 million by 2032.
  • Among the various by Processor segments, the Laser Direct Structuring (LDS) dominated the United States market contributing a revenue share of 52.73% in 2024.
  • In terms of the end use segmentation, the Automotive segment is projected to dominate the global market with the projected revenue share of 31.76% in 2032.
  • Antennas led the Product segments in 2024, capturing a 31.17% revenue share and is projected to continue its dominance during projected period.
Molded Interconnect Devices (MIDs) have shifted modern electronics by deploying mechanical and electrical functions into a single 3D structure, eliminating the requirement of separate circuit boards and connectors. The advent of Liquid Crystal Polymer as a base material marked a substantial milestone, offering better chemical, thermal, and dimensional properties perfect for high-precision manufacturing. The integration of Laser Direct Structuring has also revolutionized production, enabling scalable and intricate metallization on complex surfaces. As the partnership between material scientists, engineers, and polymer chemists deepened, LCP-driven MIDs developed into essential components across various sectors-allowing miniaturized, high-performance devices in telecommunications, medical technologies, and automotive systems.

The LCP-based molded interconnect devices market is anticipated to grow, supported by elements including rising industrial adoption, rapid technological advancement, and strategic partnerships. Furthermore, trends like design automation, structuring, precision laser, and the usage of LCP in high-reliability industries such as aerospace, healthcare, and automotive are expanding the LCP-based molded interconnect devices market’s growth. Key players are pursuing intensive R&D partnerships, customer-centric strategies, and vertical integration to improve streamline design, material performance, and assure quality consistency. The competition in the market is intensifying with large companies acquiring regional specialists. Reliability, innovation, and cross-sector partnerships are transforming LCP-based MIDs into an essential technology for the next generation of durable, compact, and smart electronic systems.

COVID 19 Impact Analysis

The COVID-19 pandemic severely disrupted the LCP-based molded interconnect devices (MID) market due to supply chain breakdowns, factory shutdowns, and shortages of key raw materials like high-performance LCP polymers. Production slowdowns, transportation delays, and increased costs affected manufacturers across consumer electronics, automotive, and industrial sectors. Demand from these industries declined sharply as lockdowns reduced production and consumer spending, leading to postponed projects and investments. R&D activities were hindered by travel restrictions and remote work, slowing innovation and product development. The crisis exposed supply chain vulnerabilities and overdependence on specific regions, resulting in long-term challenges in procurement, quality control, and inventory management, even as the market gradually recovered with resumed operations. Thus, the COVID-19 pandemic had a negative impact on the market.

Process Outlook

Based on process, the LCP based molded interconnect devices market is characterized into laser direct structuring (LDS, two-shot molding, and others.  The two-shot molding segment attained 29% revenue share in the LCP Based Molded Interconnect Devices Market in 2024.  The two-shot molding segment contributes significantly to the market through its versatile and efficient manufacturing approach. This process involves injecting two distinct materials in sequence within a single mold, enabling the formation of components with multiple functions and enhanced structural integrity.

End Use Outlook

By end use, the LCP based molded interconnect devices market is divided into automotive, consumer electronics, telecommunication, aerospace & defense, healthcare, and others. The consumer electronics segment gained 25% revenue share in the LCP based molded interconnect devices market in 2024. LCP-based molded interconnect components offer excellent electrical insulation, dimensional stability, and design flexibility, which are essential for producing sleek and reliable devices. The trend toward miniaturization and multifunctionality further amplifies the use of these components, helping manufacturers meet consumer expectations for performance and durability.

Regional Outlook

Region-wise, the LCP Based Molded Interconnect Devices Market is analyzed across North America, Europe, Asia Pacific, and LAMEA.  The Asia Pacific segment gained 36% revenue share in the LCP Based Molded Interconnect Devices Market in 2024.  The LPC-based molded interconnect devices market is predicted to experience prominent growth in the upcoming years. This is driven by 5G RF modules, medical/industrial miniaturization, and automotive electrification. The North America region is anticipated to lead the market with the increased adoption of laser-direct-structuring (LDS) and other MID processes across the aerospace, automobile, and telecom industries. In addition to this, the European market is expanding due to strong OEM investments in Germany and the UK. Further, the surging demand for medical devices is supporting expansion in the region.

