Semiconductor Etching Equipment

Global Semiconductor Etching Equipment Market to Reach US$20.4 Billion by 2030

The global market for Semiconductor Etching Equipment estimated at US$14.1 Billion in the year 2024, is expected to reach US$20.4 Billion by 2030, growing at a CAGR of 6.3% over the analysis period 2024-2030. Wet Etch Equipment, one of the segments analyzed in the report, is expected to record a 4.9% CAGR and reach US$12.0 Billion by the end of the analysis period. Growth in the Dry Etch Equipment segment is estimated at 8.6% CAGR over the analysis period.

The U.S. Market is Estimated at US$3.7 Billion While China is Forecast to Grow at 6.3% CAGR

The Semiconductor Etching Equipment market in the U.S. is estimated at US$3.7 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$3.3 Billion by the year 2030 trailing a CAGR of 6.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.7% and 5.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.3% CAGR.

Global "Semiconductor Etching Equipment" Market – Key Trends & Drivers Summarized

Why Is Etching Equipment at the Core of the Next Semiconductor Revolution?
As semiconductor devices continue to scale down in size while increasing in complexity, etching equipment has become an essential pillar in advanced chip manufacturing. This equipment plays a critical role in transferring intricate circuit patterns onto wafers, enabling the development of cutting-edge nodes at 5nm and below. Etching is no longer a straightforward subtractive process—it now demands extreme precision, selectivity, and uniformity to accommodate 3D architectures such as FinFETs and gate-all-around (GAA) transistors. Dry (plasma) etching and wet etching systems are both evolving to address diverse patterning challenges in logic, memory, and power devices. As leading foundries and integrated device manufacturers (IDMs) shift toward EUV lithography, etching tools must complement these advancements with high-aspect-ratio processing and minimal defect rates. Furthermore, heterogeneous integration and advanced packaging are expanding the utility of etching in interposer and TSV (through-silicon via) formation. The growing demand for AI chips, automotive-grade semiconductors, and IoT sensors has placed enormous pressure on etching systems to deliver repeatability and productivity under strict environmental controls. Equipment makers are racing to innovate process chambers, gas delivery systems, and endpoint detection technologies to stay ahead in a hypercompetitive market. These capabilities are no longer optional—they are essential enablers for future node transitions.

How Are Equipment Suppliers Innovating to Meet Future Node Demands?
The rapid miniaturization of semiconductor components requires etching equipment manufacturers to push the limits of precision, material compatibility, and chamber design. Leading suppliers are investing heavily in atomic layer etching (ALE) technology, which enables angstrom-level accuracy by controlling etching at the atomic scale. ALE is particularly crucial in minimizing line edge roughness and achieving ultra-thin features in DRAM, NAND, and advanced logic nodes. Furthermore, process modularity and multi-patterning compatibility have become key focus areas, as fabs look for flexible tools that can adapt to varying design rules. Suppliers are also incorporating AI and machine learning into etching systems to optimize process parameters, predict maintenance, and ensure uniformity across wafers. Hybrid etching platforms that integrate plasma and wet processing are gaining traction to meet specific use cases like etching of compound semiconductors (e.g., GaN, SiC). In addition, chamber materials are being redesigned to minimize contamination and particle generation, which is critical for achieving yield at smaller geometries. As fabs seek greater throughput without sacrificing control, high-density plasma (HDP) systems with advanced RF control are being rolled out. These innovations are reshaping competitive dynamics in the semiconductor equipment market, with differentiation increasingly tied to software, process integration, and customization capabilities rather than hardware alone.

How Are Regional Policies, Supply Chain Changes, and Market Dynamics Shaping the Landscape?
Global shifts in semiconductor supply chains and industrial policy are having a profound effect on the etching equipment market. Geopolitical tensions have led to a reconfiguration of manufacturing hubs, with the U.S., EU, South Korea, Japan, and China investing billions into domestic chipmaking capabilities. This regionalization is increasing demand for localized equipment suppliers and strategic technology partnerships. Export restrictions on advanced tools have intensified the push for self-reliance, particularly in China, where homegrown equipment firms are scaling rapidly to replace U.S.-made alternatives. Simultaneously, the expansion of semiconductor fabs worldwide—especially those focused on automotive and edge computing—has opened up new demand pockets for mid-tier and legacy-node etching systems. Moreover, the rise of fabless design models has increased reliance on foundries, further consolidating demand among a few high-volume customers. Environmental regulations are also influencing equipment design, prompting a move toward greener etching processes that reduce toxic by-products and energy consumption. The industry is seeing a surge in refurbishing and upgrading older etching systems to meet sustainability and cost-efficiency goals. Meanwhile, the pandemic-induced component shortages have heightened the focus on equipment resilience, multi-sourcing strategies, and predictive maintenance infrastructure. These trends are redefining supply chain strategies, operational footprints, and partnership models across the value chain.

The Growth In The Semiconductor Etching Equipment Market Is Driven By Several Factors...
The growth in the semiconductor etching equipment market is driven by several factors including the transition to sub-5nm process nodes, rising adoption of 3D and heterogeneous integration, and the proliferation of end-use applications such as AI, 5G, and automotive electronics. Technological trends like atomic layer etching (ALE), high-density plasma systems, and AI-enabled process optimization are enhancing the performance and precision of etching tools. End-user demand is diversifying, with memory, logic, and power semiconductor manufacturers requiring specialized etch solutions tailored to new architectures and material stacks. The ongoing buildout of semiconductor fabs globally, supported by national semiconductor strategies, is significantly increasing the installed base of etching systems. Furthermore, the shift toward smart manufacturing and Industry 4.0 practices is accelerating demand for software-integrated, self-calibrating, and predictive-capable etching equipment. Changing consumer electronics trends—particularly the growth in wearable tech, autonomous vehicles, and quantum computing—are indirectly expanding market demand by pushing the limits of device miniaturization and complexity. In addition, increasing demand for silicon carbide and gallium nitride devices for high-power and RF applications is driving specialized etching system innovations. These converging factors ensure that etching equipment will remain one of the most vital—and fastest-evolving—segments in the semiconductor manufacturing value chain.

SCOPE OF STUDY:

The report analyzes the Semiconductor Etching Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Type (Wet Etch Equipment, Dry Etch Equipment); Product Type (High-density Etch Equipment, Low-density Etch Equipment); Etching Film Type (Conductor Etching, Dielectric Etching, Polysilicon Etching); Application (MEMS Application, Power Devices Application, Logic ICs Application, Memory Application); End-Use (Foundry End-Use, OEM End-Use, IDM End-Use)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 39 Featured) -

• ACM Research
• Advanced Micro-Fabrication Equipment Inc. (AMEC)
• Applied Materials Inc.
• ASML Holding N.V.
• Axcelis Technologies Inc.
• Canon Anelva Corporation
• EV Group (EVG)
• Hitachi High-Tech Corporation
• KLA Corporation
• Lam Research Corporation
• Mattson Technology Inc.
• NAURA Technology Group Co., Ltd.
• Oxford Instruments plc
• Panasonic Corporation
• Plasma-Therm LLC
• Samco Inc.
• SEMES Co., Ltd.
• Shibaura Mechatronics Corporation
• SPTS Technologies Ltd.
• Tokyo Electron Limited (TEL)

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