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The Global Market for Advanced Semiconductor Packaging 2024-2035

Published Mar 01, 2024
Length 330 Pages
SKU # FTMK18610347

Description

The Global Market for Advanced Semiconductor Packaging 2024-2035


The global landscape of semiconductor manufacturing is rapidly evolving, with advanced packaging emerging as a critical component of manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. Advanced packaging allows for the creation of faster, cost-effective systems by integrating various chips, a technique that's increasingly essential given the physical limitations of traditional chip miniaturization. It is reshaping the industry, enabling the integration of diverse chip types and enhancing processing speeds.

The U.S. government recognizes the importance of advanced packaging and has introduced a $3 billion National Advanced Packaging Manufacturing Program aimed at establishing high-volume packaging facilities by the end of the decade. The focus on packaging complements the existing efforts under the CHIPS and Science Act, emphasizing the interconnectedness of chipmaking and packaging.

The Global Market for Advanced Semiconductor Packaging 2024-2035 provides a comprehensive analysis of the global advanced semiconductor packaging technologies market from 2020-2035. It encompasses packaging approaches like wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, analyzing market values in the billions (USD) by type, region, and end-use application.

Trends analyzed include heterogeneous integration, interconnects, thermal solutions, miniaturization, supply chain maturity, simulation/data analytics. Leading companies profiled include TSMC, Samsung, Intel, JCET, Amkor. Applications covered include AI, mobile, automotive, aerospace, IoT, communications (5G/6G), high performance computing, medical, and consumer electronics.

Regional markets explored include North America, Asia Pacific, Europe, China, Japan, and RoW. The report also assesses drivers like ML/AI, data centers, EV/ADAS; challenges like costs, complexity, reliability; emerging approaches like system-in-package, monolithic 3D ICs, advanced substrates, novel materials. Overall an in-depth benchmark analysis of the opportunities within the advancing semiconductor packaging industry.

Report contents include:
Market size and forecasts
Key technology trends
Growth drivers and challenges
Competitive landscape analysis
Future packaging trends outlook
In-depth analysis of wafer level packaging (WLP)
System-in-Package (SiP) and heterogeneous integration
Monolithic 3D ICs overview
Advanced semiconductor packaging applications across key markets: AI, mobile, automotive, aerospace, IoT, communications, HPC, medical, consumer electronics
Regional market breakdown
Assessment of key industry challenges: complexity, costs, supply chain maturity, standards
Company profiles: Strategies and technologies of 128 key players. Companies profiled include 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Corporation, Leader-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Box, SJ Semiconductor Corp., SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Company (TSMC) and Yuehai Integrated (Full list of companies profiled in table of contents).