In the Asia Pacific and LAMEA regions, the LCP-based Molded Interconnect Devices Market is predicted to experience significant growth. The market is led by Japan, South Korea, and China, where 5G infrastructure rollout, electronics manufacturing, and a large automotive supply chain surge demand for MID. Furthermore, in LAMEA, the market is driven by auto electrification, regional electronics sourcing, and infrastructure upgrades. Also, opportunities in the GCC market and South Africa are favourable, backed by the automotive and telecom industries.

List of Key Companies Profiled
  • Molex, LLC (Koch Industries, Inc.)
  • TE Connectivity Ltd.
  • Kyocera Corporation
  • Amphenol Corporation
  • Sumitomo Electric Industries, Ltd.
  • Taoglas
  • HARTING Technology Group
  • LPKF Laser & Electronics SE
  • Celanese Corporation
  • Solvay SA
Global LCP Based Molded Interconnect Devices Market Report Segmentation

By Process
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Other Process
By Product
  • Antennas
  • Connectors & Interconnects
  • Sensor Housings
  • Other Product
By End Use
  • Automotive
  • Consumer Electronics
  • Telecommunication
  • Aerospace & Defense
  • Healthcare
  • Other End Use
By Geography
  • North America
  • US
  • Canada
  • Mexico
  • Rest of North America
  • Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
  • LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Table of Contents

