3D Chips (3D IC)

3D Chips (3D IC)

Global 3D Chips (3D IC) Market to Reach US$45.2 Billion by 2030

The global market for 3D Chips (3D IC) estimated at US$14.2 Billion in the year 2023, is expected to reach US$45.2 Billion by 2030, growing at a CAGR of 18.1% over the analysis period 2023-2030. 3D Memory, one of the segments analyzed in the report, is expected to record a 19.2% CAGR and reach US$22.2 Billion by the end of the analysis period. Growth in the LEDs segment is estimated at 18.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$3.8 Billion While China is Forecast to Grow at 16.7% CAGR

The 3D Chips (3D IC) market in the U.S. is estimated at US$3.8 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$6.7 Billion by the year 2030 trailing a CAGR of 16.7% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 16.5% and 15.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 12.7% CAGR.

3D Chips (3D IC) - Key Trends and Drivers

3D chips, also known as 3D integrated circuits (3D ICs), represent a transformative advancement in semiconductor technology, addressing the limitations of traditional 2D ICs. These chips are created by stacking multiple layers of silicon wafers or dies and connecting them vertically using through-silicon vias (TSVs). This architectural design significantly enhances chip performance by increasing density and reducing power consumption. The vertical stacking shortens the interconnect lengths between layers, which improves signal transmission speed and reduces latency. This allows for integrating various types of circuits, such as logic, memory, and analog, within a single package, enhancing functionality and performance in a compact form factor. The impact of 3D ICs is profound across various applications, including high-performance computing, mobile devices, data centers, and Internet of Things (IoT) devices, offering a path to overcoming the physical and economic barriers of traditional semiconductor scaling.

One of the most prominent trends in the 3D IC market is the escalating demand for high-performance and energy-efficient computing solutions. As data centers and cloud computing services expand rapidly, there is a pressing need for processors capable of handling vast amounts of data with minimal energy consumption. 3D ICs are particularly well-suited for these demands due to their superior performance and energy efficiency. Additionally, the surge in artificial intelligence (AI) and machine learning (ML) applications necessitates chips that can execute complex computations swiftly. The compactness and enhanced performance of 3D ICs make them ideal for these applications. Moreover, the ongoing trend of miniaturization in consumer electronics, such as smartphones and wearable devices, is propelling the adoption of 3D ICs. These chips enable more functionality within smaller packages, addressing consumer demand for more powerful yet compact devices. The development of heterogeneous integration, where different types of circuits are combined in a single 3D package, further expands the potential applications of 3D ICs, offering solutions tailored to specific needs across various sectors.

The growth in the 3D IC market is driven by several factors. One major driver is the increasing complexity of electronic devices and the need for higher integration levels. As devices become more sophisticated, there is a greater demand for chips that can integrate more functions within a single package, which 3D ICs can provide. Another key driver is the push for improved energy efficiency and performance in data-intensive applications. The ability of 3D ICs to reduce power consumption while enhancing processing speed makes them attractive for use in data centers and high-performance computing environments. Additionally, advancements in fabrication and manufacturing technologies have reduced the costs associated with 3D IC production, making them more accessible to a broader range of applications. The proliferation of IoT devices and the increasing importance of edge computing also contribute to the market growth, as these applications require compact, efficient, and high-performance chips. Moreover, strategic collaborations and investments in research and development by major semiconductor companies are accelerating the innovation and adoption of 3D IC technologies. The integration of new materials and the development of advanced packaging techniques are also expanding the capabilities and applications of 3D ICs. In summary, the convergence of technological advancements, market demands, and strategic investments is propelling the 3D IC market forward, promising significant advancements in computing performance, energy efficiency, and device functionality.

Select Competitors (Total 26 Featured) -

• Amkor Technology, Inc.
• Applied Materials, Inc.
• ASE Technology Holding, Co., Ltd.
• Micron Technology, Inc.
• NVIDIA Corporation
• Renesas Electronics Corporation
• STATS ChipPAC Pte., Ltd.
• STMicroelectronics NV
• Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
• Toshiba Corporation

Please note: Reports are sold as single-site single-user licenses. Electronic versions require 24-48 hours as each copy is customized to the client with digital controls and custom watermarks. The Publisher uses digital controls protecting against copying and printing is restricted to one full copy to be used at the same location.

The latest version of Adobe Acrobat Reader is required to view the report. Upon ordering an electronic version, the Publisher will provide a link to download the purchased report.

Prior to fulfillment of an order, the client will be required to sign a document detailing the purchase terms for a publication from this publisher.