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Europe LCP Based Molded Interconnect Devices Market Size, Share & Industry Analysis Report By Process (Laser Direct Structuring (LDS), Two-Shot Molding, and Other Process), By Product (Antennas, Connectors & Interconnects, Sensor Housings, and Other Produ

Publisher Knowledge Based Value (KBV) Research
Published Nov 04, 2025
Length 180 Pages
SKU # KBV20576014

Description

The Europe LCP Based Molded Interconnect Devices Market would witness market growth of 16.5% CAGR during the forecast period (2025-2032).

The Germany market dominated the Europe LCP Based Molded Interconnect Devices Market by Country in 2024, and would continue to be a dominant market till 2032; thereby, achieving a market value of $118.8 million by 2032. The UK market is exhibiting a CAGR of 15% during (2025 - 2032). Additionally, The France market would experience a CAGR of 17.7% during (2025 - 2032). The Germany and UK led the Europe LCP Based Molded Interconnect Devices Market by Country with a market share of 24.2% and 13.6% in 2024.The Spain market is expected to witness a CAGR of 18.3% during throughout the forecast period.

Europe has a strong presence in LCP-based molded interconnect devices (MIDs) because of its advanced electronics, precision manufacturing, and materials knowledge. Early tests with plated plastics and two-shot molding led to the widespread use of LCP substrates, which use laser structuring to integrate circuits with high precision. Germany, Switzerland, and the Nordic countries were the first to standardize processes, develop tools, and run pilot projects. Now, European companies are helping around the world by providing MID materials, design tools, and modules. The region's strength comes from bringing together miniaturization, reliability, and system integration for fields such as automotive, industrial automation, and medical devices.

In Europe, some of the most important trends are the use of electric vehicles and self-driving cars, the integration of IIoT devices and industrial automation, and the creation of ecosystems with design libraries, reference modules, and co-engineering frameworks. European MID players work together with resin and laser suppliers, OEMs, and engineers to make adoption less risky. Focusing on making things better, getting the most out of production, and making things in the right place makes sure that quality stays high, delivery is faster, and Europe stays competitive in global MID technology as both an innovator and an adopter.

End Use Outlook

Based on End Use, the market is segmented into Automotive, Consumer Electronics, Telecommunication, Aerospace & Defense, Healthcare, and Other End Use. With a compound annual growth rate (CAGR) of 13.6% over the projection period, the Automotive Market, dominate the Germany LCP Based Molded Interconnect Devices Market by End Use in 2024 and would be a prominent market until 2032. The Healthcare market is expected to witness a CAGR of 17.4% during (2025 - 2032).

Process Outlook

Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding, and Other Process. The Laser Direct Structuring (LDS) market segment dominated the UK LCP Based Molded Interconnect Devices Market by Process is expected to grow at a CAGR of 14.5 % during the forecast period thereby continuing its dominance until 2032. Also, The Two-Shot Molding market is anticipated to grow as a CAGR of 15.4 % during the forecast period during (2025 - 2032).

Country Outlook

Germany is Europe's center for industry and innovation, making it a great place for LCP-based molded interconnect devices (MIDs) because it has advanced manufacturing, materials expertise, and electronics research and development. Adoption is likely in fields that need high accuracy and dependability, like automotive sensors, industrial robotics, and advanced instrumentation. Germany's ecosystem of OEMs, microelectronics clusters, and system suppliers supports pilot deployments and innovation. This is because of Industry 4.0, the demand for automotive electrification, and the need for compact multifunctional modules. High labor costs and strict certification standards may make it harder to enter the market, but working with local companies and doing demonstration projects can help. Germany is a good European market for LCP MIDs because of its large industrial base, ability to innovate, and leadership in electronics.

List of Key Companies Profiled
  • Molex, LLC (Koch Industries, Inc.)
  • TE Connectivity Ltd.
  • Kyocera Corporation
  • Amphenol Corporation
  • Sumitomo Electric Industries, Ltd.
  • Taoglas
  • HARTING Technology Group
  • LPKF Laser & Electronics SE
  • Celanese Corporation
  • Solvay SA
Europe LCP Based Molded Interconnect Devices Market Report Segmentation

By Process
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Other Process
By Product
  • Antennas
  • Connectors & Interconnects
  • Sensor Housings
  • Other Product
By End Use
  • Automotive
  • Consumer Electronics
  • Telecommunication
  • Aerospace & Defense
  • Healthcare
  • Other End Use
By Country
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Table of Contents

