Global Semiconductor Packaging and Testing Service Market 2025 by Company, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Semiconductor Packaging and Testing Service market size was valued at US$ 120330 million in 2024 and is forecast to a readjusted size of USD 170210 million by 2031 with a CAGR of 5.1% during review period.
A process wherein a semiconductor chip is packaged in a form suitable for the electronic device.
Semiconductor packaging is a process of protecting the chip from the external environment, and electrically packaging it to connect the terminals. The integrated circuit (IC) is a component of circuit boards and electronic devices. ICs need to be electrically packaged in a form fitting to where they’re installed. They are responsible for interconnects, supplying electrical power, and heat dissipation. Packaging also protects the semiconductor chips, shielding the integrated circuits from external factors such as high temperatures, impurities, and physical impact. Each chip is tested to verify normal operation after the packaging process has been completed. This testing is called the package test. The package test is conducted on finished chip products. Chips are placed in a testing apparatus and tested under various conditions to sort out defective products.
The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing. According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.
This report studies the Semiconductor Packaging and Testing Service.
The key IDMs include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi; and the key OSATs include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation and ChipMOS TECHNOLOGIES, etc.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.27% year-on-year.
This report is a detailed and comprehensive analysis for global Semiconductor Packaging and Testing Service market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Packaging and Testing Service market size and forecasts, in consumption value ($ Million), 2020-2031
Global Semiconductor Packaging and Testing Service market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Semiconductor Packaging and Testing Service market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Semiconductor Packaging and Testing Service market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Packaging and Testing Service
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Packaging and Testing Service market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Western Digital, Infineon, NXP, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Semiconductor Packaging and Testing Service market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
IDM
OSAT
Market segment by Application
Analog IC
Micro IC
Logic IC
Memory IC
Discrete Semiconductors
Optoelectronics
Sensors
Market segment by players, this report covers
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Western Digital
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas
Microchip Technology
Onsemi
Sony Semiconductor Solutions Corporation
Panasonic
Winbond
Nanya Technology
ISSI (Integrated Silicon Solution Inc.)
Macronix
Giantec Semiconductor
Sharp
Magnachip
Toshiba
JS Foundry KK.
Hitachi
Murata
Skyworks Solutions Inc
Wolfspeed
Littelfuse
Diodes Incorporated
Rohm
Fuji Electric
Vishay Intertechnology
Mitsubishi Electric
Nexperia
Ampleon
CR Micro
Hangzhou Silan Integrated Circuit
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
Carsem
King Yuan Electronics Corp. (KYEC)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor（Hefei）Co., Ltd.
Hefei Chipmore Technology Co.,Ltd.
HT-tech
Chippacking
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Semiconductor Packaging and Testing Service product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Semiconductor Packaging and Testing Service, with revenue, gross margin, and global market share of Semiconductor Packaging and Testing Service from 2020 to 2025.
Chapter 3, the Semiconductor Packaging and Testing Service competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Semiconductor Packaging and Testing Service market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Packaging and Testing Service.
Chapter 13, to describe Semiconductor Packaging and Testing Service research findings and conclusion.
A process wherein a semiconductor chip is packaged in a form suitable for the electronic device.
Semiconductor packaging is a process of protecting the chip from the external environment, and electrically packaging it to connect the terminals. The integrated circuit (IC) is a component of circuit boards and electronic devices. ICs need to be electrically packaged in a form fitting to where they’re installed. They are responsible for interconnects, supplying electrical power, and heat dissipation. Packaging also protects the semiconductor chips, shielding the integrated circuits from external factors such as high temperatures, impurities, and physical impact. Each chip is tested to verify normal operation after the packaging process has been completed. This testing is called the package test. The package test is conducted on finished chip products. Chips are placed in a testing apparatus and tested under various conditions to sort out defective products.
The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing. According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.
This report studies the Semiconductor Packaging and Testing Service.
The key IDMs include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi; and the key OSATs include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation and ChipMOS TECHNOLOGIES, etc.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.27% year-on-year.
This report is a detailed and comprehensive analysis for global Semiconductor Packaging and Testing Service market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Packaging and Testing Service market size and forecasts, in consumption value ($ Million), 2020-2031
Global Semiconductor Packaging and Testing Service market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Semiconductor Packaging and Testing Service market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Semiconductor Packaging and Testing Service market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Packaging and Testing Service
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Packaging and Testing Service market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Western Digital, Infineon, NXP, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Semiconductor Packaging and Testing Service market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
IDM
OSAT
Market segment by Application
Analog IC
Micro IC
Logic IC
Memory IC
Discrete Semiconductors
Optoelectronics
Sensors
Market segment by players, this report covers
Samsung
Intel
SK Hynix
Micron Technology
Texas Instruments (TI)
STMicroelectronics
Kioxia
Western Digital
Infineon
NXP
Analog Devices, Inc. (ADI)
Renesas
Microchip Technology
Onsemi
Sony Semiconductor Solutions Corporation
Panasonic
Winbond
Nanya Technology
ISSI (Integrated Silicon Solution Inc.)
Macronix
Giantec Semiconductor
Sharp
Magnachip
Toshiba
JS Foundry KK.
Hitachi
Murata
Skyworks Solutions Inc
Wolfspeed
Littelfuse
Diodes Incorporated
Rohm
Fuji Electric
Vishay Intertechnology
Mitsubishi Electric
Nexperia
Ampleon
CR Micro
Hangzhou Silan Integrated Circuit
ASE (SPIL)
Amkor
JCET (STATS ChipPAC)
Tongfu Microelectronics (TFME)
Powertech Technology Inc. (PTI)
Carsem
King Yuan Electronics Corp. (KYEC)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP.
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor（Hefei）Co., Ltd.
Hefei Chipmore Technology Co.,Ltd.
HT-tech
Chippacking
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Semiconductor Packaging and Testing Service product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Semiconductor Packaging and Testing Service, with revenue, gross margin, and global market share of Semiconductor Packaging and Testing Service from 2020 to 2025.
Chapter 3, the Semiconductor Packaging and Testing Service competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Semiconductor Packaging and Testing Service market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Packaging and Testing Service.
Chapter 13, to describe Semiconductor Packaging and Testing Service research findings and conclusion.
Table of Contents
182 Pages
- 1 Market Overview
- 2 Company Profiles
- 3 Market Competition, by Players
- 4 Market Size Segment by Type
- 5 Market Size Segment by Application
- 6 North America
- 7 Europe
- 8 Asia-Pacific
- 9 South America
- 10 Middle East & Africa
- 11 Market Dynamics
- 12 Industry Chain Analysis
- 13 Research Findings and Conclusion
- 14 Appendix
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