Global Semiconductor Advanced Packaging Materials Market 2025 by Company, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Semiconductor Advanced Packaging Materials market size was valued at US$ 14010 million in 2024 and is forecast to a readjusted size of USD 28490 million by 2031 with a CAGR of 10.0% during review period.

Traditional semiconductor packaging materials mainly include packaging substrates, lead frames, bonding wires, ceramic packaging materials, chip bonding materials, etc. The packaging materials in the advanced packaging field (FC, WB, WLCSP, etc.) are mainly packaging substrates (ABF), underfill, die attach materials (paste and wire), epoxy molding compounds, etc.



This report is a detailed and comprehensive analysis for global Semiconductor Advanced Packaging Materials market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Semiconductor Advanced Packaging Materials market size and forecasts, in consumption value ($ Million), 2020-2031

Global Semiconductor Advanced Packaging Materials market size and forecasts by region and country, in consumption value ($ Million), 2020-2031

Global Semiconductor Advanced Packaging Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031

Global Semiconductor Advanced Packaging Materials market shares of main players, in revenue ($ Million), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Advanced Packaging Materials

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Advanced Packaging Materials market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Semiconductor Advanced Packaging Materials market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type

FC Package Substrate (FC-CSP and ABF)

WB Package Substrate (WB-BGA)

Underfill

Die Attach Material (Paste and Wire)

Epoxy Molding Compound

Others

Market segment by Application

Consumer Electronics

Automotive

IoT

5G

High Performance Computing

Others

Market segment by players, this report covers

Unimicron

Ibiden

Nan Ya PCB

Shinko Electric Industries

Kinsus Interconnect

AT&S

Semco

Kyocera

TOPPAN

Zhen Ding Technology

Daeduck Electronics

Zhuhai Access Semiconductor

LG InnoTek

Shennan Circuit

Shenzhen Fastprint Circuit Tech

Henkel

Won Chemical

NAMICS

Resonac

Panasonic

MacDermid Alpha

Shin-Etsu Chemical

Sunstar

Fuji Chemical

Zymet

Threebond

AIM Solder

LORD Corporation

SMIC Senju Metal Industry Co., Ltd

Shenmao Technology

Heraeu

Sumitomo Bakelite

Indium

Tamura

Shanghai Doitech

KCC

Eternal Materials

NAGASE

Hysol Huawei Electronics

Jiangsu HHCK Advanced Materials

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Semiconductor Advanced Packaging Materials product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Semiconductor Advanced Packaging Materials, with revenue, gross margin, and global market share of Semiconductor Advanced Packaging Materials from 2020 to 2025.

Chapter 3, the Semiconductor Advanced Packaging Materials competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Semiconductor Advanced Packaging Materials market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Advanced Packaging Materials.

Chapter 13, to describe Semiconductor Advanced Packaging Materials research findings and conclusion.