548 Pages
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global LCP Based Molded Interconnect Devices Market, by Process
1.4.2 Global LCP Based Molded Interconnect Devices Market, by Product
1.4.3 Global LCP Based Molded Interconnect Devices Market, by End Use
1.4.4 Global LCP Based Molded Interconnect Devices Market, by Geography
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario 
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Market Trends – LCP Based Molded Interconnect Devices Market
Chapter 5. State of Competition - LCP Based Molded Interconnect Devices Market
Chapter 6. Value Chain Analysis of LCP Based Molded Interconnect Devices Market
Chapter 7. Competition Analysis – Global
7.1 Market Share Analysis, 2024
7.2 Porter Five Forces Analysis
Chapter 8. Product Life Cycle – LCP Based Molded Interconnect Devices Market
Chapter 9. Market Consolidation – LCP Based Molded Interconnect Devices Market
Chapter 10. Key Customer Criteria – LCP Based Molded Interconnect Devices Market
Chapter 11. Global LCP Based Molded Interconnect Devices Market by Process
11.1 Global Laser Direct Structuring (LDS) Market by Region
11.2 Global Two-Shot Molding Market by Region
11.3 Global Other Process Market by Region
Chapter 12. Global LCP Based Molded Interconnect Devices Market by Product
12.1 Global Antennas Market by Region
12.2 Global Connectors & Interconnects Market by Region
12.3 Global Sensor Housings Market by Region
12.4 Global Other Product Market by Region
Chapter 13. Global LCP Based Molded Interconnect Devices Market by End Use
13.1 Global Automotive Market by Region
13.2 Global Consumer Electronics Market by Region
13.3 Global Telecommunication Market by Region
13.4 Global Aerospace & Defense Market by Region
13.5 Global Healthcare Market by Region
13.6 Global Other End Use Market by Region
Chapter 14. Global LCP Based Molded Interconnect Devices Market by Region
14.1 North America LCP Based Molded Interconnect Devices Market
14.2 Key Factors Impacting the Market
14.2.1 Market Drivers
14.2.2 Market Restraints
14.2.3 Market Opportunities
14.2.4 Market Challenges
14.2.5 Market Trends – North America LCP Based Molded Interconnect Devices Market
14.2.6 State of Competition – North America LCP Based Molded Interconnect Devices Market
14.2.7 North America LCP Based Molded Interconnect Devices Market by Process
14.2.7.1 North America Laser Direct Structuring (LDS) Market by Country
14.2.7.2 North America Two-Shot Molding Market by Country
14.2.7.3 North America Other Process Market by Country
14.2.8 North America LCP Based Molded Interconnect Devices Market by Product
14.2.8.1 North America Antennas Market by Country
14.2.8.2 North America Connectors & Interconnects Market by Country
14.2.8.3 North America Sensor Housings Market by Country
14.2.8.4 North America Other Product Market by Country
14.2.9 North America LCP Based Molded Interconnect Devices Market by End Use
14.2.9.1 North America Automotive Market by Country
14.2.9.2 North America Consumer Electronics Market by Country
14.2.9.3 North America Telecommunication Market by Country
14.2.9.4 North America Aerospace & Defense Market by Country
14.2.9.5 North America Healthcare Market by Country
14.2.9.6 North America Other End Use Market by Country
14.2.10 North America LCP Based Molded Interconnect Devices Market by Country
14.2.10.1 US LCP Based Molded Interconnect Devices Market
14.2.10.1.1 US LCP Based Molded Interconnect Devices Market by Process
14.2.10.1.2 US LCP Based Molded Interconnect Devices Market by Product
14.2.10.1.3 US LCP Based Molded Interconnect Devices Market by End Use
14.2.10.2 Canada LCP Based Molded Interconnect Devices Market
14.2.10.2.1 Canada LCP Based Molded Interconnect Devices Market by Process
14.2.10.2.2 Canada LCP Based Molded Interconnect Devices Market by Product
14.2.10.2.3 Canada LCP Based Molded Interconnect Devices Market by End Use
14.2.10.3 Mexico LCP Based Molded Interconnect Devices Market
14.2.10.3.1 Mexico LCP Based Molded Interconnect Devices Market by Process
