Digital TV SoC

Global Digital TV SoC Market to Reach US$23.6 Billion by 2030

The global market for Digital TV SoC estimated at US$11.8 Billion in the year 2024, is expected to reach US$23.6 Billion by 2030, growing at a CAGR of 12.3% over the analysis period 2024-2030. LCD Application, one of the segments analyzed in the report, is expected to record a 15.0% CAGR and reach US$8.8 Billion by the end of the analysis period. Growth in the LED Application segment is estimated at 9.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$3.2 Billion While China is Forecast to Grow at 17.0% CAGR

The Digital TV SoC market in the U.S. is estimated at US$3.2 Billion in the year 2024. China, the world`s second largest economy, is forecast to reach a projected market size of US$5.1 Billion by the year 2030 trailing a CAGR of 17.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 8.7% and 11.1% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 9.8% CAGR.

Global Digital TV SoC Market – Key Trends & Drivers Summarized

What Makes Digital TV SoCs Central to the Future of Connected Entertainment?
Digital TV system-on-chip (SoC) solutions have become an indispensable component of modern television architecture, integrating multiple digital processing functionalities—such as audio, video, signal demodulation, and internet protocol decoding—into a single silicon chip. This integration has enabled manufacturers to produce thinner, smarter, and more cost-effective television sets. With the mass transition from traditional broadcast to digital television and the increasing penetration of over-the-top (OTT) streaming services, the demand for digital TV SoCs has grown considerably. These chips facilitate advanced functionalities like 4K and 8K upscaling, HDR rendering, motion estimation and compensation (MEMC), and AI-based content recognition—capabilities that are becoming standard expectations in high-end and mid-range smart TVs.

Moreover, the proliferation of hybrid broadcast broadband TV (HbbTV) standards and ATSC 3.0 digital broadcasting in North America and parts of Asia is reshaping the functional requirements of TV SoCs. Manufacturers are now compelled to develop highly programmable SoCs that support a broader range of connectivity standards, including HDMI 2.1, Wi-Fi 6, and Ethernet IP multicast. These transitions not only improve the end-user viewing experience but also expand the opportunities for advertisers and broadcasters to deliver personalized, data-driven content. In response, chipmakers are embedding AI engines and machine learning cores to enable real-time user analytics and content personalization at the device level, turning digital TV SoCs into platforms for both high-fidelity media consumption and data intelligence.

How Are Technological Advancements Reshaping Chip Architecture in the SoC Space?
The digital TV SoC market is undergoing a profound transformation led by advances in semiconductor design and fabrication technologies. At the forefront is the migration to sub-10nm process nodes, which has significantly enhanced chip performance, energy efficiency, and heat dissipation. This evolution is critical, as modern smart TVs require higher computational power to handle graphics-intensive operations, real-time video rendering, voice assistant integration, and multi-platform streaming. SoC vendors are increasingly leveraging heterogeneous computing architectures—combining CPU, GPU, neural processing units (NPUs), and dedicated accelerators—to meet these demands without escalating power consumption or thermal loads.

In addition to process node scaling, the integration of AI and edge processing capabilities has become a major differentiator in high-performance TV SoCs. These intelligent chips can analyze viewing habits, optimize picture settings in real time, and support low-latency cloud gaming via platforms like Google Stadia or NVIDIA GeForce Now. Moreover, with the rising need for enhanced cybersecurity in connected TVs, SoCs are now being embedded with hardware-level Trusted Execution Environments (TEEs) and advanced encryption modules to protect against firmware attacks, unauthorized content access, and data leaks. These embedded security features are becoming standard, particularly for vendors targeting premium and enterprise-grade digital signage markets.

Why Is End-Use Diversification Influencing SoC Design and Demand?
While home entertainment remains the primary application segment for digital TV SoCs, the landscape is broadening. Increasing adoption of smart TVs in commercial and institutional environments—such as retail signage, hospitality, education, and healthcare—is creating a diverse set of performance requirements. For instance, hospitality-grade TVs require SoCs capable of handling multiple user profiles, casting, and remote device management. Similarly, digital signage applications demand high refresh rates, constant uptime, and robust support for networked content distribution. This diversification is influencing SoC design toward modularity and scalability, allowing manufacturers to customize chip capabilities according to specific end-use demands.

Furthermore, consumer expectations are shifting toward seamless multi-device ecosystems. As a result, SoCs must now support integration with voice assistants like Alexa and Google Assistant, as well as interoperability with smart home platforms using Matter and Zigbee protocols. Chipmakers are increasingly embedding these interfaces to future-proof devices and enable deeper ecosystem integration. Also noteworthy is the emergence of cloud-native TV platforms, where content rendering and personalization algorithms are partially offloaded to the cloud. SoC designs are now required to accommodate such hybrid processing approaches through better I/O bandwidth and edge-to-cloud synchronization features, opening up new revenue avenues in software-defined TV infrastructure.

What Is Fueling the Rapid Expansion of the Digital TV SoC Market?
The growth in the digital TV SoC market is driven by several factors rooted in evolving technology paradigms and shifting end-use patterns. A key growth driver is the global migration to next-generation broadcast standards, such as DVB-T2 and ATSC 3.0, which necessitate the adoption of advanced SoCs with enhanced signal processing and compression capabilities. Concurrently, rising consumer demand for ultra-high-definition (UHD) viewing and immersive audio formats is spurring innovation in SoC design to support 4K/8K resolution, Dolby Vision, HDR10+, and multi-channel audio decoding.

Additionally, the booming OTT and IPTV sector is exerting significant pressure on manufacturers to deliver SoCs that support simultaneous multi-stream decoding, advanced codec compatibility (HEVC, AV1, VVC), and low-latency network protocols. In the commercial segment, the growing deployment of connected displays in public and enterprise spaces is generating demand for SoCs that offer high reliability, 24/7 operability, and remote content control. On the supply side, the availability of foundry services offering advanced process nodes (such as TSMC’s 7nm and 5nm platforms) is accelerating time-to-market for high-performance SoCs. Finally, regional policy initiatives promoting digital television switchover—particularly in Southeast Asia, Eastern Europe, and Africa—are fueling demand for cost-effective SoCs, ensuring that both premium and value-tier segments of the market continue to expand.

SCOPE OF STUDY:

The report analyzes the Digital TV SoC market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:
Application (LCD, LED, OLED, QLED); End-User (Residential, Commercial)

Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

• Amlogic Inc.
• Apple Inc.
• Broadcom Inc.
• HiSilicon Technologies Co., Ltd.
• Intel Corporation
• LG Electronics Inc.
• Marvell Technology Group Ltd.
• MediaTek Inc.
• MStar Semiconductor Inc.
• Novatek Microelectronics Corp.
• NXP Semiconductors N.V.
• Panasonic Corporation
• Qualcomm Technologies Inc.
• Realtek Semiconductor Corp.
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• Sharp Corporation
• Sigma Designs, Inc.
• STMicroelectronics N.V.
• Toshiba Corporation

TARIFF IMPACT FACTOR

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