Table of Contents

330 Pages
  • RESEARCH METHODOLOGY
    • Semiconductor Packaging Technology Overview
    • Semiconductor Supply Chain
    • Advanced Packaging Supply Chain
    • Key Technology Trends in Advanced Packaging
    • Market Growth Drivers
    • Competitive Landscape
    • Market Challenges
    • Future outlook
    • Transistor Device Scaling
    • Wafer Level Packaging
    • Fan-Out Wafer Level Packaging
    • Chiplets
    • Interconnection in Semiconductor Packaging
    • 2.5D and 3D Packaging
    • Introduction
    • Benefits
    • Types of Wafer Level Packaging
    • WLP Manufacturing Processes
    • Wafer Level Packaging Trends
    • Applications of Wafer Level Packaging
    • Wafer Level Packaging Outlook
    • Introduction
    • Approaches for heterogenous integration
    • SiP Manufacturing Approaches
    • SiP Component Integration
    • Heterogeneous Integration Drivers
    • Trends Driving SiP Adoption
    • SiP Applications
    • SiP Industry Landscape
    • Future Outlook on Heterogeneous Integration
    • Overview
    • Benefits
    • Challenges
    • Future outlook
    • Market value chain
    • Packaging trends by market
    • Design requirements
    • Artificial Intelligence (AI)
    • Mobile Devices
    • High Performance Computing (HPC)
    • Automotive Electronics
    • Internet of Things (IoT) Devices
    • 5G & 6G Communications Infrastructure
    • Aerospace and Defense Electronics
    • Medical Electronics
    • Consumer Electronics
    • Additive manufacturing for advanced packaging
    • Silicon photonics
    • Global market (Revenues)
    • Integrated Device Manufacturers
    • Outsourced Semiconductor Assembly and Test (OSAT) Companies
    • Foundries
    • Electronics OEMs
    • Packaging Equipment and Materials Companies
    • Market challenges for advanced semiconductor packaging.
    • AaltoSemi
    • Absolic, Inc.
    • ACCRETECH (Europe) GmbH
    • Adeia, Inc.
    • Advanced Micro Devices, Inc. (AMD)
    • Analog Devices, Inc. (ADI)
    • Amkor Technology
    • Anmuquan Intelligent Technology (AMQ Intelligent)
    • Apple
    • Applied Materials
    • Ardentec Corporation
    • ARM
    • ASE
    • ASMPT Ltd
    • Besi
    • Biren Technology
    • Blue Ocean Smart System
    • Brewer Science
    • Broadcom
    • BroadPak
    • Cambricon Technologies Co.,
    • Capcon Semiconductor
    • CAS Microelectronics Integration
    • CD Micro-Technology
    • CEA-Leti
    • Cerebras
    • China Wafer Level CSP Co
    • Chipbond Technology Corporation
    • Chipletz
    • ChipMOS Technologies, Inc.
    • Corning
    • Dewo Advanced Automation (DAA
    • Disco
    • Dupont
    • Ebara
    • Eliyan
    • EMC Semi-Conductor Technology
    • EPS Technology
    • Entegris
    • EV Group
    • GlobalFoundries
    • Global Unichip
    • Gloway
    • Goldenscope Tech
    • Gona Semiconductor Technology
    • Graphcore
    • Greatek Electronics Inc
    • Hangke Chuangxing (Aero Inno-Star)
    • Hanmi Semiconductor
    • HiSilicon
    • HLMC (Shanghai Huali Microelectronics Corporation)
    • Huatian Huichuang Technology (Xi'an) Co., Ltd.
    • Huawei
    • Ibiden
    • IBM
    • ICLeague Technology Co Ltd
    • IMEC
    • Infineon Technologies AG
    • Integra
    • Inari Amertron Berhad
    • Intel Corporation
    • JCET Group
    • Jiangsu IC Assembly & Test (ICAT)
    • Jingdu Semiconductor
    • Keyang Semiconductor (KYS)
    • King Yuan Electronics Co., Ltd.
    • Kioxia
    • KyLitho
    • Kyocera
    • Lam Research
    • Lapis Technology
    • LB Semicon Co Ltd
    • Leading Interconnect Semiconductor Technology
    • Lidrotec GmbH
    • Lux Semiconductors
    • Malaysian Pacific Industries Berhad
    • Micron Technology, Inc.
    • Mediatek
    • Micross Components
    • Mitsubishi
    • National Center For Advanced Packaging China (NCAP China)
    • NEC
    • Nvidia Corporation
    • Nepes Corporation
    • Onsemi
    • Orient Semiconductor Electronics Ltd.
    • Panasonic
    • Powertech Technology Inc.
    • Pragmatic Semiconductor
    • Qorvo
    • Renesas
    • Rigger Micro Technologies (RMT)
    • Rohm
    • Rong Semiconductor
    • Samsung Electronics
    • Samtec, Inc.
    • Schott AG
    • Sharp
    • Shinko Electric Industries
    • Showa Denko
    • Sigurd Microelectronics Corporation
    • Silicon Box
    • Siliconware Precision Industries (SPIL)
    • SJ Semiconductor
    • SK Hynix
    • Skywater
    • Sony Corporation
    • Starmask
    • STMicroelectronics
    • Suss Microtec
    • SZLQ Intelligence (Suzhou Lieqi Intelligent Equipment)
    • Taiwan Semiconductor Manufacturing Company (TSMC)
    • Techsense International
    • Tezzaron Semiconductor
    • Tongfu Microelectronics Co., Ltd.
    • Texas Instruments
    • Tokyo Seimitsu Co., Ltd.
    • Tong Hsing Electronic Industries, Ltd.
    • Toshiba
    • Tower Semiconductor
    • Unimicron
    • Unisem
    • UTAC Group
    • Walton Advanced Engineering Inc.
    • Winstek Semiconductor Technology Co., Ltd.
    • Xinhe Semiconductor
    • Yibu Semiconductor
    • Yuehai Integrated
  • REFERENCES
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