Global Multilayer Printed Circuit Board Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Multilayer Printed Circuit Board market size was valued at US$ 26520 million in 2024 and is forecast to a readjusted size of USD 30120 million by 2031 with a CAGR of 1.9% during review period.

Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.

Global Multilayer Printed Circuit Board main players are Nippon Mektron, ZD Tech, TTM Technologies, Unimicron, Young Poong Group, HannStar, etc. The market distribution is relatively dispersed. China is the largest market, with a share about 60%.

This report is a detailed and comprehensive analysis for global Multilayer Printed Circuit Board market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Multilayer Printed Circuit Board market size and forecasts, in consumption value ($ Million), sales quantity (K sqm), and average selling prices (USD/sqm), 2020-2031

Global Multilayer Printed Circuit Board market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K sqm), and average selling prices (USD/sqm), 2020-2031

Global Multilayer Printed Circuit Board market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K sqm), and average selling prices (USD/sqm), 2020-2031

Global Multilayer Printed Circuit Board market shares of main players, shipments in revenue ($ Million), sales quantity (K sqm), and ASP (USD/sqm), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Multilayer Printed Circuit Board

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Multilayer Printed Circuit Board market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Nippon Mektron, ZD Tech, TTM Technologies, Unimicron, Sumitomo Denko, Compeq, Tripod, Samsung E-M, Young Poong Group, HannStar, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Multilayer Printed Circuit Board market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Layer 4-6
Layer 8-10
Layer 10+

Market segment by Application
Consumer Electronics
Communications
Computer Related
Automotive
Others

Major players covered
Nippon Mektron
ZD Tech
TTM Technologies
Unimicron
Sumitomo Denko
Compeq
Tripod
Samsung E-M
Young Poong Group
HannStar
Ibiden
Nanya PCB
KBC PCB Group
Daeduck Group
AT&S
Fujikura
Meiko
Multek
Kinsus
Chin Poon
T.P.T.
Shinko Denski
Wus Group
Simmtech
Mflex
CMK
LG Innotek
Gold Circuit
Shennan Circuit
Ellington

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Multilayer Printed Circuit Board product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Multilayer Printed Circuit Board, with price, sales quantity, revenue, and global market share of Multilayer Printed Circuit Board from 2020 to 2025.

Chapter 3, the Multilayer Printed Circuit Board competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Multilayer Printed Circuit Board breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Multilayer Printed Circuit Board market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Multilayer Printed Circuit Board.

Chapter 14 and 15, to describe Multilayer Printed Circuit Board sales channel, distributors, customers, research findings and conclusion.


1 Market Overview
2 Manufacturers Profiles
3 Competitive Environment: Multilayer Printed Circuit Board by Manufacturer
4 Consumption Analysis by Region
5 Market Segment by Type
6 Market Segment by Application
7 North America
8 Europe
9 Asia-Pacific
10 South America
11 Middle East & Africa
12 Market Dynamics
13 Raw Material and Industry Chain
14 Shipments by Distribution Channel
15 Research Findings and Conclusion
16 Appendix

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