180 Pages
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe LCP Based Molded Interconnect Devices Market, by Process
1.4.2 Europe LCP Based Molded Interconnect Devices Market, by Product
1.4.3 Europe LCP Based Molded Interconnect Devices Market, by End Use
1.4.4 Europe LCP Based Molded Interconnect Devices Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario 
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Market Trends – Europe LCP Based Molded Interconnect Devices Market
Chapter 5. State of Competition - Europe LCP Based Molded Interconnect Devices Market
Chapter 6. Value Chain Analysis of LCP Based Molded Interconnect Devices Market
Chapter 7. Competition Analysis – Global
7.1 Market Share Analysis, 2024
7.2 Porter Five Forces Analysis
Chapter 8. Product Life Cycle – LCP Based Molded Interconnect Devices Market
Chapter 9. Market Consolidation – LCP Based Molded Interconnect Devices Market
Chapter 10. Key Customer Criteria – LCP Based Molded Interconnect Devices Market
Chapter 11. Europe LCP Based Molded Interconnect Devices Market by Process
11.1 Europe Laser Direct Structuring (LDS) Market by Country
11.2 Europe Two-Shot Molding Market by Country
11.3 Europe Other Process Market by Country
Chapter 12. Europe LCP Based Molded Interconnect Devices Market by Product
12.1 Europe Antennas Market by Country
12.2 Europe Connectors & Interconnects Market by Country
12.3 Europe Sensor Housings Market by Country
12.4 Europe Other Product Market by Country
Chapter 13. Europe LCP Based Molded Interconnect Devices Market by End Use
13.1 Europe Automotive Market by Country
13.2 Europe Consumer Electronics Market by Country
13.3 Europe Telecommunication Market by Country
13.4 Europe Aerospace & Defense Market by Country
13.5 Europe Healthcare Market by Country
13.6 Europe Other End Use Market by Country
Chapter 14. Europe LCP Based Molded Interconnect Devices Market by Country
14.1 Germany LCP Based Molded Interconnect Devices Market
14.1.1 Germany LCP Based Molded Interconnect Devices Market by Process
14.1.2 Germany LCP Based Molded Interconnect Devices Market by Product
14.1.3 Germany LCP Based Molded Interconnect Devices Market by End Use
14.2 UK LCP Based Molded Interconnect Devices Market
14.2.1 UK LCP Based Molded Interconnect Devices Market by Process
14.2.2 UK LCP Based Molded Interconnect Devices Market by Product
14.2.3 UK LCP Based Molded Interconnect Devices Market by End Use
14.3 France LCP Based Molded Interconnect Devices Market
14.3.1 France LCP Based Molded Interconnect Devices Market by Process
14.3.2 France LCP Based Molded Interconnect Devices Market by Product
14.3.3 France LCP Based Molded Interconnect Devices Market by End Use
14.4 Russia LCP Based Molded Interconnect Devices Market
14.4.1 Russia LCP Based Molded Interconnect Devices Market by Process
14.4.2 Russia LCP Based Molded Interconnect Devices Market by Product
14.4.3 Russia LCP Based Molded Interconnect Devices Market by End Use
14.5 Spain LCP Based Molded Interconnect Devices Market
14.5.1 Spain LCP Based Molded Interconnect Devices Market by Process
14.5.2 Spain LCP Based Molded Interconnect Devices Market by Product
14.5.3 Spain LCP Based Molded Interconnect Devices Market by End Use
14.6 Italy LCP Based Molded Interconnect Devices Market
14.6.1 Italy LCP Based Molded Interconnect Devices Market by Process
14.6.2 Italy LCP Based Molded Interconnect Devices Market by Product
14.6.3 Italy LCP Based Molded Interconnect Devices Market by End Use
14.7 Rest of Europe LCP Based Molded Interconnect Devices Market
14.7.1 Rest of Europe LCP Based Molded Interconnect Devices Market by Process
14.7.2 Rest of Europe LCP Based Molded Interconnect Devices Market by Product
14.7.3 Rest of Europe LCP Based Molded Interconnect Devices Market by End Use
Chapter 15. Company Profiles
15.1 Molex, LLC (Koch Industries, Inc.)
15.1.1 Company Overview
15.1.2 SWOT Analysis
15.2 TE Connectivity Ltd.
15.2.1 Company Overview
15.2.2 Financial Analysis
15.2.3 Segmental and Regional Analysis
15.2.4 Research & Development Expense
15.2.5 SWOT Analysis
15.3 Kyocera Corporation
15.3.1 Company Overview
15.3.2 Financial Analysis
15.3.3 Segmental and Regional Analysis
15.3.4 Research & Development Expenses
15.3.5 SWOT Analysis
15.4 Amphenol Corporation
15.4.1 Company Overview
15.4.2 Financial Analysis
15.4.3 Segmental and Regional Analysis
15.4.4 Research & Development Expenses
15.4.5 SWOT Analysis
15.5 Sumitomo Electric Industries, Ltd.
15.5.1 Company Overview
15.5.2 Financial Analysis
15.5.3 Segmental and Regional Analysis
15.5.4 Research & Development Expenses
15.5.5 SWOT Analysis
15.6 Taoglas
15.6.1 Company Overview
15.7 HARTING Technology Group
15.7.1 Company Overview
15.8 LPKF Laser & Electronics SE
15.8.1 Company Overview
15.8.2 Financial Analysis
15.8.3 Segmental and Regional Analysis
15.8.4 Research & Development Expenses
15.9 Celanese Corporation
15.9.1 Company Overview
15.9.2 Financial Analysis
15.9.3 Segmental and Regional Analysis
15.9.4 Research & Development Expenses
15.9.5 SWOT Analysis
15.10. Solvay SA
15.10.1 Company Overview
15.10.2 Financial Analysis
15.10.3 Segmental Regional Analysis
15.10.4 Research & Development Expenses
15.10.5 SWOT Analysis

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