Global Co-packaged Optical (CPO) Modules Market 2025 by Company, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Co-packaged Optical (CPO) Modules market size was valued at US$ 45.9 million in 2024 and is forecast to a readjusted size of USD 947 million by 2031 with a CAGR of 41.9% during review period.

A Co-Packaged Optical (CPO) Module is an advanced optical interconnect technology that integrates optical engines directly alongside the switching ASICs or processors inside a single package. It brings the optics closer to the source of data to reduce power consumption, improve performance, and overcome bandwidth and thermal limitations of traditional pluggable transceivers.

The AI revolution is a recurring theme across industries, with projections of the AI sector reaching $280 billion by 2030. CPO technology, which integrates optical engines with compute chips (e.g., AI/ML accelerators), could benefit from AI-driven demand for high-speed, low-latency data transmission in data centers and HPC clusters.

Tech giants like Google, Amazon, Microsoft, and Meta are exploring CPO to enhance power efficiency and data transmission speeds. CPO is expected to replace traditional pluggable optics in data center switches by 2026–2028.

Traditional pluggable optics consume 50-60% more power than CPO. CPO enables energy-efficient data transmission, reducing cooling costs in data centers. Growing focus on green data centers and carbon footprint reduction is accelerating CPO deployment.

Industry alliances like OIF (Optical Internetworking Forum) and Open Compute Project (OCP) are working on CPO specifications. Companies like Cisco, Intel, Broadcom, etc. are collaborating to develop standardized CPO modules for commercial deployment.



This report is a detailed and comprehensive analysis for global Co-packaged Optical (CPO) Modules market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Co-packaged Optical (CPO) Modules market size and forecasts, in consumption value ($ Million), 2020-2031

Global Co-packaged Optical (CPO) Modules market size and forecasts by region and country, in consumption value ($ Million), 2020-2031

Global Co-packaged Optical (CPO) Modules market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031

Global Co-packaged Optical (CPO) Modules market shares of main players, in revenue ($ Million), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Co-packaged Optical (CPO) Modules

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Co-packaged Optical (CPO) Modules market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Broadcom, NVIDIA, Cisco, Ranovus, Intel, Marvell Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Co-packaged Optical (CPO) Modules market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Less than 1.6 T
1.6 to 3.2 T
More than 3.2 T

Market segment by Application
Data Center and HPC
Telecommunication and Networking

Market segment by players, this report covers
Broadcom
NVIDIA
Cisco
Ranovus
Intel
Marvell Technology

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Co-packaged Optical (CPO) Modules product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Co-packaged Optical (CPO) Modules, with revenue, gross margin, and global market share of Co-packaged Optical (CPO) Modules from 2020 to 2025.

Chapter 3, the Co-packaged Optical (CPO) Modules competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Co-packaged Optical (CPO) Modules market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Co-packaged Optical (CPO) Modules.

Chapter 13, to describe Co-packaged Optical (CPO) Modules research findings and conclusion.