14.2.10.3.2 Mexico LCP Based Molded Interconnect Devices Market by Product
14.2.10.3.3 Mexico LCP Based Molded Interconnect Devices Market by End Use
14.2.10.4 Rest of North America LCP Based Molded Interconnect Devices Market
14.2.10.4.1 Rest of North America LCP Based Molded Interconnect Devices Market by Process
14.2.10.4.2 Rest of North America LCP Based Molded Interconnect Devices Market by Product
14.2.10.4.3 Rest of North America LCP Based Molded Interconnect Devices Market by End Use
14.3 Europe LCP Based Molded Interconnect Devices Market
14.4 Key Factors Impacting the Market
14.4.1 Market Drivers
14.4.2 Market Restraints
14.4.3 Market Opportunities
14.4.4 Market Challenges
14.4.5 Market Trends – Europe LCP Based Molded Interconnect Devices Market
14.4.6 State of Competition - Europe LCP Based Molded Interconnect Devices Market
14.4.7 Europe LCP Based Molded Interconnect Devices Market by Process
14.4.7.1 Europe Laser Direct Structuring (LDS) Market by Country
14.4.7.2 Europe Two-Shot Molding Market by Country
14.4.7.3 Europe Other Process Market by Country
14.4.8 Europe LCP Based Molded Interconnect Devices Market by Product
14.4.8.1 Europe Antennas Market by Country
14.4.8.2 Europe Connectors & Interconnects Market by Country
14.4.8.3 Europe Sensor Housings Market by Country
14.4.8.4 Europe Other Product Market by Country
14.4.9 Europe LCP Based Molded Interconnect Devices Market by End Use
14.4.9.1 Europe Automotive Market by Country
14.4.9.2 Europe Consumer Electronics Market by Country
14.4.9.3 Europe Telecommunication Market by Country
14.4.9.4 Europe Aerospace & Defense Market by Country
14.4.9.5 Europe Healthcare Market by Country
14.4.9.6 Europe Other End Use Market by Country
14.4.10 Europe LCP Based Molded Interconnect Devices Market by Country
14.4.10.1 Germany LCP Based Molded Interconnect Devices Market
14.4.10.1.1 Germany LCP Based Molded Interconnect Devices Market by Process
14.4.10.1.2 Germany LCP Based Molded Interconnect Devices Market by Product
14.4.10.1.3 Germany LCP Based Molded Interconnect Devices Market by End Use
14.4.10.2 UK LCP Based Molded Interconnect Devices Market
14.4.10.2.1 UK LCP Based Molded Interconnect Devices Market by Process
14.4.10.2.2 UK LCP Based Molded Interconnect Devices Market by Product
14.4.10.2.3 UK LCP Based Molded Interconnect Devices Market by End Use
14.4.10.3 France LCP Based Molded Interconnect Devices Market
14.4.10.3.1 France LCP Based Molded Interconnect Devices Market by Process
14.4.10.3.2 France LCP Based Molded Interconnect Devices Market by Product
14.4.10.3.3 France LCP Based Molded Interconnect Devices Market by End Use
14.4.10.4 Russia LCP Based Molded Interconnect Devices Market
14.4.10.4.1 Russia LCP Based Molded Interconnect Devices Market by Process
14.4.10.4.2 Russia LCP Based Molded Interconnect Devices Market by Product
14.4.10.4.3 Russia LCP Based Molded Interconnect Devices Market by End Use
14.4.10.5 Spain LCP Based Molded Interconnect Devices Market
14.4.10.5.1 Spain LCP Based Molded Interconnect Devices Market by Process
14.4.10.5.2 Spain LCP Based Molded Interconnect Devices Market by Product
14.4.10.5.3 Spain LCP Based Molded Interconnect Devices Market by End Use
14.4.10.6 Italy LCP Based Molded Interconnect Devices Market
14.4.10.6.1 Italy LCP Based Molded Interconnect Devices Market by Process
14.4.10.6.2 Italy LCP Based Molded Interconnect Devices Market by Product
14.4.10.6.3 Italy LCP Based Molded Interconnect Devices Market by End Use
14.4.10.7 Rest of Europe LCP Based Molded Interconnect Devices Market
14.4.10.7.1 Rest of Europe LCP Based Molded Interconnect Devices Market by Process
14.4.10.7.2 Rest of Europe LCP Based Molded Interconnect Devices Market by Product
14.4.10.7.3 Rest of Europe LCP Based Molded Interconnect Devices Market by End Use
14.5 Asia Pacific LCP Based Molded Interconnect Devices Market
14.6 Key Factors Impacting the Market
14.6.1 Market Drivers
14.6.2 Market Restraints
14.6.3 Market Opportunities
14.6.4 Market Challenges
14.6.5 Market Trends – Asia Pacific LCP Based Molded Interconnect Devices Market
