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Global Semiconductor Laser Annealing Machine Supply, Demand and Key Producers, 2026-2032

Publisher GlobalInfoResearch
Published Jan 09, 2026
Length 132 Pages
SKU # GFSH20701678

Description

The global Semiconductor Laser Annealing Machine market size is expected to reach $ 1454 million by 2032, rising at a market growth of 9.7% CAGR during the forecast period (2026-2032).

In the manufacturing process of semiconductor devices, in order to form specific doping in silicon wafers, multiple ion implantation processes are required during the manufacturing process. During the ion input process, the bombardment of impurity ions will cause a certain degree of lattice damage to the silicon atoms in the wafer, resulting in the impurity ions not being able to be located in the correct lattice position and not having the proper electrical activity. Therefore, the wafer needs to be heat treated to repair the lattice and activate the electrical activity of the impurity ions. This heat treatment process is called annealing.

Semiconductor laser annealing machine refers to special equipment that uses high-energy laser beams for automated annealing processes. Its main function is to project a beam spot of a specific shape and uniform energy distribution onto a semiconductor wafer to anneal, scan and process the wafer. Compared with traditional furnace annealing and rapid annealing technology, laser annealing has the advantages of high instantaneous temperature, short action time, low thermal budget, and optional area processing, which can better meet the process requirements of thin-film processing and efficient activation. At present, laser annealing equipment has been widely used in the field of cutting-edge logic chip manufacturing.

Semiconductor Laser Annealing Machine can be divided into power laser annealing equipment and IC front-end laser annealing equipment. Power laser annealing equipment accounts for more than half, and IC front-end laser annealing equipment has the fastest growth rate. In 2023, the power annealing market share is about 55%. IGBT has become one of the fastest-growing power devices with its excellent performance. With the maturity of wafer thinning technology, thin-film high-voltage IGBT will become a future development trend; in addition, as the research and development of the third-generation wide bandgap semiconductor material SiC becomes more mature, the demand for SiC devices will gradually increase. Laser annealing technology is suitable for thin-film high-voltage IGBT and SiC products, and will continue to be one of the mainstream technologies in the future.

The development of the semiconductor laser annealing machine market is mainly driven by the downstream power device market and the advanced process chip market. In the field of power devices, power devices can be divided into traditional silicon-based devices and wide bandgap material devices according to material type. At present, silicon-based devices with a wide application base will still be the mainstream products for a long time in the future, such as IGBT. Benefiting from the development of industrial control, frequency conversion, and new energy industries, my country's power device industry will maintain steady growth. In addition, as the world's largest IGBT market, China has a large space for import substitution, and the acceleration of the localization process will benefit domestic equipment manufacturers.

The major semiconductor laser annealing machine manufacturers in the global market include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Applied Materials and Veeco, etc. The top five companies in the world account for nearly 87% of the market. The overall market concentration is high, and most of the high-end market is monopolized by foreign companies. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.

This report studies the global Semiconductor Laser Annealing Machine production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Semiconductor Laser Annealing Machine and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2025 as the base year. This report explores demand trends and competition, as well as details the characteristics of Semiconductor Laser Annealing Machine that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Semiconductor Laser Annealing Machine total production and demand, 2021-2032, (Units)

Global Semiconductor Laser Annealing Machine total production value, 2021-2032, (USD Million)

Global Semiconductor Laser Annealing Machine production by region & country, production, value, CAGR, 2021-2032, (USD Million) & (Units), (based on production site)

Global Semiconductor Laser Annealing Machine consumption by region & country, CAGR, 2021-2032 & (Units)

U.S. VS China: Semiconductor Laser Annealing Machine domestic production, consumption, key domestic manufacturers and share

Global Semiconductor Laser Annealing Machine production by manufacturer, production, price, value and market share 2021-2026, (USD Million) & (Units)

Global Semiconductor Laser Annealing Machine production by Type, production, value, CAGR, 2021-2032, (USD Million) & (Units)

Global Semiconductor Laser Annealing Machine production by Application, production, value, CAGR, 2021-2032, (USD Million) & (Units)

This report profiles key players in the global Semiconductor Laser Annealing Machine market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Sumitomo Heavy Industries, Veeco, SCREEN Semiconductor Solutions, Mitsui Group (JSW), Applied Materials, Hitachi, Shanghai Micro Electronics Equipment, DIT, EO Technics, Chengdu Laipu Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Semiconductor Laser Annealing Machine market

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2021-2032 by year with 2025 as the base year, 2026 as the estimate year, and 2027-2032 as the forecast year.

Global Semiconductor Laser Annealing Machine Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Semiconductor Laser Annealing Machine Market, Segmentation by Type:
Power Laser Annealing Machine
IC Front-end Laser Annealing Machine

Global Semiconductor Laser Annealing Machine Market, Segmentation by Application:
Power Semiconductor
Advanced Process Chip

Companies Profiled:
Sumitomo Heavy Industries
Veeco
SCREEN Semiconductor Solutions
Mitsui Group (JSW)
Applied Materials
Hitachi
Shanghai Micro Electronics Equipment
DIT
EO Technics
Chengdu Laipu Technology
Beijing U-PRECISION Tech
Hans DSI
YAC BEAM
ETA Semitech

Key Questions Answered:

1. How big is the global Semiconductor Laser Annealing Machine market?

2. What is the demand of the global Semiconductor Laser Annealing Machine market?

3. What is the year over year growth of the global Semiconductor Laser Annealing Machine market?

4. What is the production and production value of the global Semiconductor Laser Annealing Machine market?

5. Who are the key producers in the global Semiconductor Laser Annealing Machine market?

6. What are the growth factors driving the market demand?

Table of Contents

132 Pages
1 Supply Summary
2 Demand Summary
3 World Manufacturers Competitive Analysis
4 United States VS China VS Rest of the World
5 Market Analysis by Type
6 Market Analysis by Application
7 Company Profiles
8 Industry Chain Analysis
9 Research Findings and Conclusion
10 Appendix
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