Global Automatic Wafer Laser Grooving Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
Description
According to our (Global Info Research) latest study, the global Automatic Wafer Laser Grooving Equipment market size was valued at US$ 293 million in 2024 and is forecast to a readjusted size of USD 496 million by 2031 with a CAGR of 9.0% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
The Automatic wafer laser grooving equipment is the core equipment used for high-precision wafer processing in semiconductor manufacturing. By integrating laser technology, automated control systems and AI algorithms, it can achieve unmanned operation of the entire process of micron-level grooves, through holes and invisible cutting on the surface or inside of the wafer.
The automatic wafer laser grooving equipment is one of the core links in the semiconductor manufacturing industry chain. Benefiting from the explosion of demand for advanced packaging, third-generation semiconductors (SiC/GaN) and memory chips, the market size continues to expand.
Growth drivers include: under the miniaturization of chip processes, the demand for high-density interconnection drives the penetration of precision slotting processes such as TSV (silicon through via); the processing of wide bandgap materials such as SiC/GaN relies on ultrafast laser technology to reduce thermal damage; China's semiconductor equipment localization policy accelerates the replacement of European and American manufacturers.
The competitive landscape is dominated by Japanese and Korean manufacturers, with DISCO and ASMPT accounting for more than 60% in total, but Chinese manufacturers (such as Delong Laser and HGLASER) have made significant breakthroughs in the field of ultraviolet/ultrafast lasers, and the localization rate continues to increase.
The technology trend focuses on the combination of ultrafast lasers (picosecond/femtosecond) and AI process optimization systems to meet the precision requirements of nodes below 5nm and heterogeneous integration. At the same time, equipment intelligence and modularization have become the key to differentiated competition. However, the market faces challenges: fragmentation rate control when wafers are thinned to less than 50μm, residual contamination of photoresist, and the impact of US technology export restrictions on the supply chain. In the future, with the surge in demand for HBM storage and automotive-grade chips, the equipment market will iterate towards high stability and high compatibility, and the process of domestic substitution may reshape the global landscape.
This report is a detailed and comprehensive analysis for global Automatic Wafer Laser Grooving Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Automatic Wafer Laser Grooving Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Automatic Wafer Laser Grooving Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Automatic Wafer Laser Grooving Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Automatic Wafer Laser Grooving Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Automatic Wafer Laser Grooving Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Automatic Wafer Laser Grooving Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO, ASMPT, EO Technics, Wuhan Dr Laser Technology, Delphi Laser, Synova, ACCRETECH, Suzhou Maxwell Technologies, Suzhou Lumi Laser Technology, Han's Laser Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Automatic Wafer Laser Grooving Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Ultrafast Laser (Picosecond/Femtosecond)
UV Laser
Market segment by Application
8 Inch Wafer
12 Inch Wafer
Others
Major players covered
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
ACCRETECH
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuhan Huagong Laser Engineering
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Automatic Wafer Laser Grooving Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Automatic Wafer Laser Grooving Equipment, with price, sales quantity, revenue, and global market share of Automatic Wafer Laser Grooving Equipment from 2020 to 2025.
Chapter 3, the Automatic Wafer Laser Grooving Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Automatic Wafer Laser Grooving Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Automatic Wafer Laser Grooving Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Automatic Wafer Laser Grooving Equipment.
Chapter 14 and 15, to describe Automatic Wafer Laser Grooving Equipment sales channel, distributors, customers, research findings and conclusion.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
The Automatic wafer laser grooving equipment is the core equipment used for high-precision wafer processing in semiconductor manufacturing. By integrating laser technology, automated control systems and AI algorithms, it can achieve unmanned operation of the entire process of micron-level grooves, through holes and invisible cutting on the surface or inside of the wafer.
The automatic wafer laser grooving equipment is one of the core links in the semiconductor manufacturing industry chain. Benefiting from the explosion of demand for advanced packaging, third-generation semiconductors (SiC/GaN) and memory chips, the market size continues to expand.
Growth drivers include: under the miniaturization of chip processes, the demand for high-density interconnection drives the penetration of precision slotting processes such as TSV (silicon through via); the processing of wide bandgap materials such as SiC/GaN relies on ultrafast laser technology to reduce thermal damage; China's semiconductor equipment localization policy accelerates the replacement of European and American manufacturers.
The competitive landscape is dominated by Japanese and Korean manufacturers, with DISCO and ASMPT accounting for more than 60% in total, but Chinese manufacturers (such as Delong Laser and HGLASER) have made significant breakthroughs in the field of ultraviolet/ultrafast lasers, and the localization rate continues to increase.
The technology trend focuses on the combination of ultrafast lasers (picosecond/femtosecond) and AI process optimization systems to meet the precision requirements of nodes below 5nm and heterogeneous integration. At the same time, equipment intelligence and modularization have become the key to differentiated competition. However, the market faces challenges: fragmentation rate control when wafers are thinned to less than 50μm, residual contamination of photoresist, and the impact of US technology export restrictions on the supply chain. In the future, with the surge in demand for HBM storage and automotive-grade chips, the equipment market will iterate towards high stability and high compatibility, and the process of domestic substitution may reshape the global landscape.
This report is a detailed and comprehensive analysis for global Automatic Wafer Laser Grooving Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Automatic Wafer Laser Grooving Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Automatic Wafer Laser Grooving Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Automatic Wafer Laser Grooving Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Automatic Wafer Laser Grooving Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Automatic Wafer Laser Grooving Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Automatic Wafer Laser Grooving Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO, ASMPT, EO Technics, Wuhan Dr Laser Technology, Delphi Laser, Synova, ACCRETECH, Suzhou Maxwell Technologies, Suzhou Lumi Laser Technology, Han's Laser Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Automatic Wafer Laser Grooving Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Ultrafast Laser (Picosecond/Femtosecond)
UV Laser
Market segment by Application
8 Inch Wafer
12 Inch Wafer
Others
Major players covered
DISCO
ASMPT
EO Technics
Wuhan Dr Laser Technology
Delphi Laser
Synova
ACCRETECH
Suzhou Maxwell Technologies
Suzhou Lumi Laser Technology
Han's Laser Technology
Wuhan Huagong Laser Engineering
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Automatic Wafer Laser Grooving Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Automatic Wafer Laser Grooving Equipment, with price, sales quantity, revenue, and global market share of Automatic Wafer Laser Grooving Equipment from 2020 to 2025.
Chapter 3, the Automatic Wafer Laser Grooving Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Automatic Wafer Laser Grooving Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Automatic Wafer Laser Grooving Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Automatic Wafer Laser Grooving Equipment.
Chapter 14 and 15, to describe Automatic Wafer Laser Grooving Equipment sales channel, distributors, customers, research findings and conclusion.
Table of Contents
107 Pages
- 1 Market Overview
- 2 Manufacturers Profiles
- 3 Competitive Environment: Automatic Wafer Laser Grooving Equipment by Manufacturer
- 4 Consumption Analysis by Region
- 5 Market Segment by Type
- 6 Market Segment by Application
- 7 North America
- 8 Europe
- 9 Asia-Pacific
- 10 South America
- 11 Middle East & Africa
- 12 Market Dynamics
- 13 Raw Material and Industry Chain
- 14 Shipments by Distribution Channel
- 15 Research Findings and Conclusion
- 16 Appendix
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