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Global High Frequency and High Speed PCB Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Publisher GlobalInfoResearch
Published Sep 23, 2025
Length 172 Pages
SKU # GFSH20415311

Description

According to our (Global Info Research) latest study, the global High Frequency and High Speed PCB market size was valued at US$ 7975 million in 2024 and is forecast to a readjusted size of USD 11580 million by 2031 with a CAGR of 5.2% during review period.

High-frequency and high-speed PCB usually refer to printed circuit boards with frequencies above 1GHz. The production process of high-frequency and high-speed PCB is basically the same as that of ordinary PCB. The key point to achieve high-frequency and high-speed lies in the properties of raw materials, that is, the characteristic parameters of raw materials. The main material of high-frequency and high-speed PCB board is high-frequency and high-speed copper clad laminate, and its core requirements are to have low dielectric constant (Dk) and low dielectric loss factor (Df). In addition to ensuring lower Dk and Df, the consistency of Dk parameters is also one of the important factors to measure the quality of the PCB board. In addition, another important parameter is the impedance characteristics of the PCB board and some other physical characteristics.

The global PCB market was valued at US$ 78.9billion in 2024 and is anticipated to reach US$ 101.6 billion by 2031, witnessing a CAGR of 4.86% during the forecast period 2025-2031. Asia-Pacific dominates the market, accounting for over 85% of global PCB production, led by China Mainland, China Taiwan, and South Korea.

The major global manufacturers of PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.

This report is a detailed and comprehensive analysis for global High Frequency and High Speed PCB market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global High Frequency and High Speed PCB market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031

Global High Frequency and High Speed PCB market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031

Global High Frequency and High Speed PCB market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031

Global High Frequency and High Speed PCB market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sqm), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for High Frequency and High Speed PCB

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global High Frequency and High Speed PCB market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Kinwong, Shennan Circuit, Suntak Technology, Shenzhen Fastprint Circuit Tech, Gul Technologies Group, Kingboard Holdings, WUS Printed Circuit (Kunshan), Victory Giant Technology, Dongguan Shengyi Electronics, Murata Manufacturing, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

High Frequency and High Speed PCB market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
High Speed PCB
High Frequency PCB

Market segment by Application
Computer Field
Communication Field
Automotive Field
Consumer Electronics
Others

Major players covered
Kinwong
Shennan Circuit
Suntak Technology
Shenzhen Fastprint Circuit Tech
Gul Technologies Group
Kingboard Holdings
WUS Printed Circuit (Kunshan)
Victory Giant Technology
Dongguan Shengyi Electronics
Murata Manufacturing
Bomin Electronics
Guangdong Ellington Electronic Technology
DSBJ (Dongshan Precision)
Unimicron
Founder PCB
Nippon Mektron
TTM Technologies, Inc
Nan Ya PCB
Meiko Electronics
Daeduck Electronics
Simmtech
AKM Meadville
Fujikura Printed Circuits
CMK Corporation
Aoshikang Technology
Dynamic Electronics
Jiangsu Allfavor Intelligent Circuits Technology
Guangdong Kingshine Electronics
Sunshine Global Circuits
Glorysky Electronics

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe High Frequency and High Speed PCB product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of High Frequency and High Speed PCB, with price, sales quantity, revenue, and global market share of High Frequency and High Speed PCB from 2020 to 2025.

Chapter 3, the High Frequency and High Speed PCB competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the High Frequency and High Speed PCB breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and High Frequency and High Speed PCB market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of High Frequency and High Speed PCB.

Chapter 14 and 15, to describe High Frequency and High Speed PCB sales channel, distributors, customers, research findings and conclusion.

Table of Contents

172 Pages
1 Market Overview
2 Manufacturers Profiles
3 Competitive Environment: High Frequency and High Speed PCB by Manufacturer
4 Consumption Analysis by Region
5 Market Segment by Type
6 Market Segment by Application
7 North America
8 Europe
9 Asia-Pacific
10 South America
11 Middle East & Africa
12 Market Dynamics
13 Raw Material and Industry Chain
14 Shipments by Distribution Channel
15 Research Findings and Conclusion
16 Appendix
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