Global Wafer Grinding and Polishing Machine Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Wafer Grinding and Polishing Machine market size was valued at US$ 4878 million in 2024 and is forecast to a readjusted size of USD 8409 million by 2031 with a CAGR of 8.4% during review period.

The wafer grinding and polishing machine is a device used for grinding and polishing silicon wafers, semiconductor wafers, and other optical components. It usually consists of a frame, worktable, grinding head, polishing head, cooling system, feed system, etc. It is a professional grinder that can grind and polish the wafer surface by using abrasives or grinding agents and grinding discs. Wafer grinders are typically equipped with cooling systems to maintain temperature stability during the grinding process and prevent wafer deformation.

This report provides statistics on CMP polishing equipment and wafer grinding equipment.

The global wafer grinding and polishing machine market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications.

The global key manufacturers of Wafer Grinding and Polishing Machine include Applied Materials, Ebara Corporation, Disco, Tianjin Huahaiqingke, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, KCTech, TSD, CETC, G&N, etc. In 2024, the global top 10 players had a share approximately 91% in terms of revenue.

CMP (Chemical Mechanical Planarization) Polishing Machines dominate the market, accounting for about 79% of the total market share. CMP machines are essential for achieving smooth, flat, and uniform wafer surfaces, which are crucial for the performance and reliability of semiconductor devices.

The 300mm wafer segment is the largest application segment, accounting for approximately 84% of the market share. This growth is fueled by the extensive use of 300mm wafers in advanced semiconductor manufacturing, especially for high-performance microchips used in mobile devices, computers, and other electronic equipment. In particular, the rising demand for smaller and more efficient semiconductor devices in industries like telecommunications, consumer electronics, and automotive is further driving the growth of wafer grinding and polishing machines.

The Asia-Pacific region holds a dominant position in the global wafer grinding and polishing machine market, accounting for about 78% of global consumption. The region’s leadership in semiconductor manufacturing, with major players located in countries like Taiwan, South Korea, Japan, and China, has played a key role in the market’s expansion. As semiconductor production continues to grow in the region, the demand for wafer processing equipment, including grinding and polishing machines, is expected to remain strong.

Market Driving Factors

Growing Demand for Semiconductors

The global demand for semiconductors has surged in recent years, driven by the increased use of electronic devices such as smartphones, laptops, wearables, and automobiles. The rapid advancement of industries like artificial intelligence (AI), machine learning, 5G communications, and Internet of Things (IoT) technologies further fuels the demand for semiconductor devices. As these devices become more advanced, the need for high-quality, precise wafers increases, thereby driving the market for wafer grinding and polishing machines.

Precision Requirements

As semiconductor devices continue to shrink in size, the need for high-precision wafer grinding and polishing processes becomes more critical. The miniaturization of chips demands extremely thin wafers with smooth, flat surfaces to ensure proper functionality and performance. Grinding and polishing machines play a key role in achieving these high-precision requirements, making them essential to the production of modern, small-scale electronic components. The advancement of technologies, such as 5nm and 3nm semiconductor process nodes, further necessitates the use of advanced wafer processing equipment.

Technological Advancements in Wafer Processing

The wafer grinding and polishing industry is experiencing constant technological improvements. Innovations such as advanced abrasive materials, automated polishing processes, and better cooling systems are enhancing the efficiency and precision of wafer grinding and polishing machines. For instance, automated systems and real-time monitoring technologies are helping manufacturers improve throughput, reduce defects, and optimize the production process. These innovations are essential for keeping up with the increasing demand for smaller and more complex semiconductor devices.

Market Restraints

High Initial Investment Costs

One of the main challenges facing the wafer grinding and polishing machine market is the high initial investment required to purchase and set up these machines. Wafer processing equipment is often expensive, and the need for precision components further increases the overall cost. Small and medium-sized enterprises (SMEs) may find it difficult to invest in such high-cost equipment, limiting market growth in some regions. Additionally, the high cost of maintenance and spare parts can further add to the financial burden.

Complexity and Skill Requirements

Wafer grinding and polishing machines require specialized knowledge and skills to operate efficiently. The processes involved are complex, and any errors in handling can lead to defective wafers, which can be costly for semiconductor manufacturers. Operators must have a thorough understanding of the grinding and polishing parameters, as well as how to monitor and maintain the machine. As such, a shortage of skilled workers or the complexity of training personnel can be a barrier to the widespread adoption of wafer grinding and polishing equipment.

Environmental Concerns

As wafer grinding and polishing processes generate waste materials, such as abrasives and slurry, there are environmental concerns related to the disposal of these by-products. The proper disposal and treatment of waste can be expensive and require compliance with environmental regulations. This could act as a deterrent for companies considering the adoption of new wafer grinding and polishing equipment. Manufacturers are increasingly focusing on developing more sustainable processes and reducing waste, but environmental concerns still remain a key restraint in the market.

Intense Competition and Price Pressure

The wafer grinding and polishing machine market is highly competitive, with many players offering similar products. As a result, companies face pressure to reduce prices, which can impact profitability. In addition to this, rapid technological advancements lead to constant updates in machine designs and features, increasing the pressure on manufacturers to innovate quickly. Smaller manufacturers may struggle to keep up with the pace of technological change and may find it difficult to offer competitive pricing while maintaining profitability.

This report is a detailed and comprehensive analysis for global Wafer Grinding and Polishing Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Wafer Grinding and Polishing Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Wafer Grinding and Polishing Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Wafer Grinding and Polishing Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Wafer Grinding and Polishing Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Wafer Grinding and Polishing Machine

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Wafer Grinding and Polishing Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Applied Materials, Ebara Corporation, Disco, Tianjin Huahaiqingke, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, KCTech, TSD, CETC, G&N, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Wafer Grinding and Polishing Machine market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type

CMP Polishing Machines

Wafer Grinding Machines

Market segment by Application

300mm Wafer

200mm Wafer

Others

Major players covered

Applied Materials

Ebara Corporation

Disco

Tianjin Huahaiqingke

TOKYO SEIMITSU

Okamoto Semiconductor Equipment Division

KCTech

TSD

CETC

G&N

Semicore

Koyo Machinery

Revasum

Engis Corporation

Hunan Yujing Machine Industrial

WAIDA MFG

SpeedFam

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Wafer Grinding and Polishing Machine product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Wafer Grinding and Polishing Machine, with price, sales quantity, revenue, and global market share of Wafer Grinding and Polishing Machine from 2020 to 2025.

Chapter 3, the Wafer Grinding and Polishing Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Wafer Grinding and Polishing Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Grinding and Polishing Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinding and Polishing Machine.

Chapter 14 and 15, to describe Wafer Grinding and Polishing Machine sales channel, distributors, customers, research findings and conclusion.