14.6.6 State of Competition - Asia Pacific LCP-based Molded Interconnect Devices (MID) market
14.6.7 Asia Pacific LCP Based Molded Interconnect Devices Market by Process
14.6.7.1 Asia Pacific Laser Direct Structuring (LDS) Market by Country
14.6.7.2 Asia Pacific Two-Shot Molding Market by Country
14.6.7.3 Asia Pacific Other Process Market by Country
14.6.8 Asia Pacific LCP Based Molded Interconnect Devices Market by Product
14.6.8.1 Asia Pacific Antennas Market by Country
14.6.8.2 Asia Pacific Connectors & Interconnects Market by Country
14.6.8.3 Asia Pacific Sensor Housings Market by Country
14.6.8.4 Asia Pacific Other Product Market by Country
14.6.9 Asia Pacific LCP Based Molded Interconnect Devices Market by End Use
14.6.9.1 Asia Pacific Automotive Market by Country
14.6.9.2 Asia Pacific Consumer Electronics Market by Country
14.6.9.3 Asia Pacific Telecommunication Market by Country
14.6.9.4 Asia Pacific Aerospace & Defense Market by Country
14.6.9.5 Asia Pacific Healthcare Market by Country
14.6.9.6 Asia Pacific Other End Use Market by Country
14.6.10 Asia Pacific LCP Based Molded Interconnect Devices Market by Country
14.6.10.1 China LCP Based Molded Interconnect Devices Market
14.6.10.1.1 China LCP Based Molded Interconnect Devices Market by Process
14.6.10.1.2 China LCP Based Molded Interconnect Devices Market by Product
14.6.10.1.3 China LCP Based Molded Interconnect Devices Market by End Use
14.6.10.2 Japan LCP Based Molded Interconnect Devices Market
14.6.10.2.1 Japan LCP Based Molded Interconnect Devices Market by Process
14.6.10.2.2 Japan LCP Based Molded Interconnect Devices Market by Product
14.6.10.2.3 Japan LCP Based Molded Interconnect Devices Market by End Use
14.6.10.3 India LCP Based Molded Interconnect Devices Market
14.6.10.3.1 India LCP Based Molded Interconnect Devices Market by Process
14.6.10.3.2 India LCP Based Molded Interconnect Devices Market by Product
14.6.10.3.3 India LCP Based Molded Interconnect Devices Market by End Use
14.6.10.4 South Korea LCP Based Molded Interconnect Devices Market
14.6.10.4.1 South Korea LCP Based Molded Interconnect Devices Market by Process
14.6.10.4.2 South Korea LCP Based Molded Interconnect Devices Market by Product
14.6.10.4.3 South Korea LCP Based Molded Interconnect Devices Market by End Use
14.6.10.5 Singapore LCP Based Molded Interconnect Devices Market
14.6.10.5.1 Singapore LCP Based Molded Interconnect Devices Market by Process
14.6.10.5.2 Singapore LCP Based Molded Interconnect Devices Market by Product
14.6.10.5.3 Singapore LCP Based Molded Interconnect Devices Market by End Use
14.6.10.6 Malaysia LCP Based Molded Interconnect Devices Market
14.6.10.6.1 Malaysia LCP Based Molded Interconnect Devices Market by Process
14.6.10.6.2 Malaysia LCP Based Molded Interconnect Devices Market by Product
14.6.10.6.3 Malaysia LCP Based Molded Interconnect Devices Market by End Use
14.6.10.7 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market
14.6.10.7.1 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by Process
14.6.10.7.2 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by Product
14.6.10.7.3 Rest of Asia Pacific LCP Based Molded Interconnect Devices Market by End Use
14.7 LAMEA LCP Based Molded Interconnect Devices Market
14.8 Key Factors Impacting the Market
14.8.1 Market Drivers
14.8.2 Market Restraints
14.8.3 Market Opportunities
14.8.4 Market Challenges
14.8.5 Market Trends – LAMEA LCP Based Molded Interconnect Devices Market
14.8.6 State of Competition - LAMEA LCP-Based Molded Interconnect Devices (MID) market
14.8.7 LAMEA LCP Based Molded Interconnect Devices Market by Process
14.8.7.1 LAMEA Laser Direct Structuring (LDS) Market by Country
14.8.7.2 LAMEA Two-Shot Molding Market by Country
14.8.7.3 LAMEA Other Process Market by Country
14.8.8 LAMEA LCP Based Molded Interconnect Devices Market by Product
14.8.8.1 LAMEA Antennas Market by Country
14.8.8.2 LAMEA Connectors & Interconnects Market by Country
14.8.8.3 LAMEA Sensor Housings Market by Country
14.8.8.4 LAMEA Other Product Market by Country
