PCBs in Communications

Global PCBs in Communications Market to Reach US$25.6 Billion by 2030

The global market for PCBs in Communications estimated at US$18.2 Billion in the year 2024, is expected to reach US$25.6 Billion by 2030, growing at a CAGR of 5.9% over the analysis period 2024-2030. Enterprises, one of the segments analyzed in the report, is expected to record a 7.3% CAGR and reach US$9.6 Billion by the end of the analysis period. Growth in the Education segment is estimated at 6.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$5.0 Billion While China is Forecast to Grow at 9.5% CAGR

The PCBs in Communications market in the U.S. is estimated at US$5.0 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$5.3 Billion by the year 2030 trailing a CAGR of 9.5% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 2.8% and 5.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 3.9% CAGR.

Global PCBs in Communications Market – Key Trends & Drivers Summarized

How Are PCBs Enabling the Backbone of Next-Generation Communication Infrastructure?

Printed circuit boards (PCBs) are the foundational substrate upon which virtually all communication equipment is built—ranging from smartphones, routers, and data switches to 5G base stations, satellite systems, and optical transceivers. With the communications industry moving toward ultra-high-speed, low-latency, and high-frequency operation, PCBs are evolving to support higher signal integrity, reduced dielectric loss, and multi-gigabit transmission rates. These requirements are reshaping PCB architectures in telecom, datacom, and enterprise communication hardware globally.

High-speed PCBs used in communication systems must accommodate multi-layer stack-ups, advanced materials (such as low-Dk laminates), embedded components, and microvias to ensure signal fidelity at GHz frequencies. As 5G, Wi-Fi 6E, fiber-optic backbones, and satellite broadband proliferate, designers are leveraging rigid, rigid-flex, and HDI PCBs with hybrid dielectric compositions to manage electromagnetic interference (EMI), maintain controlled impedance, and ensure power integrity across densely populated interconnects.

Why Are High-Frequency Materials, Signal Integrity, and Thermal Management Driving Design Innovation?

With data transmission rates exceeding 10 Gbps in many new-generation communication systems, PCBs must be engineered to minimize loss tangent, impedance mismatches, and parasitic effects. This necessitates the use of advanced laminates such as Rogers, Isola, Taconic, and Panasonic Megtron, which offer superior dielectric properties for high-frequency signaling. Designers are optimizing trace geometries, ground planes, and via structures to meet signal integrity and crosstalk mitigation standards.

In parallel, thermal management is becoming a core concern as high-power components such as ASICs, RF modules, and laser diodes are embedded onto densely packed boards. To address this, PCBs are incorporating thermal vias, metal cores, heat spreaders, and copper balancing techniques that dissipate heat without compromising board reliability. These features are especially critical in telecom base stations, rack-mounted network switches, and outdoor wireless infrastructure, where ambient conditions and uptime are tightly regulated.

How Are Industry Standards, Vertical Integration, and Network Expansion Projects Shaping Demand?

The rapid expansion of global communication infrastructure—including fiber deployments, mobile broadband coverage, and data center construction—is creating sustained demand for communication-grade PCBs. Government-supported broadband initiatives, smart city programs, and private 5G networks are driving new product launches and procurement cycles in telecom hardware. OEMs and contract manufacturers are vertically integrating PCB design and fabrication to meet stringent quality control, traceability, and time-to-market expectations.

Standardization bodies such as IEEE, IPC, and ETSI are continuously updating specifications for high-speed PCB design, thermal testing, and high-density mounting—prompting PCB suppliers to maintain compliance and design agility. PCBs for communication applications must also meet strict reliability benchmarks including IPC-6012 class 3, IPC-A-600, and ISO 9001 certifications, especially for military-grade and mission-critical network infrastructure.

What’s Driving the Growth of PCBs in the Communications Sector Globally?

The growth in the PCBs in communications market is driven by several factors including the accelerated rollout of 5G and fiber broadband, increasing digitization of enterprises, and growing demand for high-speed, low-latency data transmission. A key growth driver is the surging volume of connected devices and cloud applications, which necessitate reliable and high-performance communication hardware built on robust PCB architectures.

Ongoing investment in hyperscale data centers, satellite internet constellations, and IoT connectivity platforms is expanding the need for high-frequency, thermally efficient, and EMI-compliant PCBs. The convergence of mobile, fixed-line, and wireless infrastructure—along with global supply chain rebalancing—is encouraging localized production and design innovation in PCBs for communication systems.

As communication technologies advance toward terabit-scale connectivity, intelligent edge computing, and real-time data transfer, PCBs will remain indispensable components of high-speed electronic ecosystems—enabling the next leap in digital transformation worldwide.

SCOPE OF STUDY:

The report analyzes the PCBs in Communications market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
End-Use (Enterprises, Education, Government, Healthcare, Other End-Uses)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 36 Featured) -

• Advanced Circuits
• AT&S
• BMK Group
• Cirexx International
• Compeq Manufacturing Co., Ltd.
• Elec & Eltek International Co., Ltd.
• EMSG Inc.
• Excello Circuits
• HiTech Circuits Co., Ltd.
• JHYPCB
• Lanner Electronics Inc.
• Murrietta Circuits
• Onanon Inc.
• Park Aerospace Corp
• PCBCart
• Sanmina Corporation
• Sierra Circuits
• TTM Technologies, Inc.
• Unimicron Technology Corporation
• Zhen Ding Technology Holding Ltd.

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