14.8.9 LAMEA LCP Based Molded Interconnect Devices Market by End Use
14.8.9.1 LAMEA Automotive Market by Country
14.8.9.2 LAMEA Consumer Electronics Market by Country
14.8.9.3 LAMEA Telecommunication Market by Country
14.8.9.4 LAMEA Aerospace & Defense Market by Country
14.8.9.5 LAMEA Healthcare Market by Country
14.8.9.6 LAMEA Other End Use Market by Country
14.8.10 LAMEA LCP Based Molded Interconnect Devices Market by Country
14.8.10.1 Brazil LCP Based Molded Interconnect Devices Market
14.8.10.1.1 Brazil LCP Based Molded Interconnect Devices Market by Process
14.8.10.1.2 Brazil LCP Based Molded Interconnect Devices Market by Product
14.8.10.1.3 Brazil LCP Based Molded Interconnect Devices Market by End Use
14.8.10.2 Argentina LCP Based Molded Interconnect Devices Market
14.8.10.2.1 Argentina LCP Based Molded Interconnect Devices Market by Process
14.8.10.2.2 Argentina LCP Based Molded Interconnect Devices Market by Product
14.8.10.2.3 Argentina LCP Based Molded Interconnect Devices Market by End Use
14.8.10.3 UAE LCP Based Molded Interconnect Devices Market
14.8.10.3.1 UAE LCP Based Molded Interconnect Devices Market by Process
14.8.10.3.2 UAE LCP Based Molded Interconnect Devices Market by Product
14.8.10.3.3 UAE LCP Based Molded Interconnect Devices Market by End Use
14.8.10.4 Saudi Arabia LCP Based Molded Interconnect Devices Market
14.8.10.4.1 Saudi Arabia LCP Based Molded Interconnect Devices Market by Process
14.8.10.4.2 Saudi Arabia LCP Based Molded Interconnect Devices Market by Product
14.8.10.4.3 Saudi Arabia LCP Based Molded Interconnect Devices Market by End Use
14.8.10.5 South Africa LCP Based Molded Interconnect Devices Market
14.8.10.5.1 South Africa LCP Based Molded Interconnect Devices Market by Process
14.8.10.5.2 South Africa LCP Based Molded Interconnect Devices Market by Product
14.8.10.5.3 South Africa LCP Based Molded Interconnect Devices Market by End Use
14.8.10.6 Nigeria LCP Based Molded Interconnect Devices Market
14.8.10.6.1 Nigeria LCP Based Molded Interconnect Devices Market by Process
14.8.10.6.2 Nigeria LCP Based Molded Interconnect Devices Market by Product
14.8.10.6.3 Nigeria LCP Based Molded Interconnect Devices Market by End Use
14.8.10.7 Rest of LAMEA LCP Based Molded Interconnect Devices Market
14.8.10.7.1 Rest of LAMEA LCP Based Molded Interconnect Devices Market by Process
14.8.10.7.2 Rest of LAMEA LCP Based Molded Interconnect Devices Market by Product
14.8.10.7.3 Rest of LAMEA LCP Based Molded Interconnect Devices Market by End Use
Chapter 15. Company Profiles
15.1 Molex, LLC (Koch Industries, Inc.)
15.1.1 Company Overview
15.1.2 SWOT Analysis
15.2 TE Connectivity Ltd.
15.2.1 Company Overview
15.2.2 Financial Analysis
15.2.3 Segmental and Regional Analysis
15.2.4 Research & Development Expense
15.2.5 SWOT Analysis
15.3 Kyocera Corporation
15.3.1 Company Overview
15.3.2 Financial Analysis
15.3.3 Segmental and Regional Analysis
15.3.4 Research & Development Expenses
15.3.5 SWOT Analysis
15.4 Amphenol Corporation
15.4.1 Company Overview
15.4.2 Financial Analysis
15.4.3 Segmental and Regional Analysis
15.4.4 Research & Development Expenses
15.4.5 SWOT Analysis
15.5 Sumitomo Electric Industries, Ltd.
15.5.1 Company Overview
15.5.2 Financial Analysis
15.5.3 Segmental and Regional Analysis
15.5.4 Research & Development Expenses
15.5.5 SWOT Analysis
15.6 Taoglas
15.6.1 Company Overview
15.7 HARTING Technology Group
15.7.1 Company Overview
15.8 LPKF Laser & Electronics SE
15.8.1 Company Overview
15.8.2 Financial Analysis
15.8.3 Segmental and Regional Analysis
15.8.4 Research & Development Expenses
15.9 Celanese Corporation
15.9.1 Company Overview
15.9.2 Financial Analysis
15.9.3 Segmental and Regional Analysis
15.9.4 Research & Development Expenses
15.9.5 SWOT Analysis
15.10. Solvay SA
15.10.1 Company Overview
15.10.2 Financial Analysis
15.10.3 Segmental Regional Analysis
15.10.4 Research & Development Expenses
15.10.5 SWOT Analysis
Chapter 16. Winning Imperatives of LCP Based Molded Interconnect Devices Market

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